公开(公告)号：US11456232B2

公开(公告)日：2022-09-27

申请号：US16100406

申请日：2018-08-10

Applicant: Intel Corporation

Inventor： Zhimin Wan ,  Je-Young Chang ,  Chia-Pin Chiu ,  Shankar Devasenathipathy ,  Betsegaw Kebede Gebrehiwot ,  Chandra Mohan Jha

IPC: H01L23/427 ,  H01L25/18

Abstract: Disclosed herein are thermal assemblies for multi-chip packages (MCPs), as well as related methods and devices. For example, in some embodiments, a thermal assembly for an MCP may include a heat pipe having a ring shape.

公开(公告)号：US20220201889A1

公开(公告)日：2022-06-23

申请号：US17128620

申请日：2020-12-21

Applicant: Intel Corporation

Inventor： Raanan Sover ,  James Williams ,  Bradley Smith ,  Nir Peled ,  Paul George ,  Jason Armstrong ,  Alexey Chinkov ,  Meir Cohen ,  Je-Young Chang ,  Kuang Liu ,  Ravindranath Mahajan ,  Kelly Lofgreen ,  Kyle Arrington ,  Michael Crocker ,  Sergio Antonio Chan Arguedas

IPC: H05K7/20

Abstract: A two-phase immersion cooling system for an integrated circuit assembly may be formed utilizing boiling enhancement structures formed on or directly attached to heat dissipation devices within the integrated circuit assembly, formed on or directly attached to integrated circuit devices within the integrated circuit assembly, and/or conformally formed over support devices and at least a portion of an electronic board within the integrated circuit assembly. In still a further embodiment, the two-phase immersion cooling system may include a low boiling point liquid including at least two liquids that are substantially immiscible with one another.

公开(公告)号：US11081450B2

公开(公告)日：2021-08-03

申请号：US16585052

申请日：2019-09-27

Applicant: Intel Corporation

Inventor： Dong-Ho Han ,  Jaejin Lee ,  Je-Young Chang ,  Jerrod Peterson ,  Mark Carbone

IPC: H01L23/552 ,  H01L21/48 ,  H01L23/367 ,  H01L23/498

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, a radiation source on the substrate, a ground on the substrate, where the ground is located around the radiation source, and a heat spreader over the radiation source, where the heat spreader includes one or more ground coupling mechanisms that are in contact with the ground on the substrate. The one or more ground coupling mechanisms in contact with the ground on the substrate create a radiation shield that at least partially keeps radiation from the radiation source from extending past the substrate.

公开(公告)号：US20200243418A1

公开(公告)日：2020-07-30

申请号：US16256831

申请日：2019-01-24

Applicant: Intel Corporation

Inventor： Nicholas Neal ,  Zhimin Wan ,  Shankar Devasenathipathy ,  Je-Young Chang

IPC: H01L23/433 ,  H01L21/48 ,  F28F19/01

Abstract: Embodiments include a cooling solution having a first array of fins, where the first array of fins extend vertically from the substrate, and where adjacent individual fins of the first array are separated from each other by a microchannel. A second array of fins extend vertically from the substrate, where a channel region is between the first array of fins and the second array of fins.

公开(公告)号：US20200219789A1

公开(公告)日：2020-07-09

申请号：US16241108

申请日：2019-01-07

Applicant: Intel Corporation

Inventor： Aastha Uppal ,  Je-Young Chang ,  Javed Shaikh ,  Divya Mani ,  Weihua Tang

IPC: H01L23/427 ,  H01L23/522 ,  H01L21/48 ,  H01L23/00

Abstract: An integrated circuit structure may be formed using a phase change material to substantially fill at least one chamber within the integrated circuit assembly to increase thermal capacitance. The integrated circuit assembly may comprise a substrate, at least one integrated circuit device electrically attached to the substrate, a heat dissipation device, a thermal interface material between the integrated circuit device and the heat dissipation device, a chamber defined by the heat dissipation device, the substrate, and the integrated circuit device, and a phase change material within the chamber.

公开(公告)号：US20200027844A1

公开(公告)日：2020-01-23

申请号：US16585052

申请日：2019-09-27

Applicant: Intel Corporation

Inventor： Dong-Ho Han ,  Jaejin Lee ,  Je-Young Chang ,  Jerrod Peterson ,  Mark Carbone

IPC: H01L23/552 ,  H01L23/498 ,  H01L23/367 ,  H01L21/48

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, a radiation source on the substrate, a ground on the substrate, where the ground is located around the radiation source, and a heat spreader over the radiation source, where the heat spreader includes one or more ground coupling mechanisms that are in contact with the ground on the substrate. The one or more ground coupling mechanisms in contact with the ground on the substrate create a radiation shield that at least partially keeps radiation from the radiation source from extending past the substrate.

公开(公告)号：US10228735B2

公开(公告)日：2019-03-12

申请号：US15637439

申请日：2017-06-29

Applicant: Intel Corporation

Inventor： Devdatta P. Kulkarni ,  Richard J. Dischler ,  Je-Young Chang

IPC: G06F1/20 ,  H01L21/02 ,  H01L23/367 ,  H01L23/495

Abstract: Methods of forming microelectronic package structures/modules, and structures formed thereby, are described. Structures formed herein may include a die disposed on a substrate; a cooling solution comprising a first surface and a second surface opposite the first surface, wherein the second surface is disposed on a backside of the die disposed on a package substrate. A lid comprising an outer surface is disposed on the first surface of the cooling solution, wherein the lid includes a plurality of fins disposed on an inner surface of the lid. A solder is disposed between the outer surface of the lid and the first surface of the cooling solution.

公开(公告)号：US11935808B2

公开(公告)日：2024-03-19

申请号：US16831078

申请日：2020-03-26

Applicant: Intel Corporation

Inventor： Debendra Mallik ,  Je-Young Chang ,  Ram Viswanath ,  Elah Bozorg-Grayeli ,  Ahmad Al Mohammad

IPC: H01L23/367 ,  H01L23/373 ,  H01L23/495

CPC classification number: H01L23/3672 ,  H01L23/373 ,  H01L23/49568

Abstract: Thermal heat spreaders and/or an IC die with solderable thermal structures may be assembled together with a solder array thermal interconnects. A thermal heat spreader may include a non-metallic material and one or more metallized surfaces suitable for bonding to a solder alloy employed as thermal interface material between the heat spreader and an IC die. An IC die may include a metallized back-side surface similarly suitable for bonding to a thermal interconnect comprising a solder alloy. Metallization on the IC die and/or heat spreader may comprise a plurality of solderable structures. A multi-chip package may include multiple IC die having different die thickness that are accommodated by a z-height thickness variation in the thermal interconnects and/or the solderable structures of the IC die or heat spreader.

公开(公告)号：US11830783B2

公开(公告)日：2023-11-28

申请号：US16600107

申请日：2019-10-11

Applicant: Intel Corporation

Inventor： Aastha Uppal ,  Divya Mani ,  Je-Young Chang

IPC: H01L23/367 ,  H01L25/065 ,  H01L23/433 ,  H01L25/00 ,  H01L23/10 ,  H01L21/48 ,  H01L23/373 ,  H01L25/16 ,  H01L23/498 ,  H01L23/31

CPC classification number: H01L23/367 ,  H01L21/4875 ,  H01L23/10 ,  H01L23/3736 ,  H01L23/433 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/165 ,  H01L25/50 ,  H01L23/3128 ,  H01L23/49816

Abstract: Embodiments include semiconductor packages. A semiconductor package include a high-power electronic component and an embedded heat spreader (EHS) in a package substrate. The EHS is adjacent to the high-power electronic component. The semiconductor package includes a plurality of thermal interconnects below the EHS and the package substrate, and a plurality of dies on the package substrate. The thermal interconnects is coupled to the EHS. The EHS is below the high-power electronic component and embedded within the package substrate. The high-power electronic component has a bottom surface substantially proximate to a top surface of the EHS. The EHS is a copper heat sink, and the high-power electronic component is an air core inductor or a voltage regulator. The thermal interconnects are comprised of thermal ball grid array balls or thermal adhesive materials. The thermal interconnects couple a bottom surface of the package substrate to a top surface of a substrate.

公开(公告)号：US11804418B2

公开(公告)日：2023-10-31

申请号：US16246311

申请日：2019-01-11

Applicant: Intel Corporation

Inventor： Nicholas Neal ,  Je-Young Chang ,  Jae Kim ,  Ravindranath Mahajan

IPC: H05K7/20 ,  H01L23/433 ,  F28F3/12 ,  F28F9/00 ,  H01L23/367 ,  H01L23/473 ,  F28F9/02 ,  F28D21/00

CPC classification number: H01L23/4336 ,  F28F3/12 ,  F28F9/001 ,  F28F9/0202 ,  H01L23/367 ,  H01L23/4735 ,  H05K7/20254 ,  F28D2021/0029 ,  F28F2260/02

Abstract: A heat exchange module, comprising an array of microchannels, where the array of microchannels extends in a first direction, and are separated from one another by a first sidewall. The array of microchannels is over a cold plate. A first array of fluid distribution channels is stacked over the array of microchannels and extend in a second direction that is substantially orthogonal to the first direction. The first array of fluid distribution channels extends from the first manifold and terminate between a first manifold and a second manifold. A second array of fluid distribution channels is stacked over the array of microchannels. The first array of fluid distribution channels and the second array of the fluid distribution channels are fluidically coupled to the microchannel array. A wall extends into the microchannel array below a second sidewall separating ones of the first array and ones of the second array of fluid distribution channels.