RESPONSE TO TAMPER DETECTION IN A MEMORY DEVICE
    22.
    发明申请
    RESPONSE TO TAMPER DETECTION IN A MEMORY DEVICE 有权
    对存储器件中的篡改器检测的响应

    公开(公告)号:US20140230079A1

    公开(公告)日:2014-08-14

    申请号:US14175063

    申请日:2014-02-07

    Abstract: In response to a tamper-attempt indication, a memory device selectively disables one or more memory operations. Disabling can be accomplished by different techniques, including altering bias voltages associated with performing the memory operation, gating off a current needed for performing the memory operation, and limiting the needed current to a magnitude below the threshold magnitude required for the operation. After disabling the memory operation, a mock current can be generated. The mock current is intended to mimic the current normally expended during the memory operation when not disabled, thereby leading a user to believe that the device is continuing to operate normally even though the memory operation that is being attempted is not actually being performed.

    Abstract translation: 响应于篡改尝试指示,存储器设备选择性地禁用一个或多个存储器操作。 禁用可以通过不同的技术实现,包括改变与执行存储器操作相关联的偏置电压,选通执行存储器操作所需的电流,以及将所需电流限制在低于操作所需阈值幅度的幅度。 禁用内存操作后,可以生成模拟电流。 模拟电流旨在模拟在不被禁用时在存储器操作期间通常消耗的电流,从而导致用户认为即使正在尝试的存储器操作实际上不被执行,设备也继续正常地操作。

    Methods of forming magnetoresistive devices and integrated circuits

    公开(公告)号:US11335728B2

    公开(公告)日:2022-05-17

    申请号:US16881958

    申请日:2020-05-22

    Abstract: Magnetoresistive device architectures and methods for manufacturing are presented that facilitate integration of process steps associated with forming such devices into standard process flows used for surrounding logic/circuitry. In some embodiments, the magnetoresistive device structures are designed such that the devices are able to fit within the vertical dimensions of the integrated circuit associated with a single metal layer and a single layer of interlayer dielectric material. Integrating the processing for the magnetoresistive devices can include using the same standard interlayer dielectric material as used in the surrounding circuits on the integrated circuit as well as using standard vias to interconnect to at least one of the electrodes of the magnetoresistive devices.

    Memory device with shared amplifier circuitry

    公开(公告)号:US10395699B2

    公开(公告)日:2019-08-27

    申请号:US14496984

    申请日:2014-09-25

    Abstract: In some examples, a memory device may have at least a first and a second memory array. In some cases, a portion of the bit cells of the first memory array may be coupled to first PMOS-follower circuitry and to second PMOS-follower circuitry. A portion of the bit cells of the second memory array may also be coupled to the second PMOS-follower circuitry and to third PMOS-follower circuitry. Additionally, in some cases, the portions of bit cells of both the first memory array and the second memory array may be coupled to shared preamplifier circuitry.

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