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公开(公告)号：US09586857B2
公开(公告)日：2017-03-07
申请号：US14700877
申请日：2015-04-30
Applicant: International Business Machines Corporation
Inventor： Cyril Cabral, Jr. , Fuad E. Doany , Gregory M. Fritz , Michael S. Gordon , Qiang Huang , Eric P. Lewandowski , Xiao Hu Liu , Kenneth P. Rodbell , Thomas M. Shaw
CPC classification number: C03C17/06 , C03B23/203 , C03C15/00 , C03C17/34 , C03C21/002 , C03C23/0055 , C03C27/06 , C03C2217/252 , C03C2217/261 , C03C2218/32 , C03C2218/328 , C03C2218/34 , G03F7/20
Abstract: A method of manufacturing a glass substrate to control the fragmentation characteristics by etching and filling trenches in the glass substrate is disclosed. An etching pattern may be determined. The etching pattern may outline where trenches will be etched into a surface of the glass substrate. The etching pattern may be configured so that the glass substrate, when fractured, has a smaller fragmentation size than chemically strengthened glass that has not been etched. A mask may be created in accordance with the etching pattern, and the mask may be applied to a surface of the glass substrate. The surface of the glass substrate may then be etched to create trenches. A filler material may be deposited into the trenches.
Abstract translation: 公开了通过蚀刻和填充玻璃衬底中的沟槽来制造玻璃衬底以控制碎裂特性的方法。 可以确定蚀刻图案。 蚀刻图案可以概括将沟槽蚀刻到玻璃基板的表面中的位置。 蚀刻图案可以被配置为使得玻璃基板在断裂时具有比未被蚀刻的化学强化玻璃更小的碎裂尺寸。 可以根据蚀刻图案形成掩模，并且可以将掩模施加到玻璃基板的表面。 然后可以蚀刻玻璃基板的表面以产生沟槽。 填充材料可以沉积到沟槽中。
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公开(公告)号：US20140205780A1
公开(公告)日：2014-07-24
申请号：US14013390
申请日：2013-08-29
Applicant: International Business Machines Corporation
Inventor： Michael A. Gaynes , Michael S. Gordon , Eric P. Lewandowski
CPC classification number: C09D5/24 , H01B1/20 , H01B1/22 , H01B1/24 , Y10T428/1372
Abstract: An electrically conductive paste providing low alpha particle emission is provided. A resin and conductive particles are mixed, and a curing agent is added. A solvent is subsequently added. The electrically conductive paste including a resin compound is formed by mixing the mixture in a high shear mixer. The electrically conductive paste can be applied to a surface of an article to form a coating, or can be molded into an article. The solvent is evaporated, and the electrically conductive paste is cured to provide a graphite-containing resin compound. The graphite-containing resin compound is electrically conductive, and provides low alpha particle emission at a level suitable for a low alpha particle emissivity coating.
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23.发明申请公开(公告)号：US20210159382A1
公开(公告)日：2021-05-27
申请号：US16698171
申请日：2019-11-27
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Jae-Woong Nah , Li-Wen Hung , Eric P. Lewandowski , Adinath S. Narasgond
Abstract: A quantum device includes a qubit chip having a plurality of qubits and an interposer attached to and electrically connected to the qubit chip. The device also includes a substrate handler attached to one side of the qubit chip or to one side of the interposer, or both so as to be thermally in contact with the qubit chip or the interposer, or both. The substrate handler includes a plurality of vias, at least a portion of plurality of vias being filled with a non-superconducting material, the non-superconducting material being selected to dissipate heat generated in the qubit chip, the interposer or both.
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公开(公告)号：US10608158B2
公开(公告)日：2020-03-31
申请号：US15721238
申请日：2017-09-29
Applicant: International Business Machines Corporation
Inventor： David W. Abraham , John M. Cotte , Eric P. Lewandowski
Abstract: A technique relates to a structure. An under-bump-metallization (UBM) structure includes a first region and a second region. The first and second regions are laterally positioned in the UBM structure. The first region includes a superconducting material. A substrate opposes the UBM structure. A superconducting solder material joins the first region to the substrate and the second region to the substrate.
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公开(公告)号：US10535592B2
公开(公告)日：2020-01-14
申请号：US15936014
申请日：2018-03-26
Applicant: International Business Machines Corporation
Inventor： Eric P. Lewandowski , Jae-Woong Nah , Peter J. Sorce
IPC: H01L23/498 , H01L21/48 , H01L21/027 , H01L21/3205 , H01L21/3213 , H05K3/06 , H05K3/12 , H05K3/34 , H05K3/40
Abstract: A barrier layer is formed over electrically conductive contact pads on a substrate such as a wafer. A photoresist layer is applied over the barrier layer, and openings in the photoresist layer are filled with solder to form solder bumps. The barrier layer may be removed from within the openings prior to filling the openings with solder. The process is applicable to fine pitch architectures and chip size packaging substrates. The photoresist layer and portions of the barrier layer outside of the openings are removed following solder fill.
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Patent Agency Ranking
公开(公告)号：US20190019997A1
公开(公告)日：2019-01-17
申请号：US16117892
申请日：2018-08-30
Applicant: International Business Machines Corporation
Inventor： Paul S. Andry , Gregory M. Fritz , Michael S. Gordon , Eric P. Lewandowski , Yu Luo
IPC: H01M2/02 , C25D1/04 , C25D1/22 , C25D5/02 , G02C7/08 , H01M4/38 , H01M4/42 , H01M4/48 , H01M4/50 , H01M4/66 , H01M10/04
Abstract: A battery, comprising a cathode comprising a cathode material in contact with a cathode current collector. The battery also comprises an electrolyte. The battery also comprises an anode comprising an electroplated homogeneous solid metallic alloy comprising 100 ppm to 1000 ppm Bi and 100 ppm to 1000 ppm In, and a remainder Zn.
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公开(公告)号：US20180218971A1
公开(公告)日：2018-08-02
申请号：US15936014
申请日：2018-03-26
Applicant: International Business Machines Corporation
Inventor： Eric P. Lewandowski , Jae-Woong Nah , Peter J. Sorce
IPC: H01L23/498 , H01L21/3205 , H05K3/12 , H05K3/06 , H01L21/027 , H01L21/48 , H01L21/3213
Abstract: A barrier layer is formed over electrically conductive contact pads on a substrate such as a wafer. A photoresist layer is applied over the barrier layer, and openings in the photoresist layer are filled with solder to form solder bumps. The barrier layer may be removed from within the openings prior to filling the openings with solder. The process is applicable to fine pitch architectures and chip size packaging substrates. The photoresist layer and portions of the barrier layer outside of the openings are removed following solder fill.
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公开(公告)号：US20180218970A1
公开(公告)日：2018-08-02
申请号：US15935984
申请日：2018-03-26
Applicant: International Business Machines Corporation
Inventor： Eric P. Lewandowski , Jae-Woong Nah , Peter J. Sorce
IPC: H01L23/498 , H01L21/3205 , H05K3/12 , H05K3/06 , H01L21/027 , H01L21/48 , H01L21/3213
CPC classification number: H01L23/49816 , H01L21/0273 , H01L21/32051 , H01L21/32133 , H01L21/4853 , H01L23/49838 , H01L23/49866 , H01L23/49894 , H01L2224/11 , H05K3/064 , H05K3/12 , H05K3/3457 , H05K3/4007 , H05K2203/04
Abstract: A barrier layer is formed over electrically conductive contact pads on a substrate such as a wafer. A photoresist layer is applied over the barrier layer, and openings in the photoresist layer are filled with solder to form solder bumps. The barrier layer may be removed from within the openings prior to filling the openings with solder. The process is applicable to fine pitch architectures and chip size packaging substrates. The photoresist layer and portions of the barrier layer outside of the openings are removed following solder fill.
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公开(公告)号：US20180040859A1
公开(公告)日：2018-02-08
申请号：US15789584
申请日：2017-10-20
Applicant: International Business Machines Corporation
Inventor： Paul S. Andry , Eric P. Lewandowski , Yu Luo , Adinath S. Narasgond
IPC: H01M2/02 , C25D1/22 , C25D5/02 , G02C7/08 , H01M10/04 , H01M4/42 , H01M4/48 , H01M4/50 , H01M4/66 , C25D1/04 , H01M4/38
CPC classification number: H01M2/0202 , A61B5/145 , A61B2562/028 , C25D1/04 , C25D1/22 , C25D3/22 , C25D3/54 , C25D3/56 , C25D3/565 , C25D5/02 , C25D5/10 , C25D5/50 , G02C7/083 , H01M4/139 , H01M4/38 , H01M4/42 , H01M4/48 , H01M4/50 , H01M4/661 , H01M4/664 , H01M10/0436 , H01M2002/0205 , H01M2004/027 , H01M2004/028 , Y10T29/49108 , Y10T29/49115
Abstract: A battery comprising an anode comprising anode material in contact with a metal anode current collector. The battery further comprises a cathode comprising cathode material in contact with a cathode current collector comprising a transparent conducting oxide (TCO). The battery further comprises an electrolyte with a pH in a range of 3 to 7.
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公开(公告)号：US09738560B2
公开(公告)日：2017-08-22
申请号：US15163260
申请日：2016-05-24
Applicant: International Business Machines Corporation
Inventor： Cyril Cabral, Jr. , Fuad E. Doany , Gregory M. Fritz , Michael S. Gordon , Qiang Huang , Eric P. Lewandowski , Xiao Hu Liu , Kenneth P. Rodbell , Thomas M. Shaw
CPC classification number: C03C17/06 , C03B23/203 , C03C15/00 , C03C17/34 , C03C21/002 , C03C23/0055 , C03C27/06 , C03C2217/252 , C03C2217/261 , C03C2218/32 , C03C2218/328 , C03C2218/34 , G03F7/20
Abstract: A method of manufacturing a glass substrate to control the fragmentation characteristics by etching and filling trenches in the glass substrate is disclosed. An etching pattern may be determined. The etching pattern may outline where trenches will be etched into a surface of the glass substrate. The etching pattern may be configured so that the glass substrate, when fractured, has a smaller fragmentation size than chemically strengthened glass that has not been etched. A mask may be created in accordance with the etching pattern, and the mask may be applied to a surface of the glass substrate. The surface of the glass substrate may then be etched to create trenches. A filler material may be deposited into the trenches.
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