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32 条记录 (耗时 0.016 秒)

    Charged particle system for reticle/wafer defects inspection and review
    21.
    发明授权
    Charged particle system for reticle/wafer defects inspection and review 有权
    带电粒子系统用于掩模/晶圆缺陷检查和检查

    公开(公告)号：US08519333B2

    公开(公告)日：2013-08-27

    申请号：US13463208

    申请日：2012-05-03

    申请人： Chiyan Kuan ,  Yi-Xiang Wang ,  Chung-Shih Pan ,  Zhonghua Dong ,  Zhongwei Chen

    发明人： Chiyan Kuan ,  Yi-Xiang Wang ,  Chung-Shih Pan ,  Zhonghua Dong ,  Zhongwei Chen

    IPC分类号： H01J37/20 ,  H01J37/26 ,  G01N23/225 ,  G01N23/22

    CPC分类号： G01N23/2251 ,  G01N2223/307 ,  G01N2223/611

    摘要： The present invention relates to a charged particle system for reticle or semiconductor wafer defects inspection and review, and more particularly, relates to an E-beam inspection tool for reticle or semiconductor wafer defects inspection and review without gravitational AMC settling. The charged particle system is an upside down electron beam inspection system with an electron beam aimed upward. The face down design may prevent AMC from gravitational settling on the inspected face of the specimen during inspection, thereafter having a cleaner result compared with conventional face-up inspection system.

    摘要翻译： 本发明涉及一种用于掩模版或半导体晶片缺陷检查和审查的带电粒子系统，更具体地涉及一种用于掩模版或半导体晶片缺陷检查和检查的电子束检查工具，而不引力AMC沉降。 带电粒子系统是一个向上的电子束检查系统。 面朝下设计可以防止AMC在检查期间在试样的被检查面上引力沉降，之后与常规的面朝上检查系统相比具有更清洁的结果。

    Particle detection system
    22.
    发明授权
    Particle detection system 有权
    粒子检测系统

    公开(公告)号：US08237125B2

    公开(公告)日：2012-08-07

    申请号：US12764890

    申请日：2010-04-21

    申请人： Yi-Xiang Wang ,  Joe Wang

    发明人： Yi-Xiang Wang ,  Joe Wang

    IPC分类号： G01T1/28

    CPC分类号： H01J37/244 ,  H01J2237/2441 ,  H01J2237/2444 ,  H01J2237/2445 ,  H01J2237/2448 ,  H01J2237/2449

    摘要： This invention provides a design to process a large range of detection beam current at low noise with a single detector. With such a design, the detection system can generate up to 1010 gain and maximum signal output at more than mini Ampere (mA) level.

    摘要翻译： 本发明提供了利用单个检测器处理低噪声的大范围检测光束电流的设计。 通过这样的设计，检测系统可以以超过小于安培（mA）的电平产生多达1010个增益和最大信号输出。

    Movable Detector for Charged Particle Beam Inspection or Review
    23.
    发明申请
    Movable Detector for Charged Particle Beam Inspection or Review 有权
    用于带电粒子束检测或检查的可移动检测器

    公开(公告)号：US20110291007A1

    公开(公告)日：2011-12-01

    申请号：US12787139

    申请日：2010-05-25

    申请人： YI-XIANG WANG ,  JOE WANG ,  XUEDONG LIU ,  ZHONGWEI CHEN

    发明人： YI-XIANG WANG ,  JOE WANG ,  XUEDONG LIU ,  ZHONGWEI CHEN

    IPC分类号： G01N23/22 ,  H01J37/244

    CPC分类号： H01J37/244 ,  H01J37/28 ,  H01J2237/024 ,  H01J2237/24465 ,  H01J2237/24475 ,  H01J2237/2448 ,  H01J2237/24495 ,  H01J2237/2611 ,  H01J2237/2817

    摘要： The present invention generally relates to a detection unit of a charged particle imaging system. More particularly, portion of the detection unit can move into or out of the detection system as imaging condition required. With the assistance of a Wein filter (also known as an E×B charged particle analyzer) and a movable detector design, the present invention provides a stereo imaging system that suitable for both low current, high resolution mode and high current, high throughput mode. Merely by way of example, the invention has been applied to a scanning electron beam inspection system. But it would be recognized that the invention could apply to other system using charged particle beam as an observation tool.

    摘要翻译： 本发明一般涉及带电粒子成像系统的检测单元。 更具体地，检测单元的一部分可以作为所需的成像条件移入或移出检测系统。 在Wein滤波器（也称为E×B带电粒子分析仪）和可移动检测器设计的帮助下，本发明提供了一种适用于低电流，高分辨率模式和高电流，高通量模式的立体成像系统 。 仅作为示例，本发明已经应用于扫描电子束检查系统。 但是应当认识到，本发明可以应用于使用带电粒子束作为观测工具的其它系统。

    Wafer grounding and biasing method, apparatus, and application
    24.
    发明授权
    Wafer grounding and biasing method, apparatus, and application 有权
    晶圆接地和偏置方法，装置和应用

    公开(公告)号：US08908348B2

    公开(公告)日：2014-12-09

    申请号：US12552270

    申请日：2009-09-01

    申请人： Yi-Xiang Wang ,  Juying Dou ,  Kenichi Kanai

    发明人： Yi-Xiang Wang ,  Juying Dou ,  Kenichi Kanai

    IPC分类号： H01L21/683 ,  H01J37/317 ,  H01J37/20 ,  H01J37/28 ,  B82Y10/00 ,  B82Y40/00

    CPC分类号： H01J37/20 ,  B82Y10/00 ,  B82Y40/00 ,  H01J37/28 ,  H01J37/3174 ,  H01J2237/0044 ,  H01J2237/2008

    摘要： A wafer grounding apparatus and method adaptable to a charged particle beam apparatus is disclosed. A wafer substrate is supported by a wafer mount. A grounding pin is arranged to be in contact with a backside film formed on a backside of the wafer substrate. A grounding pulse generator provides at least one pulse to drive the grounding pin such that dielectric breakdown occurring at the backside film leads to establishment of a current path through the backside films. Accordingly, a current flows in the wafer substrate through this current path and then flows out of the wafer substrate via at least one current return path formed from capacitive coupling between the wafer substrate and the wafer mount.

    摘要翻译： 公开了适用于带电粒子束装置的晶片接地装置和方法。 晶片基板由晶片支架支撑。 接地销布置成与形成在晶片衬底的背面上的背面膜接触。 接地脉冲发生器提供至少一个脉冲来驱动接地引脚，使得在背面薄膜处发生的电介质击穿导致建立通过背面薄膜的电流路径。 因此，电流通过该电流路径流过晶片衬底，然后通过由晶片衬底和晶片座之间的电容耦合形成的至少一个电流返回路径流出晶片衬底。

    Method and system for heating substrate in vacuum environment and method and system for identifying defects on substrate
    25.
    发明授权
    Method and system for heating substrate in vacuum environment and method and system for identifying defects on substrate 有权
    在真空环境中加热基材的方法和系统以及用于识别基材上的缺陷的方法和系统

    公开(公告)号：US08809779B2

    公开(公告)日：2014-08-19

    申请号：US12339558

    申请日：2008-12-19

    申请人： Hong Xiao ,  Yi-Xiang Wang

    发明人： Hong Xiao ,  Yi-Xiang Wang

    IPC分类号： G01N23/00 ,  G01N23/22 ,  H05B3/00

    CPC分类号： H05B3/0047 ,  G01N23/2202

    摘要： A method for heating a substrate in a vacuum environment and a system therefor is provided. The system includes a chamber capable of holding the substrate located in the vacuum environment and a light source capable of projecting a light beam only on a portion of the substrate. The method includes the following steps. First, the substrate is placed in the vacuumed chamber. Thereafter, the light beam emitted from the light source is projected on the portion of the substrate, such that the portion is significantly heated before whole the substrate is heated. When the light beam is a charged particle beam projected by a charged particle beam assembly and projected on defects located on the substrate, the defects are capable of being identified by an examination result provided by an examination assembly after termination of light beam projection.

    摘要翻译： 提供一种在真空环境中加热基板的方法及其系统。 该系统包括能够保持位于真空环境中的衬底的腔室和能够仅将光束投射到衬底的一部分上的光源。 该方法包括以下步骤。 首先，将基板放置在真空室中。 此后，从光源发射的光束被投射在基板的部分上，使得该部分在整个基板被加热之前被显着地加热。 当光束是由带电粒子束组件投射并投影在基板上的缺陷上的带电粒子束时，能够通过在光束投影终止之后由检查组件提供的检查结果来识别缺陷。

    E-beam defect review system
    28.
    发明授权
    E-beam defect review system 有权
    电子束缺陷检查系统

    公开(公告)号：US08094924B2

    公开(公告)日：2012-01-10

    申请号：US12335458

    申请日：2008-12-15

    申请人： Jack Jau ,  Zhongwei Chen ,  Yi Xiang Wang ,  Chung-Shih Pan ,  Joe Wang ,  Xuedong Liu ,  Weiming Ren ,  Wei Fang

    发明人： Jack Jau ,  Zhongwei Chen ,  Yi Xiang Wang ,  Chung-Shih Pan ,  Joe Wang ,  Xuedong Liu ,  Weiming Ren ,  Wei Fang

    IPC分类号： G06K9/00

    CPC分类号： G06T7/001 ,  G01N23/04 ,  G01N2223/102 ,  G01N2223/426 ,  G01N2223/611 ,  G06T2207/10061 ,  G06T2207/30148

    摘要： An apparatus comprises an imaging unit to image a wafer to be reviewed, wherein imaging unit is the modified SORIL column. The modified SORIL column includes a focusing sub-system to do micro-focusing due to a wafer surface topology, wherein the focusing sub-system verifies the position of a grating image reflecting from the wafer surface to adjust the focus; and a surface charge control to regulate the charge accumulation due to electron irradiation during the review process, wherein the gaseous molecules are injected under a flood gun beam rather than under a primary beam. The modified SORIL column further includes a storage unit for storing wafer design database; and a host computer to manage defect locating, defect sampling, and defect classifying, wherein the host computer and storage unit are linked by high speed network.

    摘要翻译： 一种装置包括成像单元以对待审查的晶片进行成像，其中成像单元是经修改的SORIL柱。 改进的SORIL柱包括由于晶片表面拓扑而进行微聚焦的聚焦子系统，其中聚焦子系统验证从晶片表面反射的光栅图像的位置以调整焦点; 以及表面电荷控制，用于调节在复查过程期间由于电子辐射引起的电荷累积，其中气体分子在洪水枪光束下而不是在主光束下方注入。 改进的SORIL列还包括用于存储晶片设计数据库的存储单元; 以及用于管理缺陷定位，缺陷采样和缺陷分类的主计算机，其中主计算机和存储单元通过高速网络链接。

    OPERATION STAGE FOR WAFER EDGE INSPECTION AND REVIEW
    29.
    发明申请
    OPERATION STAGE FOR WAFER EDGE INSPECTION AND REVIEW 失效
    水边检查和审查的操作阶段

    公开(公告)号：US20100140498A1

    公开(公告)日：2010-06-10

    申请号：US12331336

    申请日：2008-12-09

    申请人： JACK JAU ,  HONG XIAO ,  JOE WANG ,  ZHONGWEI CHEN ,  YI XIANG WANG ,  EDWARD TSENG

    发明人： JACK JAU ,  HONG XIAO ,  JOE WANG ,  ZHONGWEI CHEN ,  YI XIANG WANG ,  EDWARD TSENG

    IPC分类号： G21K5/10

    CPC分类号： H01J37/28 ,  H01J37/20 ,  H01J2237/202 ,  H01J2237/2817 ,  H01L21/67288 ,  H01L21/6831

    摘要： The present invention relates to an operation stage of a charged particle beam apparatus which is employed in a scanning electron microscope for substrate (wafer) edge and backside defect inspection or defect review. However, it would be recognized that the invention has a much broader range of applicability. A system and method in accordance with the present invention provides an operation stage for substrate edge inspection or review. The inspection region includes top near edge, to bevel, apex, and bottom bevel. The operation stage includes a supporting stand, a z-stage, an X-Y stage, an electrostatic chuck, a pendulum stage and a rotation track. The pendulum stage mount with the electrostatic chuck has the ability to swing from 0° to 180° while performing substrate top bevel, apex and bottom bevel inspection or review. In order to keep the substrate in focus and avoid a large position shift during altering the substrate observation angle by rotation the pendulum stage, one embodiment of the present invention discloses a method such that the rotation axis of the pendulum stage consist of the tangent of upper edge of the substrate to be inspected. The electrostatic chuck of the present invention has a diameter smaller than which of the substrate to be inspected. During the inspection process the substrate on the electrostatic chuck may be rotated about the central axis on the electrostatic chuck to a desired position, this design insures all position on the bevel and apex are able to be inspected.

    摘要翻译： 本发明涉及用于基板（晶片）边缘和背面缺陷检查或缺陷检查的扫描电子显微镜中的带电粒子束装置的操作阶段。 然而，应当认识到，本发明具有更广泛的应用范围。 根据本发明的系统和方法提供了用于衬底边缘检查或审查的操作阶段。 检查区域包括顶部近边缘，斜面，顶点和底部斜面。 操作台包括支撑台，z台，X-Y台，静电卡盘，摆台和旋转轨道。 具有静电卡盘的摆台安装具有从0°摆动到180°的能力，同时执行基板顶部斜面，顶部和底部斜面检查或检查。 为了将基板保持在对焦状态，并且通过旋转摆锤台来改变基板观察角度而避免大的位置偏移，本发明的一个实施例公开了一种方法，使得摆台的旋转轴线由上部的切线 要检查的基板的边缘。 本发明的静电卡盘的直径小于要检查的基板的直径。 在检查过程中，静电卡盘上的基板可以围绕静电卡盘上的中心轴线旋转到期望的位置，该设计确保能够检查斜面上的所有位置和顶点。