公开(公告)号：US20080139022A1

公开(公告)日：2008-06-12

申请号：US11950101

申请日：2007-12-04

申请人： Hung-Chuan Chen ,  Hung-Chang Hsieh

发明人： Hung-Chuan Chen ,  Hung-Chang Hsieh

IPC分类号： H01R13/648

CPC分类号： H01R27/02 ,  H01R13/645

摘要： A power supply apparatus includes a main body, a power input device, a first power output device and a second power output device. The first power output device includes a first cable and a first connector. The first cable is connected to a first surface of the first connector and includes at least a stop block and at least a fastening element. The second power output device includes a second cable and a second connector. The second cable is connected to a first surface of the second connector and includes an extension part and a retaining wall. An edge of the retaining wall is confined by the stop block and the extension part is clamped by the fastening element so as to selectively combine the first connector with the second connector as a composite connector assembly and facilitate securely fixing the composite connector assembly in a common power socket.

摘要翻译： 电源装置包括主体，电源输入装置，第一电力输出装置和第二电力输出装置。 第一电力输出装置包括第一电缆和第一连接器。 第一电缆连接到第一连接器的第一表面，并且至少包括止动块和至少紧固元件。 第二电力输出装置包括第二电缆和第二连接器。 第二电缆连接到第二连接器的第一表面，并包括延伸部分和挡土墙。 挡土墙的边缘由止动块限制，并且延伸部分被紧固元件夹持，以便将第一连接器与第二连接器选择性地组合为复合连接器组件，并且有助于将复合连接器组件牢固地固定在共同的 电源插座。

公开(公告)号：US07060400B2

公开(公告)日：2006-06-13

申请号：US10637347

申请日：2003-08-08

申请人： Wen-Chuan Wang ,  Shih-Ming Chang ,  Chih-Chen Chin ,  Chi-Lun Lu ,  Sheng-Chi Chin ,  Hung-Chang Hsieh

发明人： Wen-Chuan Wang ,  Shih-Ming Chang ,  Chih-Chen Chin ,  Chi-Lun Lu ,  Sheng-Chi Chin ,  Hung-Chang Hsieh

IPC分类号： G01F9/00

CPC分类号： G03F1/76 ,  G03F7/0035

摘要： A method of fabricating a photomask having improved critical dimension (CD) uniformity that meets or exceeds 90 nanometer technology requirements. The method includes the steps of: providing a transparent substrate covered with a layer of opaque material and a layer of photoresist; patterning the layer of photoresist to expose an area of the layer of opaque material that has a shape that follows a contour of a main pattern area to be defined by the layer of opaque material; removing the exposed area to define the layer of opaque material into the main pattern area and an area that surrounds the main pattern area; removing the patterned layer of photoresist; and removing the surrounding area of the layer of opaque material.

摘要翻译： 制造具有满足或超过90纳米技术要求的改进的临界尺寸（CD）均匀性的光掩模的方法。 该方法包括以下步骤：提供用不透明材料层和光致抗蚀剂层覆盖的透明基板; 图案化光致抗蚀剂层以暴露不透明材料层的区域，其具有跟随由不透明材料层限定的主图案区域的轮廓的形状; 去除暴露区域以将不透明材料层定义到主图案区域中并且围绕主图案区域的区域; 去除图案化的光刻胶层; 并去除不透明材料层的周围区域。

公开(公告)号：US06570642B2

公开(公告)日：2003-05-27

申请号：US09920605

申请日：2001-08-02

申请人： Yung-Sheng Huang ,  Hung-Chang Hsieh

发明人： Yung-Sheng Huang ,  Hung-Chang Hsieh

IPC分类号： G03B2754

CPC分类号： H01L23/544 ,  H01L2223/54406 ,  H01L2223/54433 ,  H01L2223/54493 ,  H01L2924/0002 ,  H01L2924/00

摘要： A tool for placing an identifying mark on a semiconductor wafer has a bundle of optical fibers that can be illuminated in a pattern representing an identifying character. Light from the fibers is focused on a photoresist layer during wafer manufacture and a pattern of dots is etched into the wafer to represent the character. The dots are too small to be seen with the human eye but the character can be read by a human or by a machine. The character is etched as part of a conventional etch step in manufacturing the wafer and it is easily repeated as a series of manufacturing steps obscure the original mark.

摘要翻译： 用于在半导体晶片上放置识别标记的工具具有可以以表示识别字符的图案照亮的一束光纤。 来自纤维的光在晶片制造期间聚焦在光致抗蚀剂层上，并且将点阵图案蚀刻到晶片中以表示字符。 这些点太小，不能用人眼看到，但人物可以由人或机器读取。 作为制造晶片的常规蚀刻步骤的一部分蚀刻该字符，并且由于一系列制造步骤遮蔽原始标记，因此容易重复该字符。

公开(公告)号：US6110816A

公开(公告)日：2000-08-29

申请号：US261999

申请日：1999-03-05

申请人： Yung-Sheng Huang ,  Hung-Chang Hsieh ,  Han-Chang Hsieh

发明人： Yung-Sheng Huang ,  Hung-Chang Hsieh ,  Han-Chang Hsieh

IPC分类号： H01L21/60 ,  H01L23/485 ,  H01L21/44

CPC分类号： H01L24/85 ,  H01L24/03 ,  H01L24/05 ,  H01L24/48 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05093 ,  H01L2224/05187 ,  H01L2224/05556 ,  H01L2224/05557 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/4807 ,  H01L2224/48453 ,  H01L2224/48463 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01074 ,  H01L2924/01327 ,  H01L2924/04941 ,  H01L2924/10253 ,  H01L2924/14

摘要： A method is adapted to form wire interconnect pads on integrated circuit devices and includes the steps of providing a semiconductor substrate having an aluminum-copper top metal layer, and a titanium nitride layer covering the aluminum-copper top metal layer, and a photoresist coating applied to the titanium nitride layer. The photoresist coating is partially exposed and partially developed to form openings for etching an array of submicron size holes. Etching through the titanium nitride layer to the aluminum-copper layer, by way of the partially developed photoresist, forms a rough textured surface profile in the array of cavities, with diameters of less than 0.3 um, etched in the aluminum copper layer. After stripping of the photoresist and depositing a passivation film, windows are formed delineating improved bond pads for wire bonding. The textured cavities increase the surface area of the bond pads and provide improved bondability for the 0.35 and 0.3 um IC devices.

摘要翻译： 一种适于在集成电路器件上形成导线互连焊盘的方法，包括以下步骤：提供具有铝 - 铜顶层金属层的半导体衬底和覆盖铝 - 铜顶层金属层的氮化钛层和涂覆有光致抗蚀剂涂层 到氮化钛层。 光致抗蚀剂涂层被部分曝光并部分显影以形成用于蚀刻亚微米尺寸孔阵列的开口。 通过部分显影的光致抗蚀剂将氮化钛层蚀刻到铝 - 铜层上，在铝铜层中蚀刻直径小于0.3μm的空腔阵列中形成粗糙的纹理表面轮廓。 在剥离光致抗蚀剂并沉积钝化膜之后，形成窗口，描绘改进的用于引线接合的接合焊盘。 纹理的空腔增加了接合焊盘的表面积，并为0.35和0.3um IC器件提供了改进的粘合性。

公开(公告)号：US08624345B2

公开(公告)日：2014-01-07

申请号：US13486995

申请日：2012-06-01

申请人： Ken Wu ,  Hung-Chang Hsieh ,  Chang-Cheng Hung ,  Luke Hsu ,  Ren-Guey Hsieh ,  Hsin-Chang Lee ,  Chia-Jen Chen

发明人： Ken Wu ,  Hung-Chang Hsieh ,  Chang-Cheng Hung ,  Luke Hsu ,  Ren-Guey Hsieh ,  Hsin-Chang Lee ,  Chia-Jen Chen

IPC分类号： H01L33/44 ,  G03F1/46 ,  G03F1/58 ,  G03F1/68

CPC分类号： G03F7/70941 ,  G03F1/26 ,  G03F1/46 ,  G03F7/70433

摘要： A mask substrate, photomask and method for forming the same are provided. The photomask includes a substantially light transparent substrate and a circuitry pattern disposed over the light transparent substrate. The circuitry pattern includes a phase shifting layer disposed over the substantially light transparent substrate. A substantially light shielding layer is disposed over the phase shifting layer. At least one barrier layer is disposed over the substantially light shielding layer. An uppermost portion of the substantially light shielding layer does not comprise anti-reflective properties and the at least one barrier layer comprises an uppermost hardmask layer and an underlying anti-reflective layer.

摘要翻译： 提供了掩模基板，光掩模及其形成方法。 光掩模包括基本上透明的基板和设置在光透明基板上的电路图案。 电路图案包括设置在基本上光透明基底上的相移层。 基本上遮光层设置在相移层上。 至少一个阻挡层设置在基本上遮光层上。 基本上遮光层的最上部分不包括抗反射性质，并且至少一个阻挡层包括最上面的硬掩模层和下面的抗反射层。

公开(公告)号：US08198118B2

公开(公告)日：2012-06-12

申请号：US11590257

申请日：2006-10-31

申请人： Ken Wu ,  Hung-Chang Hsieh ,  Chang-Cheng Hung ,  Luke Hsu ,  Ren-Guey Hsieh ,  Hsin-Chang Lee ,  Chia-Jen Chen

发明人： Ken Wu ,  Hung-Chang Hsieh ,  Chang-Cheng Hung ,  Luke Hsu ,  Ren-Guey Hsieh ,  Hsin-Chang Lee ,  Chia-Jen Chen

IPC分类号： H01L21/31 ,  H01L33/44 ,  G03F1/00 ,  G03F9/00

CPC分类号： G03F7/70941 ,  G03F1/26 ,  G03F1/46 ,  G03F7/70433

摘要： A mask and method for forming the same including carrying out a photolithographic patterning process the method including providing a substantially light transparent portion; forming a substantially light shielding layer disposed over the substantially light transparent portion; forming at least one barrier layer disposed over the substantially light shielding layer; forming a resist layer disposed over the at least one barrier layer; patterning the resist layer for producing a circuitry pattern; and, carrying out an etching process according to the circuitry pattern to expose a portion of the substantially light transparent portion to form a mask.

摘要翻译： 一种掩模及其形成方法，包括进行光刻图案处理，该方法包括提供基本上透明的部分; 形成设置在所述基本上透明部分上的基本上遮光层; 形成设置在所述基本上遮光层上的至少一个势垒层; 形成设置在所述至少一个阻挡层上的抗蚀剂层; 图案化抗蚀剂层以产生电路图案; 并且根据电路图案进行蚀刻处理以暴露基本上光透明部分的一部分以形成掩模。

公开(公告)号：US20100271785A1

公开(公告)日：2010-10-28

申请号：US12489120

申请日：2009-06-22

申请人： Hung-Chang Hsieh ,  Chi-Sheng Chen ,  Ren-Shen Huang

发明人： Hung-Chang Hsieh ,  Chi-Sheng Chen ,  Ren-Shen Huang

IPC分类号： H05K7/20 ,  H05K13/04

CPC分类号： H05K7/20509 ,  H01L23/36 ,  H01L23/3737 ,  H01L2924/0002 ,  H05K7/20481 ,  Y10T29/53174 ,  H01L2924/00

摘要： A heat-dissipating and fixing mechanism of an electronic component includes a heat-dissipating element, a circuit board and a thermally-conductive adhesive interface. The circuit board has multiple insertion holes. The pins of the electronic component are inserted into corresponding insertion holes of the circuit board. The thermally-conductive adhesive interface has a first surface bonded with the heat-dissipating element and a second surface bonded with the electronic component. As a consequence, the electronic component is fixed on the heat-dissipating element through the thermally-conductive adhesive interface, and the heat generated by the electronic component is transmitted to the heat-dissipating element through the thermally-conductive adhesive interface.

摘要翻译： 电子部件的散热和固定机构包括散热元件，电路板和导热粘合剂界面。 电路板有多个插孔。 电子部件的销插入到电路板的相应的插入孔中。 导热粘合剂界面具有与散热元件结合的第一表面和与电子元件粘接的第二表面。 结果，电子部件通过导热粘合剂界面固定在散热元件上，并且由电子部件产生的热量通过导热粘合剂界面传递到散热元件。

公开(公告)号：US20100003844A1

公开(公告)日：2010-01-07

申请号：US12489979

申请日：2009-06-23

申请人： Hung-Chuan Chen ,  Chin-Hsing Lin ,  Hung-Chang Hsieh

发明人： Hung-Chuan Chen ,  Chin-Hsing Lin ,  Hung-Chang Hsieh

IPC分类号： H01R13/627

CPC分类号： H01R13/6275

摘要： An electrical connector includes a plurality of pins, an isolation body and a latching mechanism. The isolation body includes a receiving part. The receiving part is arranged at a front edge of the isolation body and has a first engaging element. The latching mechanism has a second engaging element engaged with the first engaging element, so that the latching mechanism is fixed onto the isolation body.

摘要翻译： 电连接器包括多个销，隔离体和闭锁机构。 隔离体包括接收部。 接收部分布置在隔离体的前边缘处，并且具有第一接合元件。 闩锁机构具有与第一接合元件接合的第二接合元件，使得闩锁机构固定到隔离体上。

公开(公告)号：US20090103068A1

公开(公告)日：2009-04-23

申请号：US11875471

申请日：2007-10-19

申请人： Vincent Yu ,  Hsien-Cheng Wang ,  Hung-Chang Hsieh

发明人： Vincent Yu ,  Hsien-Cheng Wang ,  Hung-Chang Hsieh

IPC分类号： G03B27/34 ,  G06F19/00

CPC分类号： G03F7/70833 ,  G03F7/70258 ,  G03F7/70641 ,  G03F7/70858

摘要： Provided is an exposure apparatus including a variable focusing device. The variable focusing device may include a transparent membrane that may be deformed in the presence of an electric field. The deformation of the transparent membrane may allow the focus length of a radiation beam to be modified. In an embodiment, the variable focusing device may be modulated such that a radiation beam having a first focus length is provided for a first position on an exposure target and a radiation beam having a second focus length is provided for a second position on the exposure target. A method and computer-readable medium are also provided.

摘要翻译： 提供一种包括可变聚焦装置的曝光装置。 可变聚焦装置可以包括可能在存在电场的情况下变形的透明膜。 透明膜的变形可以允许改变辐射束的聚焦长度。 在一个实施例中，可调制可变聚焦装置，使得具有第一聚焦长度的辐射束用于曝光目标上的第一位置，并且为曝光目标上的第二位置提供具有第二焦距的辐射束 。 还提供了一种方法和计算机可读介质。

公开(公告)号：US20080080140A1

公开(公告)日：2008-04-03

申请号：US11627089

申请日：2007-01-25

申请人： Hung-Chang Hsieh

发明人： Hung-Chang Hsieh

IPC分类号： H05K7/20

CPC分类号： H01L23/4006 ,  H01L2023/4031 ,  H01L2023/405 ,  H01L2023/4087 ,  H01L2924/0002 ,  H01L2924/00

摘要： An assembled structure includes a power semiconductor device, a first insulating member, a heat sink and a fastening element. The power semiconductor device has a first perforation. The first insulating member includes a first opening and a second opening corresponding to the first perforation and a receiving portion between the first opening and a second opening. The fastening element includes a head portion and a body portion. The body portion is penetrated through the first opening, the receiving portion, the second opening and the first perforation such that the power semiconductor device is fastened onto the heat sink. The head portion is received in the receiving portion so as to isolate the head portion of the fastening element from adjacent electronic components

摘要翻译： 组装结构包括功率半导体器件，第一绝缘构件，散热器和紧固元件。 功率半导体器件具有第一穿孔。 第一绝缘构件包括对应于第一穿孔的第一开口和第二开口以及在第一开口和第二开口之间的容纳部分。 紧固元件包括头部和主体部分。 主体部分穿过第一开口，接收部分，第二开口和第一穿孔，使得功率半导体器件被紧固到散热器上。 头部被容纳在接收部分中，以将紧固元件的头部与相邻的电子部件隔离