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公开(公告)号：US09203004B2
公开(公告)日：2015-12-01
申请号：US14043494
申请日：2013-10-01
Applicant: Cree, Inc.
IPC: H01L33/40 , H01L33/62 , H01L25/075 , H01L25/16 , H01L33/52
CPC classification number: H01L33/62 , H01L25/0753 , H01L25/167 , H01L33/52 , H01L2224/48091 , H01L2224/48137 , H01L2924/00014
Abstract: Light emitting devices for light emitting diodes (LEDs) are disclosed. In one embodiment a light emitting device can include a substrate, one or more LEDs disposed over the substrate, and the LEDs can include electrical connectors for connecting to an electrical element. A light emitting device can further include a retention material disposed over the substrate and the retention material can be disposed over at least a portion of the electrical connectors. The LEDs can be connected in a pattern that is non-linear.
Abstract translation: 公开了用于发光二极管（LED）的发光器件。 在一个实施例中，发光器件可以包括衬底，设置在衬底上的一个或多个LED，并且LED可以包括用于连接到电气元件的电连接器。 发光器件还可以包括设置在衬底上的保持材料，并且保持材料可以设置在至少一部分电连接器上。 LED可以以非线性的方式连接。
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公开(公告)号：USD738832S1
公开(公告)日：2015-09-15
申请号：US29444591
申请日：2013-01-31
Applicant: CREE, Inc.
Designer： Christopher P. Hussell , Erin R. F. Welch , Jesse Colin Reiherzer
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公开(公告)号：US08921869B2
公开(公告)日：2014-12-30
申请号：US13908597
申请日：2013-06-03
Applicant: Cree, Inc.
Inventor： Erin R. F. Welch , Christopher P. Hussell , Jesse Colin Reiherzer , Joseph G. Clark
IPC: H01L27/15
CPC classification number: H01L33/60 , H01L25/0753 , H01L25/167 , H01L33/52 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2224/83192 , H01L2224/92247 , H01L2924/01322 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: Light emitting devices and methods are disclosed. In one embodiment a light emitting device can include a submount and a plurality of light emitting diodes (LEDs) disposed over the submount. At least a portion of the submount can include a reflective layer at least partially disposed below a solder mask. One or more layers within the submount may include one or more holes, a rough surface texture, or combinations thereof to improve adhesion within the device. The device can further include a retention material dispensed about the plurality of LEDs. Devices and methods are disclosed for improved solder mask adhesion.
Abstract translation: 公开了发光器件和方法。 在一个实施例中，发光器件可以包括设置在所述底座上的基座和多个发光二极管（LED）。 底座的至少一部分可以包括至少部分地布置在焊接掩模下方的反射层。 底座内的一个或多个层可以包括一个或多个孔，粗糙的表面纹理或其组合以改善装置内的粘附。 该装置还可以包括分配在多个LED周围的保留材料。 公开了用于改善焊接掩模附着力的装置和方法。
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24.发明申请HIGH VOLTAGE ARRAY LIGHT EMITTING DIODE (LED) DEVICES, FIXTURES AND METHODS 有权高电压阵列发光二极管（LED）器件，器件和方法公开(公告)号：US20130077299A1
公开(公告)日：2013-03-28
申请号：US13671089
申请日：2012-11-07
Applicant: CREE, Inc.
Inventor： Christopher P. Hussell , Jesse Colin Reiherzer , Jeffrey Carl Britt , Praneet Athalye , Peter Scott Andrews
CPC classification number: F21V21/00 , F21K9/60 , F21V7/00 , F21V11/00 , F21V15/01 , H01L25/0753 , H01L25/167 , H01L33/52 , H01L2224/48091 , H01L2224/48137 , H01L2924/01322 , H01L2924/12032 , H01L2924/1305 , H05B37/02 , H01L2924/00014 , H01L2924/00
Abstract: High voltage array light emitting devices, fixtures and methods are disclosed. In one embodiment a light emitting device can include a submount, a light emission area disposed over the submount and a retention material adapted to be dispensed about the light emission area. The light emitting device can be operable at high voltages which are greater than approximately 40 volts (V). In one aspect, the retention material can be least partially disposed within the light emission area such that the retention material physically separates a first section of the light emission area from a second section of the light emission area.
Abstract translation: 公开了高压阵列发光器件，灯具和方法。 在一个实施例中，发光器件可以包括底座，设置在底座上的发光区域和适于围绕发光区域分配的保持材料。 发光器件可以在大于大约40伏（V）的高电压下工作。 在一个方面，保持材料可以最少部分地设置在发光区域内，使得保持材料将发光区域的第一部分与发光区域的第二部分物理分离。
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公开(公告)号：US20210119090A1
公开(公告)日：2021-04-22
申请号：US17116576
申请日：2020-12-09
Applicant: Cree, Inc.
Inventor： Peter Scott Andrews , Jesse Colin Reiherzer , Amber C. Abare
IPC: H01L33/50 , H01L25/075 , H01L33/60 , H01L33/62
Abstract: Light emitting diodes, components, and related methods, with improved performance over existing light emitting diodes. In some embodiments, light emitter devices included herein include a submount, a light emitter, a light affecting material, and a wavelength conversion component. Wavelength conversion components provided herein include a transparent substrate having an upper surface and a lower surface, and a phosphor compound disposed on the upper surface or lower surface, wherein the wavelength conversion component is configured to alter a wavelength of a light emitted from a light source when positioned proximate to the light source.
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Patent Agency Ranking
公开(公告)号：US10804251B2
公开(公告)日：2020-10-13
申请号：US15359517
申请日：2016-11-22
Applicant: Cree, Inc.
Abstract: Devices, components and methods containing one or more light emitter devices, such as light emitting diodes (LEDs) or LED chips, are disclosed. In one aspect, a light emitter device component can include a metallic substrate with a mirrored surface, one or more light emitter devices mounted directly or indirectly on the mirrored surface, and one or more electrical components mounted on the top surface and electrically coupled to the one or more light emitter devices, wherein the one or more electrical components can be spaced from the mirrored metal substrate by one or more non-metallic layers. Components disclosed herein can result in improved thermal management and light output.
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公开(公告)号：US10672957B2
公开(公告)日：2020-06-02
申请号：US15654323
申请日：2017-07-19
Applicant: Cree, Inc.
Inventor： Troy Gould , Colin Kelly Blakely , Jesse Colin Reiherzer , Craig William Hardin
IPC: H01L33/54 , H01L33/00 , H01L25/075
Abstract: Light emitting diode (LED) apparatuses and methods having a high lumen output density. An example apparatus can include a substrate with one or more LEDs enclosed by an encapsulant. The encapsulant comprises beveled edges and/or top surface facets. By providing facets in the encapsulant and minimizing the chip-to-area ratio through efficient via placement, a high lumen density is achieved. Facets and bevels can be created by removing material from the encapsulant with a beveled blade.
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公开(公告)号：US20190355701A1
公开(公告)日：2019-11-21
申请号：US16525100
申请日：2019-07-29
Applicant: Cree, Inc.
Inventor： Troy Gould , Colin Kelly Blakely , Jesse Colin Reiherzer , Joseph G. Clark
Abstract: Light emitting diode (LED) devices and methods. An example apparatus can include a substrate, one or more LEDs, light-transmissive encapsulation material, and a reflective material covering a portion of the encapsulation material to form a defined opening. The opening allows light emitted from an LED to pass through in a prescribed manner. In some embodiments, the apparatus can be subsequently treated to modify the surface having the opening. In other embodiments, the reflective material can be disposed on a lateral surface of the encapsulation material to reflect light in a desired direction.
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公开(公告)号：US20190237638A1
公开(公告)日：2019-08-01
申请号：US16380400
申请日：2019-04-10
Applicant: Cree, Inc.
Inventor： Peter Scott Andrews , Jesse Colin Reiherzer , Amber C. Abare
IPC: H01L33/50 , H01L33/60 , H01L33/62 , H01L25/075
CPC classification number: H01L33/507 , H01L25/0753 , H01L33/501 , H01L33/502 , H01L33/505 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/16225 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2933/0091
Abstract: Light emitting diodes, components, and related methods, with improved performance over existing light emitting diodes. In some embodiments, light emitter devices included herein include a submount, a light emitter, a light affecting material, and a wavelength conversion component. Wavelength conversion components provided herein include a transparent substrate having an upper surface and a lower surface, and a phosphor compound disposed on the upper surface or lower surface, wherein the wavelength conversion component is configured to alter a wavelength of a light emitted from a light source when positioned proximate to the light source.
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