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公开(公告)号：US20150359097A1
公开(公告)日：2015-12-10
申请号：US14827668
申请日：2015-08-17
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： KUO-FU SU , GWUN-JIN LIN
CPC classification number: H05K1/115 , H05K1/028 , H05K1/0298 , H05K3/002 , H05K3/426 , Y10T29/49165
Abstract: A structure of via hole of electrical circuit board includes an adhesive layer and a conductor layer that are formed after wiring is formed on a carrier board. At least one through hole extends in a vertical direction through the carrier board, the wiring, the adhesive layer, and the conductor layer and forms a hole wall surface. The conductor layer shows a height difference with respect to an exposed zone of the circuit trace in the vertical direction. A conductive cover section covers the conductor layer and the hole wall surface of the through hole. The carrier board is a single-sided board, a double-sided board, a multi-layered board, or a combination thereof, and the single-sided board, the double-sided board, and multi-layered board can be flexible boards, rigid boards, or composite boards combining flexible and rigid boards.
Abstract translation: 电路板的通孔的结构包括在载体板上形成布线之后形成的粘合剂层和导体层。 至少一个通孔在垂直方向上穿过载板，布线，粘合剂层和导体层延伸并形成孔壁表面。 导体层相对于垂直方向上的电路迹线的暴露区域显示高度差。 导电覆盖部分覆盖导体层和通孔的孔壁表面。 载板是单面板，双面板，多层板或其组合，单面板，双面板和多层板可以是柔性板， 刚性板，或组合柔性和刚性板的复合板。
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公开(公告)号：US20150250049A1
公开(公告)日：2015-09-03
申请号：US14621945
申请日：2015-02-13
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： KUO-FU SU , GWUN-JIN LIN
CPC classification number: H01R12/62 , H05K1/028 , H05K1/0283 , H05K1/148 , H05K3/285 , H05K2201/0129 , H05K2201/0162 , H05K2201/051 , H05K2201/056
Abstract: A flexible circuit board includes a first connection section and a second connection section between which a stretchable extension section is connected and has at least a portion that is shapeable by a shapeable material layer to form a spiral section. The spiral section is stretchable in the extension direction. The spiral section provides the flexible circuit board with characteristics of better flexibility, stretchability, capability of eliminating stresses induced in multiple directions.
Abstract translation: 柔性电路板包括第一连接部分和第二连接部分，在该第一连接部分和第二连接部分之间连接有可拉伸的延伸部分，并且具有至少一部分可由可塑材料层形成以形成螺旋部分的部分。 螺旋部分在延伸方向上是可拉伸的。 螺旋部分为柔性电路板提供了更好的弹性，拉伸性，消除多个方向应力的能力。
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公开(公告)号：US20150179302A1
公开(公告)日：2015-06-25
申请号：US14506826
申请日：2014-10-06
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： GWUN-JIN LIN , KUO-FU SU
Abstract: A water resistant structure for a flexible circuit cable is disclosed. The flexible circuit cable has a first surface, a second surface, a first end, a second end, and an extension section connecting between the first end and the second end. The extension section of the flexible circuit cable extends in an extension direction and defines a water resistant section. The water resistant section has a predetermined water resistant section length. The water resistant section of the flexible circuit cable includes at least one pad member and a water resistant material formed thereon. The water resistant material and the pad member provide the flexible circuit cable with an effect of water resistance.
Abstract translation: 公开了一种用于柔性电路电缆的防水结构。 柔性电路电缆具有连接在第一端和第二端之间的第一表面，第二表面，第一端，第二端和延伸段。 柔性电路电缆的延伸部分沿延伸方向延伸并限定了防水部分。 防水部分具有预定的防水部分长度。 柔性电路电缆的防水部分包括形成在其上的至少一个衬垫构件和防水材料。 防水材料和衬垫构件提供具有防水效果的柔性电路电缆。
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24.发明申请公开(公告)号：US20140375394A1
公开(公告)日：2014-12-25
申请号：US14108838
申请日：2013-12-17
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： GWUN-JIN LIN , KUO-FU SU , CHIH-HENG CHUO
IPC: H01P3/08
CPC classification number: H01P1/22 , H01P1/227 , H01P3/026 , H03H7/38 , H05K1/00 , H05K1/0242 , H05K1/025 , H05K1/0393 , H05K2201/0969 , H05K2201/09827
Abstract: An attenuation reduction control structure for high-frequency signal transmission lines of a flexible circuit board includes an impedance control layer formed on a surface of a substrate. The impedance control layer includes an attenuation reduction pattern that is arranged in an extension direction of the high-frequency signal transmission lines of the substrate and corresponds to bottom angle structures of the high-frequency signal transmission lines in order to improve attenuation of a high-frequency signal transmitted through the high-frequency signal transmission lines. An opposite surface of the substrate includes a conductive shielding layer formed thereon. The conductive shielding layer is formed with an attenuation reduction pattern corresponding to top angle structures of the high-frequency signal transmission lines.
Abstract translation: 柔性电路板的高频信号传输线的衰减减小控制结构包括形成在基板的表面上的阻抗控制层。 阻抗控制层包括沿着衬底的高频信号传输线的延伸方向布置的衰减减小图案，并且对应于高频信号传输线的底角结构，以便改善高频信号传输线的衰减， 频率信号通过高频信号传输线路传输。 基板的相对表面包括形成在其上的导电屏蔽层。 导电屏蔽层形成有对应于高频信号传输线的顶角结构的衰减减小图案。
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25.发明申请公开(公告)号：US20140285280A1
公开(公告)日：2014-09-25
申请号：US13895444
申请日：2013-05-16
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： CHIH-HENG CHUO , GWUN-JIN LIN , KUO-FU SU
IPC: H01P3/02
CPC classification number: H05K1/0224 , H01P3/02 , H01P3/026 , H05K1/0219 , H05K1/0245 , H05K1/0253 , H05K1/117 , H05K2201/058
Abstract: Disclosed is a grounding pattern structure for high-frequency connection pads of a circuit board. A substrate of the circuit board includes a component surface on which at least a pair of high-frequency connection pads. At least a pair of differential mode signal lines are formed on the substrate and connected to the high-frequency connection pads. The grounding surface of the substrate includes a grounding layer formed at a location corresponding to the differential mode signal lines. The grounding surface of the substrate includes a grounding pattern structure formed thereon to correspond to a location adjacent to the high-frequency connection pads. The grounding pattern structure is electrically connected to the grounding layer. The component surface of the substrate can be provided with a connector mounted thereto with signal terminals of the connector soldered to the high-frequency connection pads.
Abstract translation: 公开了一种用于电路板的高频连接焊盘的接地图案结构。 电路板的基板包括一个部件表面，在该部件表面上至少有一对高频连接焊盘。 至少一对差模信号线形成在基板上并连接到高频连接焊盘。 衬底的接地表面包括形成在对应于差动模式信号线的位置处的接地层。 衬底的接地表面包括形成在其上的接地图案结构，以对应于与高频连接焊盘相邻的位置。 接地图结构与接地层电连接。 基板的部件表面可以设置有安装在其上的连接器，其中连接器的信号端子焊接到高频连接焊盘。
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Patent Agency Ranking
公开(公告)号：US20140097021A1
公开(公告)日：2014-04-10
申请号：US14039112
申请日：2013-09-27
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： KUO-FU SU
IPC: H05K9/00
CPC classification number: H05K9/00 , H05K1/0253 , H05K1/028 , H05K1/148 , H05K9/0066 , H05K2201/053 , H05K2201/09063 , H05K2201/2027
Abstract: Disclosed is a bundle division structure for a flexible circuit cable. The flexible circuit cable includes a plurality of conductor units that extends in an extension direction and is collected together to form a clustered structure. The clustered structure defines at least one bundle division section. The bundle division structure includes a bundle division unit, at least a pair of conductor unit receiving slots. The conductor units of the bundle division section are divided into groups that are respectively received in the conductor unit receiving slot. The bundle division unit is coupled to a protection member for protection and positioning purposes.
Abstract translation: 公开了一种用于柔性电路电缆的束分割结构。 柔性电路电缆包括沿延伸方向延伸并且被收集在一起以形成聚集结构的多个导体单元。 聚类结构定义至少一个束分割部分。 捆束分割结构包括捆束分割单元，至少一对导体单元接收槽。 捆束分割部分的导体单元被分成分别接收在导体单元接收槽中的组。 束分割单元耦合到保护构件以用于保护和定位目的。
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公开(公告)号：US20130277095A1
公开(公告)日：2013-10-24
申请号：US13920386
申请日：2013-06-18
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： GWUN-JIN LIN , CHIH-HENG CHUO , KUO-FU SU
IPC: H05K1/02
CPC classification number: H05K1/0277 , H05K1/028 , H05K1/118 , H05K2201/0394 , H05K2201/052 , H05K2201/09063 , H05K2201/0949 , H05K2201/10598 , H05K2203/0228 , H05K2203/1572
Abstract: Disclosed is a double-side-conducting flexible-circuit flat cable with cluster section, which includes a flexible circuit substrate, a first electrical conduction path, a second electrical conduction path, a plurality of first and second conductive contact zones. The flexible circuit substrate has a first surface and a second surface and includes, in an extension direction, a first connection section, a cluster section, and at least one second connection section. The cluster section is composed of a plurality of clustered flat cable components formed by slitting in the extension direction. The first and second electrical conduction paths are respectively formed on the first and second surfaces of the flexible circuit substrate and each extends along one of the clustered flat cable components of the cluster section. The plurality of first and second conductive contact zones are respectively arranged on the first and second surfaces of the flexible circuit substrate at the first connection section. Each of the first and second conductive contact zones extends along one of the electrical conduction paths of the cluster section toward the second connection section.
Abstract translation: 公开了一种具有集束部分的双面导电柔性电路扁平电缆，其包括柔性电路基板，第一导电路径，第二导电通路，多个第一和第二导电接触区域。 柔性电路基板具有第一表面和第二表面，并且在延伸方向上包括第一连接部分，集束部分和至少一个第二连接部分。 集群部分由沿着延伸方向切割形成的多个群集扁平电缆部件组成。 第一和第二导电路径分别形成在柔性电路基板的第一和第二表面上，并且每个沿着集束部分的群集扁平电缆部件之一延伸。 多个第一和第二导电接触区域分别设置在第一连接部分处的柔性电路基板的第一和第二表面上。 第一和第二导电接触区域中的每一个沿着群集部分的导电路径中的一个朝向第二连接部分延伸。
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公开(公告)号：US20250008650A1
公开(公告)日：2025-01-02
申请号：US18731560
申请日：2024-06-03
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： CLINTON LIN , CHIH-HENG CHUO , KUO-FU SU
Abstract: A contact height adjustment structure for a flexible circuit board is provided for making a plurality of conductive zones on a first surface of the flexible circuit board in tight contact engagement with corresponding contact points of a circuit device. The flexible circuit board is provided, on a second surface opposite to the first surface, with a plurality of height adjustment pads that are arranged at intervals and correspond, in a one-to-one manner, to the plurality of conductive zones. The plurality of height adjustment pads provide the plurality of conductive zones with a pushing force toward the corresponding contact points of the circuit device, so as to adjust a contact height of the conductive zones and to achieve an effect of setting the conductive zones in tight contact engagement with the corresponding contact points.
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公开(公告)号：US20240074047A1
公开(公告)日：2024-02-29
申请号：US18321999
申请日：2023-05-23
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： KUO-FU SU , CHIH-HENG CHUO , CLINTON LIN
CPC classification number: H05K1/11 , H05K1/119 , H05K3/0014 , H05K3/4007 , H05K2201/09045 , H05K2203/0723
Abstract: A conductive bump structure of a circuit board includes at least one composite conductive bump formed in at least one bump preservation region on a conductive layer of the circuit board. The composite conductive bump includes a raised portion and a conductive pillar. The raised portion is raised from a top surface of the conductive layer by a height. A bottom of the conductive pillar is in contact with and is combined with a curved top surface of the raised portion, and a top of the conductive pillar is raised upwards to protrude beyond the top planar surface of the conductive layer by a protrusion height.
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公开(公告)号：US20200170109A1
公开(公告)日：2020-05-28
申请号：US16412613
申请日：2019-05-15
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： KUO-FU SU , CHIH-HENG CHUO , GWUN-JIN LIN
Abstract: A circuit board structure that includes a resin-based conductive adhesive layer is disclosed, in which a conductive layer is arranged between a first circuit board and a second circuit board. The conductive layer includes a first conductive paste layer and the resin-based conductive adhesive layer is formed on the first conductive paste layer. The resin-based conductive adhesive layer contains a sticky resin material and a plurality of conductive particles distributed in the sticky resin material. The plurality of conductive particles establish an electrical connection between the first conductive paste layer and the resin-based conductive adhesive layer.
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