公开(公告)号：US20240179868A1

公开(公告)日：2024-05-30

申请号：US18523790

申请日：2023-11-29

Applicant: Frore Systems Inc.

Inventor： Prabhu Sathyamurthy ,  Suryaprakash Ganti ,  Seshagiri Rao Madhavapeddy ,  Nilesh Sudhir Hasabnis ,  Vikram Mukundan ,  William Finn Ninian Paisley

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20172 ,  G06F1/20 ,  H05K7/20145 ,  H05K7/20154 ,  H05K7/20436

Abstract: A cooling system for a computing device is described. The cooling system includes a heat transfer structure. The heat transfer structure includes a heat spreader, a fin structure, and a differential pressure device. The fin structure transfers heat from the heat spreader to a fluid. The differential pressure device generates a low pressure region that draws the fluid from an ingress in the computing device through the fin structure. The heat transfer structure is enclosed in a chamber of the computing device. The chamber includes the ingress and an egress.

公开(公告)号：US11978690B2

公开(公告)日：2024-05-07

申请号：US17860561

申请日：2022-07-08

Applicant: Frore Systems Inc.

Inventor： Vikram Mukundan ,  Suryaprakash Ganti ,  Seshagiri Rao Madhavapeddy ,  Ananth Saran Yalamarthy ,  Prathima Kapa

IPC: H01L23/40 ,  B81B3/00 ,  G06F1/20 ,  H01L23/473

CPC classification number: H01L23/4735 ,  B81B3/0021 ,  G06F1/20 ,  H01L23/40 ,  B81B2201/034 ,  B81B2203/0118 ,  B81B2203/0307 ,  B81B2203/0315 ,  B81B2203/033 ,  B81B2207/99

Abstract: A cooling system is described. The cooling system includes a bottom plate, a support structure, and a cooling element. The bottom plate has orifices therein. The cooling element has a central axis and is supported by the support structure at the central axis. A first portion of the cooling element is on a first side of the central axis and a second portion of the cooling element is on a second side of the central axis opposite to the first side. The first and second portions of the cooling element are unpinned. The first portion and the second portion are configured to undergo vibrational motion when actuated to drive a fluid toward a heat-generating structure. The support structure couples the cooling element to the bottom plate. At least one of the support structure is an adhesive support structure or the support structure undergoes rotational motion in response to the vibrational motion. The adhesive support structure has at least one lateral dimension defined by a trench in the cooling element or the bottom plate.

公开(公告)号：US11710678B2

公开(公告)日：2023-07-25

申请号：US16369801

申请日：2019-03-29

Applicant: Frore Systems Inc.

Inventor： Suryaprakash Ganti ,  Seshagiri Rao Madhavapeddy ,  Leonard Eugene Fennell ,  Vikram Mukundan

IPC: F25B21/02 ,  H01L41/00 ,  F04B17/00 ,  H01L23/473 ,  F04B53/10 ,  F04B43/04 ,  F04B45/047 ,  B06B1/06 ,  H01L23/427 ,  H01L23/433 ,  H05K7/20 ,  F04D33/00 ,  H04M1/02 ,  F04B43/09 ,  H01L23/46 ,  H01L23/42 ,  F04B45/04 ,  H10N30/00 ,  H10N30/20 ,  H10N30/80 ,  H10N35/80

CPC classification number: H01L23/4735 ,  B06B1/06 ,  F04B17/003 ,  F04B43/04 ,  F04B43/046 ,  F04B43/095 ,  F04B45/043 ,  F04B45/047 ,  F04B53/1077 ,  F04D33/00 ,  F25B21/02 ,  H01L23/42 ,  H01L23/427 ,  H01L23/433 ,  H01L23/4336 ,  H01L23/46 ,  H01L23/473 ,  H04M1/0202 ,  H05K7/20 ,  H05K7/20009 ,  H05K7/2039 ,  H05K7/20272 ,  H05K7/20281 ,  H10N30/00 ,  H10N30/20 ,  H10N30/204 ,  H10N30/2047 ,  H10N30/80 ,  H10N35/80 ,  F25B2321/023 ,  F25B2321/025 ,  F25B2321/0212 ,  F25B2321/0252

Abstract: A piezoelectric cooling system and method for driving the cooling system are described. The piezoelectric cooling system includes a first piezoelectric cooling element and a second piezoelectric cooling element. The first piezoelectric cooling element is configured to direct a fluid toward a surface of a heat-generating structure. The second piezoelectric cooling element is configured to direct the fluid to an outlet area after heat has been transferred to the fluid by the heat-generating structure.

公开(公告)号：US20230200011A1

公开(公告)日：2023-06-22

申请号：US18083414

申请日：2022-12-16

Applicant: Frore Systems Inc.

Inventor： Prabhu Sathyamurthy ,  Suryaprakash Ganti ,  Seshagiri Rao Madhavapeddy ,  Vikram Mukundan ,  Narayana Prasad Rayapati

IPC: H05K7/20

CPC classification number: H05K7/20309 ,  H05K7/20327 ,  H05K7/20381

Abstract: A server system is described. The server system includes a vapor chamber in thermal communication with a plurality of heat sources and an array of microelectromechanical system (MEMS) jets arranged to cause a fluid to impinge on a surface of the vapor chamber.

公开(公告)号：US20230012794A1

公开(公告)日：2023-01-19

申请号：US17860564

申请日：2022-07-08

Applicant: Frore Systems Inc.

Inventor： Suryaprakash Ganti ,  Ganapathy Sankar ,  Vikram Mukundan ,  Ananth Saran Yalamarthy

IPC: H01L41/09 ,  H01L41/113 ,  B81B7/00 ,  H01L41/04 ,  H01L23/367

Abstract: A cooling system is described. The cooling system includes a support structure, a cooling element, and drive electronics. The cooling element has a central axis and is supported by the support structure at the central axis. First and second portions of the cooling element are on first and second sides of the central axis and unpinned. The first and second portions of the cooling element undergo vibrational motion when actuated to drive a fluid toward a heat-generating structure. The cooling element further has first and second piezoelectrics having opposite polarizations. The first piezoelectric is part of the first portion of the cooling element. The second piezoelectric is part of the second portion of the cooling element. The drive electronics drive the first and second portions of the cooling element using a single drive signal.

公开(公告)号：US20230011084A1

公开(公告)日：2023-01-12

申请号：US17862171

申请日：2022-07-11

Applicant: Frore Systems Inc.

Inventor： Vikram Mukundan ,  Ananth Saran Yalamarthy ,  Suryaprakash Ganti ,  Seshagiri Rao Madhavapeddy ,  Prabhu Sathyamurthy

IPC: H05K7/20 ,  G06F1/20

Abstract: A cooling system including a support structure and a cooling element is described. The cooling element has a thickness and includes an anchored region and a cantilevered arm. The anchored region is coupled to and supported by the support structure. The cantilevered arm extends outward from the anchored region. The cantilevered arm includes at least one cavity therein. The at least one cavity has a depth of at least one-third and not more than three-fourths of the thickness of the cooling element. The cooling element is configured to undergo vibrational motion when actuated to drive a fluid for cooling a heat-generating structure.

公开(公告)号：US20220087064A1

公开(公告)日：2022-03-17

申请号：US17468151

申请日：2021-09-07

Applicant: Frore Systems Inc.

Inventor： Suryaprakash Ganti ,  Brian James Gally ,  Ming-Hau Tung ,  Seshagiri Rao Madhavapeddy ,  Vikram Mukundan ,  Ananth Saran Yalamarthy ,  Leonard Eugene Fennell

IPC: H05K7/20 ,  H01L23/473

Abstract: A method for providing a cooling system is described. The method includes providing a plurality of sheets. Each sheet includes at least one structure for a level in each cooling cell of a plurality of cooling cells. A particular level of each cooling cell includes a cooling element having a first side and a second side. The cooling element is configured to undergo vibrational motion to drive fluid from the first side to the second side. The method also includes aligning the sheets, attaching the sheets to form a laminate that includes the cooling cells, and separating the laminate into sections. Each section includes at least one cooling cell.

公开(公告)号：US20210400848A1

公开(公告)日：2021-12-23

申请号：US17464422

申请日：2021-09-01

Applicant: Frore Systems Inc.

Inventor： Vikram Mukundan ,  Suryaprakash Ganti ,  Ananth Saran Yalamarthy ,  Seshagiri Rao Madhavapeddy ,  Prabhu Sathyamurthy

IPC: H05K7/20

Abstract: An actuator usable in a cooling system is described. The actuator includes an anchored region and a cantilevered arm. The cantilevered arm extends outward from the anchored region. The cantilevered arm includes a step region, an extension region and an outer region. The step region extends outward from the anchored region and has a step thickness. The extension region extends outward from the step region and has an extension thickness less than the step thickness. The outer region extends outward from the extension region and has an outer thickness greater than the extension thickness.

公开(公告)号：US20210185856A1

公开(公告)日：2021-06-17

申请号：US17121620

申请日：2020-12-14

Applicant: Frore Systems Inc.

Inventor： Suryaprakash Ganti ,  Seshagiri Rao Madhavapeddy ,  Prabhu Sathyamurthy ,  Vikram Mukundan ,  Lumaya Ahmed

IPC: H05K7/20 ,  H05K7/14 ,  H05K5/02 ,  H05K5/03

Abstract: A system including an active cooling system is described. The active cooling system includes a cooling element in communication with a fluid and configured to use vibrational motion to direct a fluid toward a surface of heat-generating structure(s). Heat is transferred from the heat-generating structure to the fluid. The system is configured such that the fluid follows a path from the surface of the heat-generating structure(s) past a structure having a lower temperature than the surface of the heat-generating structure. The structure absorbs heat from the fluid. The structure is within the system and distal from the active cooling system.

公开(公告)号：US20210180723A1

公开(公告)日：2021-06-17

申请号：US16715793

申请日：2019-12-16

Applicant: Frore Systems Inc.

Inventor： Vikram Mukundan ,  Ananth Saran Yalamarthy ,  Prabhu Sathyamurthy ,  Suryaprakash Ganti ,  Narayana Prasad Rayapati ,  Seshagiri Rao Madhavapeddy

IPC: F16K99/00 ,  B81B7/00 ,  H05K7/20

Abstract: An active cooling system is described. The active cooling system includes at least one cooling element that has a vent therein and is in communication with a fluid. The cooling element(s) are actuated to vibrate to drive the fluid toward a heat-generating structure and to alternately open and close at least one virtual valve corresponding to the vent. The virtual valve is open for a low flow resistance and closed for a high flow resistance. The vent remains physically open for the virtual valve being closed.