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    Ground-based heat sink facilitating electronic system cooling
    21.
    发明授权
    Ground-based heat sink facilitating electronic system cooling 有权
    地面散热器，便于电子系统冷却

    公开(公告)号：US09363924B2

    公开(公告)日：2016-06-07

    申请号：US13780538

    申请日：2013-02-28

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC: F28D15/06 ,  H05K7/20 ,  F24J3/08 ,  F28D15/02

    CPC classification number: H05K7/2039 ,  F24T10/30 ,  F28D15/0266 ,  F28D15/0275 ,  H05K7/20827 ,  Y02E10/10 ,  Y02E10/16

    Abstract: Cooling methods are provided which include providing a heat sink having a housing with a compartment, a coolant inlet, and a coolant outlet. The housing is configured for a coolant to flow from the coolant inlet through the compartment to the coolant outlet, wherein the coolant is transferring heat extracted from one or more electronic components. The heat sink further includes one or more heat pipes having a first portion disposed within the compartment of the housing and a second portion disposed outside the housing. The heat pipe(s) is configured to extract heat from the coolant flowing through the compartment, and to transfer the extracted heat to the second portion disposed outside the housing. The second portion outside the housing is disposed to facilitate conducting the extracted heat into the ground.

    Abstract translation: 提供了冷却方法，其包括提供散热器，该散热器具有带有隔室的壳体，冷却剂入口和冷却剂出口。 壳体构造成用于使冷却剂从冷却剂入口通过隔室流到冷却剂出口，其中冷却剂传送从一个或多个电子部件提取的热量。 散热器还包括一个或多个热管，其具有设置在壳体的隔室内的第一部分和设置在壳体外部的第二部分。 热管被配置为从流过隔室的冷却剂中提取热量，并且将提取的热量传送到设置在壳体外部的第二部分。 壳体外部的第二部分设置成便于将提取的热量导入地面。

    Cooling system with automated seasonal freeze protection
    22.
    发明授权
    Cooling system with automated seasonal freeze protection 有权
    具有自动季节性冻结保护的冷却系统

    公开(公告)号：US09351431B2

    公开(公告)日：2016-05-24

    申请号：US13649334

    申请日：2012-10-11

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons ,  Prabjit Singh ,  Jing Zhang

    IPC: F28F13/00 ,  H05K7/20

    CPC classification number: H05K7/20836 ,  F28F2265/14

    Abstract: An automated multi-fluid cooling system and method are provided for cooling an electronic component(s). The cooling system includes a coolant loop, a coolant tank, multiple valves, and a controller. The coolant loop is at least partially exposed to outdoor ambient air temperature(s) during normal operation, and the coolant tank includes first and second reservoirs containing first and second fluids, respectively. The first fluid freezes at a lower temperature than the second, the second fluid has superior cooling properties compared with the first, and the two fluids are soluble. The multiple valves are controllable to selectively couple the first or second fluid into the coolant in the coolant loop, wherein the coolant includes at least the second fluid. The controller automatically controls the valves to vary first fluid concentration level in the coolant loop based on historical, current, or anticipated outdoor air ambient temperature(s) for a time of year.

    Abstract translation: 提供了一种用于冷却电子部件的自动多流体冷却系统和方法。 冷却系统包括冷却剂回路，冷却剂箱，多个阀和控制器。 在正常操作期间，冷却剂回路至少部分地暴露于室外环境空气温度，并且冷却剂箱分别包括容纳第一和第二流体的第一和第二储存器。 第一流体在比第二流体低的温度下冻结，第二流体与第一流体相比具有优异的冷却性能，并且两种流体是可溶的。 多个阀是可控制的，以选择性地将第一或第二流体耦合到冷却剂回路中的冷却剂中，其中冷却剂至少包括第二流体。 控制器根据一年中的历史，当前或预期的室外空气环境温度，自动控制阀门改变冷却剂回路中的第一个液体浓度水平。

    Coolant-conditioning unit with automated control of coolant flow valves
    23.
    发明授权
    Coolant-conditioning unit with automated control of coolant flow valves 有权
    具有自动控制冷却剂流量阀的冷却液调节装置

    公开(公告)号：US09253921B2

    公开(公告)日：2016-02-02

    申请号：US13782003

    申请日：2013-03-01

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC: G05D23/00 ,  H05K7/20

    CPC classification number: H05K7/20281 ,  F28F27/02 ,  H05K7/20781 ,  H05K7/20836

    Abstract: A method is provided which includes providing a coolant-conditioning unit which includes a facility coolant path, having a facility coolant flow control valve, and a system coolant path accommodating a system coolant, and having a bypass line with a system coolant bypass valve. A heat exchanger is coupled to the facility and system coolant paths to facilitate transfer of heat from the system coolant to facility coolant in the facility coolant path, and the bypass line is disposed in the system coolant path in parallel with the heat exchanger. A controller automatically controls a regulation position of the coolant bypass valve and a regulation position of the facility coolant flow control valve based on a temperature of the system coolant, and automatically adjusts the regulation position of the system coolant bypass valve to facilitate maintaining the facility coolant flow control valve at or above a specified, partially open, minimum regulation position.

    Abstract translation: 提供一种方法，其包括提供冷却剂调节单元，该冷却剂调节单元包括具有设备冷却剂流量控制阀的设备冷却剂通道和容纳系统冷却剂的系统冷却剂通道，并且具有与系统冷却剂旁通阀的旁路管路。 热交换器被耦合到设备和系统冷却剂路径，以便于将热量从系统冷却剂传送到设备冷却剂路径中的设备冷却剂，并且旁路管线与热交换器平行地设置在系统冷却剂路径中。 控制器基于系统冷却液的温度自动控制冷却剂旁通阀的调节位置和设备冷却剂流量控制阀的调节位置，并且自动调节系统冷却剂旁通阀的调节位置以便于维持设备冷却剂 流量控制阀处于或高于指定的，部分打开的最小调节位置。

    Separate control of coolant flow through coolant circuits
    25.
    发明授权
    Separate control of coolant flow through coolant circuits 有权
    通过冷却剂回路分离冷却剂流量

    公开(公告)号：US09148982B2

    公开(公告)日：2015-09-29

    申请号：US13671887

    申请日：2012-11-08

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC: G06F19/00 ,  H05K7/20 ,  G05D23/19 ,  G06F1/20

    CPC classification number: H05K7/2079 ,  G05D23/1934 ,  G06F1/206 ,  H05K7/20836

    Abstract: Methods and coolant distribution systems are provided for automated coolant flow control for, for instance, facilitating cooling of multiple different electronic systems. The methods include, for instance, automatically controlling coolant flow to a plurality of coolant circuits, and for a coolant circuit i of the coolant circuits: automatically determining the heat load transferred to coolant flowing through coolant circuit i, and automatically controlling coolant flow through coolant circuit i based on the determined heat load transferred to the coolant. The different coolant circuits may have the same or different coolant flow impedances, and flow through the different coolant circuits may be controlled using different heat load-to-coolant ranges for the different circuits.

    Abstract translation: 方法和冷却剂分配系统被提供用于自动冷却剂流控制，例如，促进多个不同电子系统的冷却。 这些方法包括例如自动控制冷却剂流到多个冷却剂回路，以及冷却剂回路的冷却剂回路i：自动确定传递到冷却剂回路i中的冷却剂的热负荷，并自动控制冷却剂流过冷却剂 电路i基于传输到冷却剂的确定的热负荷。 不同的冷却剂回路可以具有相同或不同的冷却剂流动阻抗，并且可以使用用于不同回路的不同热负荷 - 冷却剂范围来控制通过不同冷却剂回路的流量。

    Sectioned manifolds facilitating pumped immersion-cooling of electronic components
    28.
    发明授权
    Sectioned manifolds facilitating pumped immersion-cooling of electronic components 有权
    有助于泵送浸入式冷却电子部件的分段式歧管

    公开(公告)号：US08964390B2

    公开(公告)日：2015-02-24

    申请号：US13671802

    申请日：2012-11-08

    Applicant: International Business Machines Corporation

    Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC: H05K7/20 ,  F28D15/00 ,  F28F27/00 ,  F28F9/00 ,  B23P15/26

    CPC classification number: B23P15/26 ,  F28D15/02 ,  F28F3/048 ,  F28F3/12 ,  F28F2250/06 ,  H05K7/20809 ,  Y10T29/4935

    Abstract: Cooling apparatuses and methods are provided for facilitating pumped immersion-cooling of electronic components. The cooling apparatus includes a housing forming a compartment about one or more components, a supply manifold, a return manifold, and a coolant loop coupling in fluid communication the supply and return manifolds and the housing. Coolant flowing through the coolant loop flows through the compartment of the housing and at least partially immersion-cools the component(s) by flow boiling. A pump facilitates circulation of coolant within the loop, and a coolant bypass line is coupled between the supply and return manifolds. The return manifold includes a mixed-phase manifold section, and the bypass line provides coolant from the supply manifold directly to the mixed-phase manifold section. Coolant flows from the coolant bypass line into the mixed-phase manifold section in a direction counter to the direction of any coolant vapor flow within that manifold section.

    Abstract translation: 提供冷却装置和方法以便于电子部件的抽吸浸没冷却。 冷却装置包括围绕一个或多个部件形成隔室的壳体，供应歧管，回流歧管以及使供应和返回歧管与壳体流体连通的冷却剂回路联接器。 流过冷却剂回路的冷却剂流过壳体的隔室，并且至少部分地通过流动沸腾来浸没组件。 泵有利于循环内的冷却剂循环，并且冷却剂旁通管线连接在供应和返回歧管之间。 回流歧管包括混合相歧管部分，并且旁路管线将冷却剂从供应歧管直接提供给混合相歧管部分。 冷却剂从冷却剂旁通管路流向与该歧管部分内任何冷却剂蒸气流的方向相反的方向流入混合相歧管部分。

    Multi-rack assembly with shared cooling apparatus
    29.
    发明授权
    Multi-rack assembly with shared cooling apparatus 有权
    带共用冷却装置的多机架组件

    公开(公告)号：US08817465B2

    公开(公告)日：2014-08-26

    申请号：US13684736

    申请日：2012-11-26

    Applicant: International Business Machines Corporation

    Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth ,  Madhusudan K. Iyengar ,  Robert E. Simons

    IPC: H05K5/00

    CPC classification number: H05K7/20709 ,  H05K7/20781

    Abstract: A method is provided which includes providing a multi-rack assembly having adjacent first and second electronics racks, each being at least partially air-cooled, and an air-to-liquid heat exchanger associated with the first rack for cooling at least a portion of air passing through the first rack. The heat exchanger, which is disposed at the air inlet or air outlet side of the first rack and is coupled in fluid communication with a coolant loop to receive coolant from the loop and exhaust coolant to the loop, transfers heat from air passing thereacross to coolant passing therethrough. The assembly also includes a cooling unit, associated with the first rack and cooling coolant in the coolant loop, and an airflow director associated with the second rack and facilitating ducting at least a portion of air passing through the second rack to also pass across the heat exchanger associated with the first rack.

    Abstract translation: 提供了一种方法，其包括提供具有相邻的第一和第二电子机架的多齿条组件，每个电子机架至少部分地被空气冷却，以及与第一齿条相关联的空气与液体热交换器，用于冷却至少一部分 空气通过第一个机架。 该热交换器设置在第一齿条的空气入口或空气出口侧，并且与冷却剂回路流体连通地连接以接收来自回路的冷却剂并将冷却剂排出到回路，将来自经过其的空气的热量传递给冷却剂 通过 组件还包括与第一齿条相关联的冷却单元和冷却剂回路中的冷却冷却剂，以及与第二齿条相关联的气流引导件，并且便于管道通过第二齿条的至少一部分空气也穿过热 交换机与第一个机架相关联。

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