公开(公告)号：US20120048194A1

公开(公告)日：2012-03-01

申请号：US13217584

申请日：2011-08-25

申请人： Yoshitaka Watanabe ,  Takeji Horie ,  Shoji Ito

发明人： Yoshitaka Watanabe ,  Takeji Horie ,  Shoji Ito

IPC分类号： B05C13/00 ,  B05C11/00

CPC分类号： G03G15/00 ,  B41J29/08 ,  B65H1/26

摘要： A sound insulation member is detachably attached to a bottom of a printer main body to shield a noise in the printer main body. The sound insulation member is detached from the printer main body when an option sheet feeding apparatus is added. When the sound insulation member is not detached from the printer main body in adding the option sheet feeding apparatus, the sound insulation member enters a recess that is provided on an upper surface of the option sheet feeding apparatus.

摘要翻译： 隔音构件可拆卸地附接到打印机主体的底部以屏蔽打印机主体中的噪声。 当添加选购片供给装置时，隔音构件与打印机主体分离。 当在添加选购片供给装置的情况下隔音构件未从打印机主体分离时，隔音构件进入设置在选购片供给装置的上表面上的凹部。

公开(公告)号：US07906570B2

公开(公告)日：2011-03-15

申请号：US11712403

申请日：2007-03-01

申请人： Ken-ichi Ueda ,  Shigeo Otome ,  Shoji Ito ,  Yow-hei Sohgawa ,  Hideo Asano

发明人： Ken-ichi Ueda ,  Shigeo Otome ,  Shoji Ito ,  Yow-hei Sohgawa ,  Hideo Asano

IPC分类号： C08K5/09

CPC分类号： C08K5/0091 ,  C08K5/0008 ,  C08K5/098 ,  C08K5/521 ,  C08L33/062

摘要： Disclosed is a thermoplastic resin composition contains including a methacrylic resin having a ring structure in a main chain thereof and a glass transition temperature of 110° C. or higher, and at least one kind of metal compound selected from metal salts, metal complexes, and metal oxides, wherein a content of the metal compound in the composition is from 10 to 10,000 ppm in terms of metal atom based on a mass of the methacrylic resin, and a process for producing such a thermoplastic resin composition, the process including carrying out, when preparing a methacrylic resin having a ring structure in a main chain thereof and a glass transition temperature of 110° C. or higher, cyclization condensation reaction using a catalyst to form the ring structure; and then adding a deactivator of the catalyst.

摘要翻译： 本发明公开了一种热塑性树脂组合物，其含有主链具有环结构，玻璃化转变温度为110℃以上的甲基丙烯酸系树脂，以及选自金属盐，金属络合物和 金属氧化物，其中，所述组合物中的金属化合物的含量以所述甲基丙烯酸系树脂的质量计为10〜10000ppm，以及所述热塑性树脂组合物的制造方法， 当制备其主链具有环结构并且玻璃化转变温度为110℃或更高的甲基丙烯酸树脂时，使用催化剂进行环化缩合反应以形成环结构; 然后加入催化剂的去活化剂。

公开(公告)号：US07886438B2

公开(公告)日：2011-02-15

申请号：US12463708

申请日：2009-05-11

申请人： Shoji Ito ,  Ryoichi Kishihara ,  Osamu Nakao ,  Hiroki Hashiba ,  Masahiro Okamoto

发明人： Shoji Ito ,  Ryoichi Kishihara ,  Osamu Nakao ,  Hiroki Hashiba ,  Masahiro Okamoto

IPC分类号： H01K3/10

CPC分类号： H01L23/5385 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1627 ,  H01L2924/3511 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/4691 ,  H05K3/4694 ,  H05K2201/09972 ,  Y10T29/49128 ,  Y10T29/4916 ,  Y10T29/49165 ,  H01L2224/0401

摘要： At least one base material having a wiring circuit that has been formed into a predetermined outer shape is bonded to a motherboard. The motherboard wiring board and the base material having a wiring circuit are electrically connected to each other at least one portion through an inner via hole. The outer shape of the base material having a wiring circuit is smaller than the outer shape of the motherboard, with the base material having a wiring circuit having an island shape on the motherboard.

摘要翻译： 具有形成为预定外形的布线电路的至少一种基材被粘合到母板上。 具有布线电路的主板布线板和基材通过内部通孔相互电连接至少一个部分。 具有布线电路的基材的外形小于母板的外形，母基板具有在主板上具有岛状的布线电路。

公开(公告)号：US20100163289A1

公开(公告)日：2010-07-01

申请号：US12645191

申请日：2009-12-22

申请人： Shoji ITO ,  Tomofumi Kitada ,  Tadanori Ominato

发明人： Shoji ITO ,  Tomofumi Kitada ,  Tadanori Ominato

IPC分类号： H05K1/02 ,  B29C65/00 ,  B29C65/48 ,  H05K1/11

CPC分类号： H05K3/4015 ,  B29C65/48 ,  B29C65/4815 ,  B29C65/483 ,  B29C65/5057 ,  B29C66/1122 ,  B29C66/43 ,  B29C66/472 ,  B29C66/474 ,  B29C66/8322 ,  B29K2027/18 ,  B29K2063/00 ,  B29K2077/10 ,  B29K2079/08 ,  B29K2101/12 ,  B29K2105/0079 ,  B29K2305/10 ,  B29K2305/14 ,  B29K2995/0005 ,  B29L2009/003 ,  B29L2031/3425 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83851 ,  H05K3/281 ,  H05K3/305 ,  H05K3/361 ,  H05K2201/0221 ,  H05K2201/10234 ,  H05K2201/10977 ,  H05K2203/041 ,  H05K2203/1189 ,  Y10T156/10

摘要： A printed wiring board including: an insulated substrate; a conductive circuit provided on one side of this insulated substrate; a cover layer covering the insulated substrate and the conductive circuit; and a conductive particle buried in this cover layer, wherein the conductive particle is buried in the cover layer so that the conductive particle contacts the conductive circuit and protrudes from the cover layer; and the conductive particle serves as an electric contact point.

摘要翻译： 一种印刷线路板，包括：绝缘基板; 设置在该绝缘基板一侧的导电电路; 覆盖绝缘基板和导电电路的覆盖层; 以及埋置在该覆盖层中的导电性粒子，其中，导电粒子被掩埋在覆盖层中，使得导电粒子与导电电路接触并从覆盖层突出; 并且导电粒子用作电接触点。

公开(公告)号：US07648337B2

公开(公告)日：2010-01-19

申请号：US10501885

申请日：2003-01-21

申请人： Sou Kuroiwa ,  Kenichi Kajiwara ,  Shoji Ito ,  Kikuichi Mori ,  Aki Ishikawa ,  Tetsutaro Fujiwara

发明人： Sou Kuroiwa ,  Kenichi Kajiwara ,  Shoji Ito ,  Kikuichi Mori ,  Aki Ishikawa ,  Tetsutaro Fujiwara

IPC分类号： F01D25/24

CPC分类号： F04D29/086 ,  F04D1/063 ,  F04D1/066 ,  F04D29/4266

摘要： A multistage pump according to the present invention has a plurality of intermediate casings (2) formed by press-forming a steel plate. The intermediate casing has a cylindrical side portion (21), a stage flat portion (23) with which an axial end face of an adjacent intermediate casing is held in contact, a stage side portion (24) extending axially from the stage flat portion, and a bottom portion (25) extending radially inward from the stage side portion. A relief plate (30) having an outer circumferential end face which is held in contact with an inner surface of a cylindrical side portion of the adjacent intermediate casing is attached to the bottom portion of the intermediate casing. The relief plate, the stage side portion, the stage flat portion, and the inner surface of the cylindrical side portion of the adjacent intermediate casing form a space in which an O-ring (40) is fitted.

摘要翻译： 根据本发明的多级泵具有通过冲压成形钢板形成的多个中间壳体（2）。 中间壳体具有圆柱形侧部（21），相邻中间壳体的轴向端面保持接触的平台部（23），从平台部分轴向延伸的台侧部分（24） 和从舞台侧部分径向向内延伸的底部（25）。 具有与相邻中间壳体的圆筒形侧部的内表面保持接触的外周端面的安全板（30）安装在中间壳体的底部。 凸版，台侧部分，平台部分和相邻中间壳体的圆柱形侧部分的内表面形成安装有O形环（40）的空间。

公开(公告)号：US20080075522A1

公开(公告)日：2008-03-27

申请号：US11525461

申请日：2006-09-22

申请人： Tracy Shoji Ito

发明人： Tracy Shoji Ito

IPC分类号： B43K5/02

CPC分类号： A46B11/0006 ,  A46B2200/1066 ,  B65D83/206

摘要： A method for applying a work material including the steps of intermixing the work material with a flowable carrier substance to form a flowable applying medium consisting of the work material and the carrier substance; and housing the applying medium in a container selectively operable to permit release of the applying medium from the container for receipt on a target spaced therefrom. An apparatus for applying a work material including a container having an internal chamber communicating with the exterior of the container through an aperture, a mechanism mounted on the container for selectively opening and closing the aperture, and an applying medium housed within the chamber of the container having a consistency permitting release through the aperture of the container toward a target spaced therefrom upon operation of the mechanism.

摘要翻译： 一种施加工件的方法，包括以下步骤：将工作材料与可流动的载体物质混合，形成由工作材料和载体物质组成的可流动的施加介质; 以及将所述施加介质容纳在容器中，所述容器可选择性地操作以允许所述施加介质从所述容器中释放以在与其间隔开的目标上接收。 一种用于施加工作材料的装置，包括具有通过孔与容器的外部连通的内部容器的容器，安装在容器上用于选择性地打开和关闭孔的机构以及容纳在容器的室内的施加介质 具有一致性，允许在机构操作时通过容器的孔径朝与其间隔开的目标释放。

公开(公告)号：US20060249833A1

公开(公告)日：2006-11-09

申请号：US11396603

申请日：2006-04-04

申请人： Toshihiko Ohara ,  Yoshiharu Unami ,  Yuji Inatani ,  Shoji Ito

发明人： Toshihiko Ohara ,  Yoshiharu Unami ,  Yuji Inatani ,  Shoji Ito

IPC分类号： H01L23/04 ,  H01L21/4763

CPC分类号： H05K3/4617 ,  H05K3/386 ,  H05K3/4046 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/0969 ,  H05K2201/10234 ,  H05K2203/0733 ,  H05K2203/1461 ,  Y10T29/49117 ,  Y10T29/49155

摘要： A method for manufacturing a wiring board comprising an insulating member, comprising: a penetrating hole formation process of forming a penetrating hole in the insulating member; a placement process of inserting a conductive connecting particle into the penetrating hole; a connecting particle pressing process of disposing the conductive layers on both surfaces of the insulating member, pressing the conductive layers toward the connecting particle in the penetrating hole, and deforming the connecting particle in the pressing direction to obtain the connecting member; and a patterning process of patterning the conductive layers, wherein, in the connecting particle pressing process, the pressing is performed such that the cross-sectional area in the direction along the insulating member surface of at least a portion of the connecting member is greater than the contact area of the connecting member with the conductive layers.

摘要翻译： 一种用于制造包括绝缘构件的布线板的方法，包括：在所述绝缘构件中形成贯通孔的贯通孔形成工序; 将导电性连接粒子插入贯通孔的配置工序; 将导电层配置在绝缘部件的两面上的连接粒子挤压工序，将导电层朝向穿透孔内的连接粒子按压，使连接粒子沿按压方向变形，得到连接部件; 以及图案化导电层的图案化工艺，其中在连接粒子压制过程中，进行按压使得沿着连接构件的至少一部分的绝缘构件表面的方向上的横截面积大于 连接构件与导电层的接触面积。

公开(公告)号：USD522998S1

公开(公告)日：2006-06-13

申请号：US29233545

申请日：2005-07-05

申请人： Shoji Ito ,  Hirohiko Yukimoto ,  Herbert Pfeifer

设计人： Shoji Ito ,  Hirohiko Yukimoto ,  Herbert Pfeifer

公开(公告)号：US06654515B2

公开(公告)日：2003-11-25

申请号：US10244730

申请日：2002-09-16

申请人： Makoto Kato ,  Shoji Ito ,  Akihiro Tanaka ,  Kenichi Higashiura ,  Naoki Kamiya

发明人： Makoto Kato ,  Shoji Ito ,  Akihiro Tanaka ,  Kenichi Higashiura ,  Naoki Kamiya

IPC分类号： G02B628

CPC分类号： G02B6/43 ,  G02B6/2817 ,  G02B6/4214 ,  G02B6/4246 ,  G02B6/4249 ,  G02B6/426 ,  G02B6/428 ,  G02B6/4284

摘要： A photoelectric back plane board is provided to facilitate the relative positioning of an optical data bus and light emitting/receiving devices, interconnection of a circuit board for optical communication and respective elements, and supplying power and inputting/outputting signals to/from the printed circuit board. In the photoelectric back plane board, the optical data bus is inserted into a recess within an optical data bus fixing board and a connector holding light emitting/receiving devices is positioningly fixed to the fixing board via through holes H formed in the fixing board so that relative positioning of the signal light incoming/outgoing areas and the light emitting/receiving devices can be easily achieved. By mounting the fixing board on a printed circuit board on which an electrical connector is provided, interconnection of a circuit board mounted on the optical connector and the printed circuit board is achieved by means of the electrical connector.

摘要翻译： 提供光电背板以便于光数据总线和发光/接收装置的相对定位，用于光通信的电路板的互连和各个元件，以及向/从印刷电路提供电力和输入/输出信号 板。 在光电背板中，将光数据总线插入到光数据总线固定板内的凹部中，并且保持发光/接收装置的连接器通过形成在定影板上的通孔H定位固定到固定板，使得 可以容易地实现信号光入射/出射区域和发光/接收装置的相对定位。 通过将固定板安装在设置有电连接器的印刷电路板上，通过电连接器实现安装在光连接器上的电路板和印刷电路板的互连。

公开(公告)号：US06506872B2

公开(公告)日：2003-01-14

申请号：US09843320

申请日：2001-04-25

申请人： Kunio Kimura ,  Yuhiko Yamashita ,  Yasunori Okumura ,  Shoji Ito

发明人： Kunio Kimura ,  Yuhiko Yamashita ,  Yasunori Okumura ,  Shoji Ito

IPC分类号： C08G6540

CPC分类号： C08G65/4006 ,  C08G2650/48

摘要： A novel polycyanoaryl ether exhibiting excellent heat-resistance, hydrolysis-resistance and weatherability, as well as industrially high general-purpose properties, and the method for the production thereof is to be provided. The polycyanoaryl ether of this invention is represented by the formula (1): wherein R1 stands for a substituted or unsubstituted alkyl group of 1 to 12 carbon atoms, a substituted or unsubstituted alkoxy group of 1 to 12 carbon atoms, a substituted or unsubstituted alkylamino group of 1 to 12 carbon atoms, a substituted or unsubstituted alkylthio group of 1 to 12 carbon atoms, a substituted or unsubstituted aryl group of 6 to 20 carbon atoms, a substituted or unsubstituted aryloxy group of 6 to 20 carbon atoms, a substituted or unsubstituted arylamino group of 6 to 20 carbon atoms, or a substituted or unsubstituted arylthio group of 6 to 20 carbon atoms; R2 stands for a divalent organic group; and n stands for a degree of polymerization.

摘要翻译： 提供具有优异的耐热性，耐水解性和耐气候性以及工业上高通用性的新型聚氰基芳基醚及其制造方法。 本发明的聚氰基芳基醚由式（1）表示：其中R1代表取代或未取代的1至12个碳原子的烷基，取代或未取代的碳原子数为1至12的烷氧基，取代或未取代的烷基氨基 1〜12个碳原子的取代或未取代的碳原子数为1〜12的烷硫基，取代或未取代的碳原子数为6〜20的芳基，取代或未取代的碳原子数为6〜20的芳氧基， 6〜20个碳原子的未取代芳基氨基，或6〜20个碳原子的取代或未取代芳硫基; R2代表二价有机基团; n表示聚合度。