公开(公告)号：US20110034606A1

公开(公告)日：2011-02-10

申请号：US12906540

申请日：2010-10-18

申请人： Eun Tae PARK ,  Yul Kyo Chung ,  Seung Hyun Sohn ,  Min Ji Ko

发明人： Eun Tae PARK ,  Yul Kyo Chung ,  Seung Hyun Sohn ,  Min Ji Ko

IPC分类号： C08K3/22

CPC分类号： H05K1/162 ,  H01G4/206 ,  H01L2924/0002 ,  H05K2201/0209 ,  H01L2924/00

摘要： Disclosed herein is a composite dielectric composition having a small variation of capacitance with temperature, comprising a combination of a polymer matrix exhibiting a positive or negative variation of capacitance with temperature and a ceramic filler exhibiting a negative or positive variation of capacitance with temperature which is reciprocal to that of the polymer matrix; and a signal-matching embedded capacitor prepared by using the same composition. Particularly, the present invention provides a composite dielectric composition comprising a polymer matrix exhibiting a positive or negative variation of capacitance with temperature and a ceramic filler exhibiting a variation of capacitance which is reciprocal to that of the polymer matrix; and a signal-matching embedded capacitor formed of the same composition and having a variation of capacitance with temperature, ΔC/C×100(%), of not more than 5%. The composite dielectric composition of the present invention can be used in preparation of the signal-matching embedded capacitor due to a small variation of capacitance with temperature.

摘要翻译： 本文公开了一种具有小的电容变化与温度的复合电介质组合物，其包括表现出电容与温度的正或负变化的聚合物基体和陶瓷填料的组合，所述陶瓷填料表现出与温度成反比的电容的负或正变化 与聚合物基体的相同; 以及通过使用相同组成制备的信号匹配嵌入式电容器。 特别地，本发明提供一种复合电介质组合物，其包含显示电容与温度的正或负变化的聚合物基质和表现出与聚合物基体相反的电容变化的陶瓷填料; 以及具有相同组成并且具有不大于5％的电容与温度变化的信号匹配嵌入式电容器，并且Dgr; C / C×100（％）。 本发明的复合电介质组合物由于电容随温度的变化小而可用于制备信号匹配嵌入式电容器。

公开(公告)号：US07736397B2

公开(公告)日：2010-06-15

申请号：US11730979

申请日：2007-04-05

申请人： Seung Eun Lee ,  Yul Kyo Chung ,  Hyung Dong Kang ,  Hyun Ju Jin

发明人： Seung Eun Lee ,  Yul Kyo Chung ,  Hyung Dong Kang ,  Hyun Ju Jin

IPC分类号： H01L21/8242 ,  H01G9/00

CPC分类号： H04R19/00 ,  H05K1/162 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2203/0346 ,  H05K2203/0353 ,  Y10T29/417 ,  Y10T29/42 ,  Y10T29/43 ,  Y10T29/435

摘要： A method for manufacturing a capacitor embedded in a PCB includes: preparing a copper clad lamination (CCL) substrate having a reinforcement member and copper foils formed on both surfaces of the reinforcement member; planarizing surfaces of the copper foils of the CCL substrate; forming a dielectric layer on the planarized surface of the copper foils; and forming a top electrode on the dielectric layer.

摘要翻译： 一种嵌入在PCB中的电容器的制造方法，其特征在于，包括：具有加强部件的铜包层压（CCL）基板和形成在所述加强部件的两面上的铜箔; 平坦化CCL基板的铜箔表面; 在铜箔的平坦化表面上形成电介质层; 并在电介质层上形成顶部电极。

公开(公告)号：US20090152121A1

公开(公告)日：2009-06-18

申请号：US12370818

申请日：2009-02-13

申请人： Jin Seok MOON ,  Yul Kyo Chung ,  Soo Hyun Lyoo ,  Seung Hyun Sohn

发明人： Jin Seok MOON ,  Yul Kyo Chung ,  Soo Hyun Lyoo ,  Seung Hyun Sohn

IPC分类号： C25D5/00

CPC分类号： H05K1/162 ,  H05K3/388 ,  H05K2201/0175 ,  H05K2201/0179 ,  Y10T29/417 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155

摘要： Disclosed herein is a printed circuit board with an embedded thin-film capacitor, and a method of manufacturing the same.Specifically, the present invention relates to a printed circuit board with an embedded thin-film capacitor, comprising a lower electrode formed on an insulating substrate; an amorphous paraelectric film formed on the lower electrode; a metal seed layer formed on the paraelectric film; and an upper electrode formed on the metal seed layer and having a surface roughness (Ra) of more than 300 nm; anda method of manufacturing a printed circuit board with an embedded thin-film capacitor, comprising forming a lower electrode on an insulating substrate; forming an amorphous paraelectric film on the lower electrode, using a low-temperature film formation process; forming a metal seed layer on the paraelectric film; and forming an upper electrode having a surface roughness (Ra) of more than 300 nm on the metal seed layer, using an electroplating method.

摘要翻译： 这里公开了具有嵌入式薄膜电容器的印刷电路板及其制造方法。 具体地说，本发明涉及一种具有嵌入式薄膜电容器的印刷电路板，包括形成在绝缘基板上的下电极; 形成在下电极上的非晶顺电膜; 形成在顺电膜上的金属种子层; 和形成在金属籽晶层上并具有大于300nm的表面粗糙度（Ra）的上电极; 以及制造具有嵌入式薄膜电容器的印刷电路板的方法，包括在绝缘基板上形成下电极; 使用低温成膜法在下电极上形成非晶顺电膜; 在顺电膜上形成金属种子层; 并且使用电镀方法在金属籽晶层上形成表面粗糙度（Ra）大于300nm的上电极。

公开(公告)号：US07540913B2

公开(公告)日：2009-06-02

申请号：US11541673

申请日：2006-10-03

申请人： Jun Hee Bae ,  Seung Hyun Kim ,  Yul Kyo Chung ,  Won Hoon Song ,  Sung Taek Lim ,  Hyun Ju Jin

发明人： Jun Hee Bae ,  Seung Hyun Kim ,  Yul Kyo Chung ,  Won Hoon Song ,  Sung Taek Lim ,  Hyun Ju Jin

IPC分类号： C09D185/00

CPC分类号： H01L21/02282 ,  H01G4/1218 ,  H01G4/33 ,  H01L21/02186 ,  H01L21/316 ,  H05K1/162 ,  H05K2201/0175 ,  H05K2201/0179

摘要： Disclosed herein are a coating solution for the formation of a dielectric thin film and a method for the formation of a dielectric thin film using the coating solution. The coating solution comprises a titanium alkoxide, a β-diketone or its derivative, and a benzoic acid derivative having an electron donating group. The method comprises spin coating the coating solution on a substrate to form a thin film and drying the thin film at a low temperature to crystallize the thin film. The titanium-containing coating solution is highly stable. In addition, the coating solution enables formation of a thin film, regardless of the kind of substrates, and can be used to form dielectric thin films in an in-line mode in the production processes of PCBs.

摘要翻译： 本文公开了用于形成电介质薄膜的涂布溶液和使用该涂布溶液形成电介质薄膜的方法。 涂布溶液包含钛醇盐，β-二酮或其衍生物，以及具有给电子基团的苯甲酸衍生物。 该方法包括将涂布溶液旋涂在基材上以形成薄膜，并在低温下干燥薄膜以使薄膜结晶。 含钛涂层溶液高度稳定。 此外，涂布溶液能够形成薄膜，而不管基板的种类如何，并且可以用于在PCB的生产过程中以在线模式形成电介质薄膜。

公开(公告)号：US20080236878A1

公开(公告)日：2008-10-02

申请号：US12076989

申请日：2008-03-26

申请人： Seung Eun Lee ,  Yul Kyo Chung ,  Jung Won Lee ,  In Hyung Lee ,  Byung Ik Song

发明人： Seung Eun Lee ,  Yul Kyo Chung ,  Jung Won Lee ,  In Hyung Lee ,  Byung Ik Song

IPC分类号： H05K1/18 ,  H01G4/10 ,  H01G7/00

CPC分类号： H05K1/162 ,  H01G4/105 ,  H01G4/33 ,  H05K2201/0175 ,  H05K2201/0179 ,  Y10T29/435

摘要： There is provided a thin film capacitor and a capacitor-embedded printed board improved in leakage current characteristics. A dielectric layer is formed of a BiZnNb-based amorphous metal oxide with a predetermined dielectric constant without being heat treated at a high temperature, and metallic phase bismuth of the BiZnNb-based amorphous metal oxide is adjusted in content to attain a desired dielectric constant. Also, another dielectric layer having a different content of metallic phase bismuth may be formed. The thin film capacitor including: a first electrode; a dielectric layer including a first dielectric film formed on the first electrode, the dielectric layer comprising a BiZnNb-based amorphous metal oxide; and a second electrode formed on the dielectric layer, wherein the BiZnNb-based amorphous metal oxide contains metallic phase bismuth.

摘要翻译： 提供了薄膜电容器和电容器嵌入式印刷电路板，改善了漏电流特性。 电介质层由具有预定介电常数的BiZnNb基非晶态金属氧化物形成，而不在高温下进行热处理，并且将BiZnNb基非晶态金属氧化物的金属相铋的含量调节到所需的介电常数。 此外，可以形成具有不同金属相铋含量的另一介质层。 所述薄膜电容器包括：第一电极; 介电层，包括形成在所述第一电极上的第一电介质膜，所述电介质层包含BiZnNb基非晶态金属氧化物; 以及形成在所述电介质层上的第二电极，其中所述BiZnNb基非晶态金属氧化物含有金属相铋。

公开(公告)号：US07417870B2

公开(公告)日：2008-08-26

申请号：US11709156

申请日：2007-02-22

申请人： Sung Taek Lim ,  Yul Kyo Chung

发明人： Sung Taek Lim ,  Yul Kyo Chung

IPC分类号： H05K1/18

CPC分类号： H05K1/0231 ,  H01L2924/15311 ,  H05K1/162 ,  H05K1/185 ,  H05K2201/0179 ,  H05K2201/09509 ,  H05K2201/10636 ,  H05K2201/10643 ,  H05K2201/10734 ,  Y02P70/611

摘要： A multi-layer board having a superior decoupling function in a low frequency band and a radio frequency band. The multi-layer board includes a board body having a plurality of stacked dielectric layers, power terminals connected through a via, ground terminals connected through a via and an integrated circuit component connected to the power and ground terminals. The multi-layer board also includes a power line unit connected to the power terminals and the integrated circuit component and a ground line unit connected to the ground terminals and the integrated circuit component. The multi-layer board further includes at least one multilayer chip capacitor mounted on the board body and connected between the power terminal and the ground terminal formed on the board body and at least one thin film capacitor mounted inside the board body and connected between the power line unit and the ground line unit.

摘要翻译： 一种在低频带和无线电频带中具有优异的去耦功能的多层板。 多层板包括具有多层堆叠电介质层的电路板，通过通孔连接的电源端子，通过通孔连接的接地端子和连接到电源接地端子的集成电路部件。 多层板还包括连接到电源端子和集成电路部件的电力线单元和连接到接地端子和集成电路部件的接地线单元。 多层板还包括安装在板体上并连接在电源端子和形成在电路板主体上的接地端子之间的至少一个多层片式电容器，以及安装在电路板主体内并连接在电源之间的至少一个薄膜电容器 线路单元和地线单元。

公开(公告)号：US20070194876A1

公开(公告)日：2007-08-23

申请号：US11709156

申请日：2007-02-22

申请人： Sung Taek Lim ,  Yul Kyo Chung

发明人： Sung Taek Lim ,  Yul Kyo Chung

IPC分类号： H01F27/28

CPC分类号： H05K1/0231 ,  H01L2924/15311 ,  H05K1/162 ,  H05K1/185 ,  H05K2201/0179 ,  H05K2201/09509 ,  H05K2201/10636 ,  H05K2201/10643 ,  H05K2201/10734 ,  Y02P70/611

摘要： A multi-layer board having a superior decoupling function in a low frequency band and a radio frequency band. The multi-layer board includes a board body having a plurality of stacked dielectric layers, power terminals connected through a via, ground terminals connected through a via and an integrated circuit component connected to the power and ground terminals. The multi-layer board also includes a power line unit connected to the power terminals and the integrated circuit component and a ground line unit connected to the ground terminals and the integrated circuit component. The multi-layer board further includes at least one multilayer chip capacitor mounted on the board body and connected between the power terminal and the ground terminal formed on the board body and at least one thin film capacitor mounted inside the board body and connected between the power line unit and the ground line unit.

摘要翻译： 一种在低频带和无线电频带中具有优异的去耦功能的多层板。 多层板包括具有多层堆叠电介质层的电路板，通过通孔连接的电源端子，通过通孔连接的接地端子和连接到电源接地端子的集成电路部件。 多层板还包括连接到电源端子和集成电路部件的电力线单元和连接到接地端子和集成电路部件的接地线单元。 多层板还包括安装在板体上并连接在电源端子和形成在电路板主体上的接地端子之间的至少一个多层片式电容器，以及安装在电路板主体内并连接在电源之间的至少一个薄膜电容器 线路单元和地线单元。

公开(公告)号：US20120160549A1

公开(公告)日：2012-06-28

申请号：US13030837

申请日：2011-02-18

申请人： Moon Il Kim ,  Yul Kyo Chung ,  Jung Soo Byun

发明人： Moon Il Kim ,  Yul Kyo Chung ,  Jung Soo Byun

IPC分类号： H05K1/09 ,  H05K3/00 ,  H05K1/16

CPC分类号： H05K3/445 ,  H01L24/24 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/07811 ,  H05K1/185 ,  H05K2201/09745 ,  H05K2201/10015 ,  H05K2201/2009 ,  H05K2203/0323 ,  H05K2203/1469 ,  Y10T29/49124 ,  H01L2924/00

摘要： Disclosed is a printed circuit board having an embedded electronic component, including a metal substrate having a first cavity formed in a thickness direction and a support plate integrated with one side of the metal substrate and formed in the first cavity. Thereby, a method of manufacturing such a printed circuit board is also provided. When manufacturing the printed circuit board having an embedded electronic component, there is no need for an additional member including support tape to seat the electronic component, thus simplifying the manufacturing process and reducing lead time, thereby improving productivity.

摘要翻译： 公开了一种具有嵌入式电子部件的印刷电路板，包括具有在厚度方向上形成的第一空腔的金属基板和与该金属基板的一侧成一体并形成在第一空腔中的支撑板。 因此，还提供了制造这种印刷电路板的方法。 当制造具有嵌入式电子部件的印刷电路板时，不需要包括支撑带的附加构件来安置电子部件，从而简化了制造工艺并缩短了交货时间，从而提高了生产率。

公开(公告)号：US20110314667A1

公开(公告)日：2011-12-29

申请号：US13137655

申请日：2011-08-31

申请人： Sang Jin Baek ,  Yul Kyo Chung ,  Hyung Mi Jung ,  Jung Soo Byun

发明人： Sang Jin Baek ,  Yul Kyo Chung ,  Hyung Mi Jung ,  Jung Soo Byun

IPC分类号： H05K3/30

CPC分类号： H05K1/185 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/82047 ,  H01L2224/82102 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/18162 ,  H01L2924/3025 ,  H05K3/4602 ,  H05K2201/035 ,  H05K2201/10674 ,  H05K2203/0191 ,  Y10T29/49124 ,  Y10T29/4913

摘要： A method of manufacturing a printed circuit board including an electronic component embedded therein, including: preparing a core substrate, which has a cavity formed therein and which includes internal circuit layers formed thereon; attaching a tape to one side of the core substrate; attaching an electronic component on the tape such that the cavity receives the electronic component therein; forming a first insulating layer on another side of the core substrate such that the first insulating layer infiltrates into the cavity; removing the tape attached to the one side of the core substrate, and forming connecting parts for electrically connecting electrode terminals of the electronic component to the internal circuit layer formed on the one side of the core substrate; and forming a second insulating layer on the one side of the core substrate from which the tape is removed

摘要翻译： 一种制造包括嵌入其中的电子部件的印刷电路板的方法，包括：准备具有形成在其中并且包括形成在其上的内部电路层的空腔的芯基板; 将带附着到所述芯基板的一侧; 将电子部件附接在带上，使得空腔在其中接收电子部件; 在所述芯基板的另一侧上形成第一绝缘层，使得所述第一绝缘层渗透到所述空腔中; 去除附着在芯基板的一侧的带，并且形成用于将电子部件的电极端子电连接到形成在芯基板的一侧上的内部电路层的连接部分; 以及在所述芯基板的一侧上形成第二绝缘层，从所述芯基板移除所述带

公开(公告)号：US07927517B2

公开(公告)日：2011-04-19

申请号：US12437657

申请日：2009-05-08

申请人： Jun Hee Bae ,  Seung Hyun Kim ,  Yul Kyo Chung ,  Won Hoon Song ,  Sung Taek Lim ,  Hyun Ju Jin

发明人： Jun Hee Bae ,  Seung Hyun Kim ,  Yul Kyo Chung ,  Won Hoon Song ,  Sung Taek Lim ,  Hyun Ju Jin

IPC分类号： C09D5/24 ,  H01B1/08

CPC分类号： H01L21/02282 ,  H01G4/1218 ,  H01G4/33 ,  H01L21/02186 ,  H01L21/316 ,  H05K1/162 ,  H05K2201/0175 ,  H05K2201/0179

摘要： Disclosed herein are a coating solution for the formation of a dielectric thin film and a method for the formation of a dielectric thin film using the coating solution. The coating solution comprises a titanium alkoxide, a β-diketone or its derivative, and a benzoic acid derivative having an electron donating group. The method comprises spin coating the coating solution on a substrate to form a thin film and drying the thin film at a low temperature to crystallize the thin film. The titanium-containing coating solution is highly stable. In addition, the coating solution enables formation of a thin film, regardless of the kind of substrates, and can be used to form dielectric thin films in an in-line mode in the production processes of PCBs.

摘要翻译： 本文公开了用于形成电介质薄膜的涂布溶液和使用该涂布溶液形成电介质薄膜的方法。 涂层溶液包含烷氧基钛，二 - 二酮或其衍生物，以及具有给电子基团的苯甲酸衍生物。 该方法包括将涂布溶液旋涂在基材上以形成薄膜，并在低温下干燥薄膜以使薄膜结晶。 含钛涂层溶液高度稳定。 此外，涂布溶液能够形成薄膜，而不管基板的种类如何，并且可以用于在PCB的生产过程中以在线模式形成电介质薄膜。