BLOCK COPOLYMERIZED POLYIMIDE INK COMPOSITION FOR PRINTING
    22.
    发明申请
    BLOCK COPOLYMERIZED POLYIMIDE INK COMPOSITION FOR PRINTING 审中-公开
    用于印刷的嵌段共聚物聚酰胺油墨组合物

    公开(公告)号:US20090229870A1

    公开(公告)日:2009-09-17

    申请号:US12470399

    申请日:2009-05-21

    IPC分类号: H05K1/00 C09D131/06 B05D5/00

    摘要: The object is to provide a polyimide ink composition having good printing properties and good continuous printing properties, which composition can be dried at a low temperature of not higher than 220° C., and which composition gives a coating film, after being dried, having excellent dimensional stability, heat resistance, low modulus of elasticity, flexibility, resistance to warping, chemical resistance, adhesiveness with substrates, and plating resistance. This object is accomplished by a polyimide ink composition for printing, comprising a mixed solvent containing an benzoic acid ester solvent and a glyme solvent, and a polyimide soluble in the mixed solvent; wherein the polyimide is obtained by polycondensing a polyimide oligomer with a tetracarboxylic dianhydride component(s) and/or a diamine component(s) having no siloxane bond in molecular skeleton thereof, the polyimide oligomer being prepared by polycondensing a tetracarboxylic dianhydride component(s) and a diamine component(s) having siloxane bonds in molecular skeleton thereof in the presence of a base catalyst(s), or a mixed catalyst including a lactone(s) and/or an acidic compound(s) and a base(s); the content of the diamine component(s) having siloxane bonds based on the total diamine components being 15 to 85% by weight.

    摘要翻译: 本发明的目的是提供具有良好的印刷性能和良好的连续印刷性能的聚酰亚胺油墨组合物,该组合物可以在不高于220℃的低温下干燥,并且该组合物在干燥后得到涂膜, 优异的尺寸稳定性,耐热性,低弹性模量,柔软性,抗翘曲性,耐化学性,与基材的粘合性和耐电镀性。 该目的通过用于印刷的聚酰亚胺油墨组合物实现,其包含含有苯甲酸酯溶剂和甘醇二甲醚溶剂的混合溶剂和可溶于混合溶剂的聚酰亚胺; 其中所述聚酰亚胺是通过将聚酰亚胺低聚物与其分子骨架中不含硅氧烷键的四羧酸二酐组分和/或二胺组分缩聚得到的,所述聚酰亚胺低聚物是通过使四羧酸二酐组分缩聚而制备的, 和在其基础催化剂存在下的分子骨架中具有硅氧烷键的二胺组分或包含内酯和/或酸性化合物和碱的混合催化剂, ; 基于总二胺成分的具有硅氧烷键的二胺成分的含量为15〜85重量%。

    Method of preparing 2223 phase (Bi,Pb)-Sr-Ca-Cu-O superconducting films
    24.
    发明授权
    Method of preparing 2223 phase (Bi,Pb)-Sr-Ca-Cu-O superconducting films 失效
    制备2223相(Bi,Pb)-Sr-Ca-Cu-O超导膜的方法

    公开(公告)号:US5330966A

    公开(公告)日:1994-07-19

    申请号:US905994

    申请日:1992-06-26

    IPC分类号: H01L39/24 B05D5/12 C23C16/00

    摘要: An oxide superconducting layer is formed on a base material of silver, whose single side is coated with MgO, or single-crystalline MgO for depositing a Bi.sub.2 Sr.sub.2 Ca.sub.2 Cu.sub.3 phase in a crystallographically oriented state by sputtering, CVD or laser ablation. Metal lead or lead oxide is then laid thereon by sputtering to obtain a two-layer structure, and the two-layer structure is heat treated in the atmospheric air. Thus, a bismuth oxide superconducting film, which is excellent in crystal orientation as well as denseness and thereby having high critical current density, is formed on the base material.

    摘要翻译: 在银的基体材料上形成氧化物超导层,其单面涂覆有MgO,或者通过溅射,CVD或激光烧蚀在晶体取向状态下沉积Bi2Sr2Ca2Cu3相的单晶MgO。 然后通过溅射将金属铅或氧化铅放置在其上以获得双层结构,并且在大气中对该二层结构进行热处理。 因此,在基材上形成结晶取向性和密度优异,从而具有高临界电流密度的氧化铋超导膜。

    Oxide superconductive wire, method of manufacturing the same and the
products using the same
    25.
    发明授权
    Oxide superconductive wire, method of manufacturing the same and the products using the same 失效
    氧化物超导线,其制造方法和使用其的产品

    公开(公告)号:US5312802A

    公开(公告)日:1994-05-17

    申请号:US613868

    申请日:1990-11-29

    摘要: An oxide superconductive wire is provided by, for example, forming an oxide superconductive layer on a tape-type flexible base. A preliminary compressive strain is applied to the oxide superconductive layer in the longitudinal direction. The remaining strain can be provided by using a base having thermal expansion coefficient larger than that of the oxide superconductive layer and by cooling the same after heat treatment, due to contraction of the base. Since the preliminary compressive strain is applied to the oxide superconductive layer, degradation of superconductivity of the oxide superconductive layer can be suppressed even if the oxide superconductive wire is bent in any direction, compared with the wire without such strain. Therefore, the oxide superconductive wire can be coiled, for example, without much degrading the superconductivity.

    摘要翻译: PCT No.PCT / JP90 / 00422 Sec。 371日期1990年11月29日第 102(e)1990年11月29日PCT PCT 1990年3月29日PCT公布。 WO90 / 12408 PCT出版物 日期1990年10月18日。氧化物超导线例如通过在带状柔性基底上形成氧化物超导层而提供。 在纵向上对氧化物超导层施加预压缩应变。 可以通过使用具有大于氧化物超导层的热膨胀系数的碱的基底,并且由于基底的收缩而在热处理后对其进行冷却来提供剩余的应变。 由于将预压缩应变施加到氧化物超导层上,与没有这种应变的线相比,即使氧化物超导线在任何方向上弯曲,也可以抑制氧化物超导层的超导性的劣化。 因此,氧化物超导线例如可以卷绕,而不会使超导性降低。

    Conductive paste and method for manufacturing multilayer printed wiring board using the same
    29.
    发明授权
    Conductive paste and method for manufacturing multilayer printed wiring board using the same 有权
    导电浆料和使用其制造多层印刷线路板的方法

    公开(公告)号:US08597459B2

    公开(公告)日:2013-12-03

    申请号:US11664393

    申请日:2005-09-26

    IPC分类号: B29C65/00 B32B37/00

    摘要: There is provided a conductive paste obtained by kneading conductive particles into an epoxy resin and having good filling ability into a via hole, which can form a connected portion wherein the connection resistance does not change with time even under high temperature and high humidity conditions. Also, there is provided a method for manufacturing a multilayer printed wiring board using the conductive paste.A conductive paste containing conductive particles and a resin mixture wherein the content of the epoxy resin having a molecular weight of 10,000 or more is from 30 to 90% by weight in the total resin component and whose elastic modulus at 85° C. after curing is 2 GPa or less, the content of the conductive particle being from 30 to 75% by volume. Furthermore, a method for manufacturing a multilayer printed wiring board using the conductive paste.

    摘要翻译: 提供一种通过将导电性粒子混入环氧树脂中并且具有良好的填充能力进入通孔而获得的导电膏,其可以形成连接部分,其中连接电阻即使在高温和高湿度条件下也不随时间变化。 此外,提供了一种使用导电浆料制造多层印刷线路板的方法。 含有导电性粒子和树脂混合物的导电性糊剂,其中分子量为10,000以上的环氧树脂的含量为总树脂成分的30〜90重量%,固化后85℃的弹性模量为 2GPa以下,导电性粒子的含量为30〜75体积%。 另外,使用该导电性糊料的多层印刷电路板的制造方法。

    Board for printed wiring, printed wiring board, and method for manufacturing them
    30.
    发明申请
    Board for printed wiring, printed wiring board, and method for manufacturing them 审中-公开
    印刷电路板,印刷线路板及其制造方法

    公开(公告)号:US20050236182A1

    公开(公告)日:2005-10-27

    申请号:US10517058

    申请日:2003-06-02

    摘要: A novel board for printed wiring comprising a fine conductor wiring having a clear and favorable boundary line and fabricated by an ordinal printing method such as screen printing, a printed wiring board using the same, and methods for manufacturing them. A board for printed wiring and a method for manufacturing the same are characterized in that the surface of a board is subjected to one of the surface treatments: (a) roughening, (2) plasma treatment, (3) roughening and then plasma treatment, and (4) roughening and then forming of a metal film coating by sputtering. A printed wiring board and a method for manufacturing the same is characterize in that a conductor wiring is fabricated by printing using a conductive paste containing metal particles the average particle diameter of which is 4 μm or less and the maximum particle diameter of which is 15 μm or less. Another printed wiring board and a method for manufacturing the same is characterized in that the surface of a conductor wiring fabricated using a conductive paste containing metal particles M and a binder B at a volume ratio of M/B of 1/1 to 1.9/1 is etched, a plating coating is formed on the surface.

    摘要翻译: 一种用于印刷布线的新型印刷电路板,包括具有透明且有利的边界线的精细导体布线,并通过诸如丝网印刷的顺序印刷法,使用其的印刷线路板及其制造方法制造。 印刷电路板及其制造方法的特征在于,对板的表面进行表面处理之一:(a)粗糙化,(2)等离子体处理,(3)粗糙化,然后进行等离子体处理, 和(4)通过溅射粗化然后形成金属膜涂层。 印刷电路板及其制造方法的特征在于,使用含有平均粒径为4μm以下,最大粒径为15μm的金属粒子的导电糊进行印刷,制造导体布线 或更少。 另一种印刷线路板及其制造方法的特征在于,使用含有金属粒子M和粘合剂B的M / B的体积比为1/1〜1.9 / 1的导电性糊剂制造的导体布线的表面 被蚀刻,在表面上形成镀覆层。