公开(公告)号：US20160079360A1

公开(公告)日：2016-03-17

申请号：US14948039

申请日：2015-11-20

申请人： Stephen M. Cea ,  Seiyon Kim ,  Annalisa Cappellani

发明人： Stephen M. Cea ,  Seiyon Kim ,  Annalisa Cappellani

IPC分类号： H01L29/06 ,  H01L29/16 ,  H01L21/02 ,  H01L29/10 ,  H01L29/78 ,  H01L29/66 ,  H01L29/423 ,  H01L29/161

CPC分类号： H01L29/1054 ,  H01L21/02532 ,  H01L21/02603 ,  H01L21/823807 ,  H01L27/092 ,  H01L29/0669 ,  H01L29/0673 ,  H01L29/1033 ,  H01L29/16 ,  H01L29/161 ,  H01L29/42392 ,  H01L29/66439 ,  H01L29/66742 ,  H01L29/66795 ,  H01L29/775 ,  H01L29/785 ,  H01L29/78618 ,  H01L29/78651 ,  H01L29/78684 ,  H01L29/78696

摘要： Uniaxially strained nanowire structures are described. For example, a semiconductor device includes a plurality of vertically stacked uniaxially strained nanowires disposed above a substrate. Each of the uniaxially strained nanowires includes a discrete channel region disposed in the uniaxially strained nanowire. The discrete channel region has a current flow direction along the direction of the uniaxial strain. Source and drain regions are disposed in the nanowire, on either side of the discrete channel region. A gate electrode stack completely surrounds the discrete channel regions.

摘要翻译： 描述了单轴应变纳米线结构。 例如，半导体器件包括设置在衬底上方的多个垂直堆叠的单轴应变纳米线。 单轴应变纳米线中的每一个包括设置在单轴应变纳米线中的离散通道区域。 离散通道区域沿着单轴应变的方向具有电流流动方向。 源极和漏极区域设置在离散通道区域的任一侧上的纳米线中。 栅极电极堆叠完全围绕离散通道区域。

公开(公告)号：US20150318219A1

公开(公告)日：2015-11-05

申请号：US14266643

申请日：2014-04-30

申请人： Annalisa Cappellani ,  Abhijit Jayant Pethe ,  Tahir Ghani ,  Harry Gomez

发明人： Annalisa Cappellani ,  Abhijit Jayant Pethe ,  Tahir Ghani ,  Harry Gomez

IPC分类号： H01L21/84 ,  H01L29/423 ,  H01L29/06 ,  H01L29/08 ,  H01L21/306 ,  H01L29/66

CPC分类号： H01L29/42392 ,  B82Y10/00 ,  H01L21/30604 ,  H01L21/845 ,  H01L29/0649 ,  H01L29/0673 ,  H01L29/0847 ,  H01L29/401 ,  H01L29/41725 ,  H01L29/42356 ,  H01L29/66439 ,  H01L29/66545 ,  H01L29/775 ,  H01L29/7848 ,  H01L29/785 ,  H01L29/78696

摘要： Strained gate-all-around semiconductor devices formed on globally or locally isolated substrates are described. For example, a semiconductor device includes a semiconductor substrate. An insulating structure is disposed above the semiconductor substrate. A three-dimensional channel region is disposed above the insulating structure. Source and drain regions are disposed on either side of the three-dimensional channel region and on an epitaxial seed layer. The epitaxial seed layer is composed of a semiconductor material different from the three-dimensional channel region and disposed on the insulating structure. A gate electrode stack surrounds the three-dimensional channel region with a portion disposed on the insulating structure and laterally adjacent to the epitaxial seed layer.

摘要翻译： 描述了形成在全局或局部隔离的基板上的应变门全面半导体器件。 例如，半导体器件包括半导体衬底。 绝缘结构设置在半导体衬底之上。 三维沟道区设置在绝缘结构的上方。 源极和漏极区域设置在三维沟道区域的两侧和外延晶种层上。 外延种子层由不同于三维沟道区的半导体材料构成，并且设置在绝缘结构上。 栅极电极堆叠围绕三维沟道区域，其中设置在绝缘结构上并且横向邻近外延籽晶层的部分。

公开(公告)号：US20140077305A1

公开(公告)日：2014-03-20

申请号：US13622974

申请日：2012-09-19

申请人： Abhijit Jayant Pethe ,  Tahir Ghani ,  Mark Bohr ,  Clair Webb ,  Harry Gomez ,  Annalisa Cappellani

发明人： Abhijit Jayant Pethe ,  Tahir Ghani ,  Mark Bohr ,  Clair Webb ,  Harry Gomez ,  Annalisa Cappellani

IPC分类号： H01L29/78 ,  H01L21/336

CPC分类号： H01L21/76897 ,  H01L21/28008 ,  H01L21/31111 ,  H01L21/76807 ,  H01L21/76834 ,  H01L21/76895 ,  H01L23/5226 ,  H01L23/53257 ,  H01L29/66545 ,  H01L29/66583 ,  H01L29/785

摘要： Gate contact structures disposed over active portions of gates and methods of forming such gate contact structures are described. For example, a semiconductor structure includes a substrate having an active region and an isolation region. A gate structure has a portion disposed above the active region and a portion disposed above the isolation region of the substrate. Source and drain regions are disposed in the active region of the substrate, on either side of the portion of the gate structure disposed above the active region. A gate contact structure is disposed on the portion of the gate structure disposed above the active region of the substrate.

摘要翻译： 描述了设置在门的有效部分上的栅极接触结构以及形成这种栅极接触结构的方法。 例如，半导体结构包括具有有源区和隔离区的衬底。 栅极结构具有设置在有源区上方的部分和设置在衬底的隔离区上方的部分。 源极和漏极区域设置在衬底的有源区域中，位于栅极结构的位于有源区域之上的部分的任一侧上。 栅极接触结构设置在栅极结构的设置在衬底的有源区上方的部分上。

公开(公告)号：US20140001560A1

公开(公告)日：2014-01-02

申请号：US13538822

申请日：2012-06-29

申请人： Annalisa Cappellani ,  Kelin J. Kuhn ,  Rafael Rios ,  Harry Gomez

发明人： Annalisa Cappellani ,  Kelin J. Kuhn ,  Rafael Rios ,  Harry Gomez

IPC分类号： H01L27/088 ,  H01L21/76

CPC分类号： H01L21/76237 ,  H01L21/76232 ,  H01L27/088 ,  H01L27/1207 ,  H01L29/0638 ,  H01L29/0653 ,  H01L29/7851

摘要： Isolated and bulk semiconductor devices formed on a same bulk substrate and methods to form such devices are described. For example, a semiconductor structure includes a first semiconductor device having a first semiconductor body disposed on a bulk substrate. The first semiconductor body has an uppermost surface with a first horizontal plane. The semiconductor structure also includes a second semiconductor device having a second semiconductor body disposed on an isolation pedestal. The isolation pedestal is disposed on the bulk substrate. The second semiconductor body has an uppermost surface with a second horizontal plane. The first and second horizontal planes are co-planar.

摘要翻译： 描述了形成在相同体积基板上的隔离和体半导体器件以及形成这种器件的方法。 例如，半导体结构包括具有设置在体基板上的第一半导体本体的第一半导体器件。 第一半导体本体具有带有第一水平面的最上表面。 半导体结构还包括具有设置在隔离基座上的第二半导体本体的第二半导体器件。 隔离基座设置在主体基板上。 第二半导体本体具有带有第二水平面的最上表面。 第一和第二水平面是共面的。

公开(公告)号：US20170047416A1

公开(公告)日：2017-02-16

申请号：US15335281

申请日：2016-10-26

申请人： Annalisa Cappellani ,  Abhijit Jayant Pethe ,  Tahir Ghani ,  Harry Gomez

发明人： Annalisa Cappellani ,  Abhijit Jayant Pethe ,  Tahir Ghani ,  Harry Gomez

IPC分类号： H01L29/423 ,  H01L29/786 ,  H01L29/06 ,  H01L29/78

CPC分类号： H01L29/42392 ,  B82Y10/00 ,  H01L21/30604 ,  H01L21/845 ,  H01L29/0649 ,  H01L29/0673 ,  H01L29/0847 ,  H01L29/401 ,  H01L29/41725 ,  H01L29/42356 ,  H01L29/66439 ,  H01L29/66545 ,  H01L29/775 ,  H01L29/7848 ,  H01L29/785 ,  H01L29/78696

摘要： Strained gate-all-around semiconductor devices formed on globally or locally isolated substrates are described. For example, a semiconductor device includes a semiconductor substrate. An insulating structure is disposed above the semiconductor substrate. A three-dimensional channel region is disposed above the insulating structure. Source and drain regions are disposed on either side of the three-dimensional channel region and on an epitaxial seed layer. The epitaxial seed layer is composed of a semiconductor material different from the three-dimensional channel region and disposed on the insulating structure. A gate electrode stack surrounds the three-dimensional channel region with a portion disposed on the insulating structure and laterally adjacent to the epitaxial seed layer.

摘要翻译： 描述了形成在全局或局部隔离的基板上的应变门全面半导体器件。 例如，半导体器件包括半导体衬底。 绝缘结构设置在半导体衬底之上。 三维沟道区设置在绝缘结构的上方。 源极和漏极区域设置在三维沟道区域的两侧和外延晶种层上。 外延种子层由不同于三维沟道区的半导体材料构成，并且设置在绝缘结构上。 栅极电极堆叠围绕三维沟道区域，其中设置在绝缘结构上并且横向邻近外延籽晶层的部分。

公开(公告)号：US20170004998A1

公开(公告)日：2017-01-05

申请号：US15266819

申请日：2016-09-15

申请人： Abhijit Jayant Pethe ,  Tahir Ghani ,  Mark Bohr ,  Clair Webb ,  Harry Gomez ,  Annalisa Cappellani

发明人： Abhijit Jayant Pethe ,  Tahir Ghani ,  Mark Bohr ,  Clair Webb ,  Harry Gomez ,  Annalisa Cappellani

IPC分类号： H01L21/768 ,  H01L23/532 ,  H01L21/28 ,  H01L23/522 ,  H01L29/66 ,  H01L21/311

CPC分类号： H01L21/76897 ,  H01L21/28008 ,  H01L21/31111 ,  H01L21/76807 ,  H01L21/76834 ,  H01L21/76895 ,  H01L23/5226 ,  H01L23/53257 ,  H01L29/66545 ,  H01L29/66583 ,  H01L29/785

摘要： Gate contact structures disposed over active portions of gates and methods of forming such gate contact structures are described. For example, a semiconductor structure includes a substrate having an active region and an isolation region. A gate structure has a portion disposed above the active region and a portion disposed above the isolation region of the substrate. Source and drain regions are disposed in the active region of the substrate, on either side of the portion of the gate structure disposed above the active region. A gate contact structure is disposed on the portion of the gate structure disposed above the active region of the substrate.

摘要翻译： 描述了设置在门的有效部分上的栅极接触结构以及形成这种栅极接触结构的方法。 例如，半导体结构包括具有有源区和隔离区的衬底。 栅极结构具有设置在有源区上方的部分和设置在衬底的隔离区上方的部分。 源极和漏极区域设置在衬底的有源区域中，位于栅极结构的位于有源区域之上的部分的任一侧上。 栅极接触结构设置在栅极结构的设置在衬底的有源区上方的部分上。

公开(公告)号：US09224808B2

公开(公告)日：2015-12-29

申请号：US13995913

申请日：2011-12-23

申请人： Stephen M. Cea ,  Seiyon Kim ,  Annalisa Cappellani

发明人： Stephen M. Cea ,  Seiyon Kim ,  Annalisa Cappellani

IPC分类号： H01L29/06 ,  H01L29/423 ,  H01L29/786 ,  H01L29/66 ,  H01L29/775

CPC分类号： H01L29/1054 ,  H01L21/02532 ,  H01L21/02603 ,  H01L21/823807 ,  H01L27/092 ,  H01L29/0669 ,  H01L29/0673 ,  H01L29/1033 ,  H01L29/16 ,  H01L29/161 ,  H01L29/42392 ,  H01L29/66439 ,  H01L29/66742 ,  H01L29/66795 ,  H01L29/775 ,  H01L29/785 ,  H01L29/78618 ,  H01L29/78651 ,  H01L29/78684 ,  H01L29/78696

摘要： Uniaxially strained nanowire structures are described. For example, a semiconductor device includes a plurality of vertically stacked uniaxially strained nanowires disposed above a substrate. Each of the uniaxially strained nanowires includes a discrete channel region disposed in the uniaxially strained nanowire. The discrete channel region has a current flow direction along the direction of the uniaxial strain. Source and drain regions are disposed in the nanowire, on either side of the discrete channel region. A gate electrode stack completely surrounds the discrete channel regions.

摘要翻译： 描述了单轴应变纳米线结构。 例如，半导体器件包括设置在衬底上方的多个垂直堆叠的单轴应变纳米线。 单轴应变纳米线中的每一个包括设置在单轴应变纳米线中的离散通道区域。 离散通道区域沿着单轴应变的方向具有电流流动方向。 源极和漏极区域设置在离散通道区域的任一侧上的纳米线中。 栅极电极堆叠完全围绕离散通道区域。

公开(公告)号：US20150255280A1

公开(公告)日：2015-09-10

申请号：US14720820

申请日：2015-05-24

申请人： Annalisa Cappellani ,  Pragyansri Pathi ,  Bruce E. Beattie ,  Abhijit Jayant Pethe

发明人： Annalisa Cappellani ,  Pragyansri Pathi ,  Bruce E. Beattie ,  Abhijit Jayant Pethe

IPC分类号： H01L21/02 ,  H01L21/768 ,  H01L21/762 ,  H01L29/66

CPC分类号： H01L29/0676 ,  B82Y10/00 ,  H01L21/02532 ,  H01L21/76264 ,  H01L21/76895 ,  H01L23/535 ,  H01L29/0649 ,  H01L29/0673 ,  H01L29/1079 ,  H01L29/42376 ,  H01L29/42392 ,  H01L29/66439 ,  H01L29/66545 ,  H01L29/66795 ,  H01L29/775 ,  H01L29/785 ,  H01L29/786 ,  H01L29/78696 ,  H01L2029/7858

摘要： Three-dimensional germanium-based semiconductor devices formed on globally or locally isolated substrates are described. For example, a semiconductor device includes a semiconductor substrate. An insulating structure is disposed above the semiconductor substrate. A three-dimensional germanium-containing body is disposed on a semiconductor release layer disposed on the insulating structure. The three-dimensional germanium-containing body includes a channel region and source/drain regions on either side of the channel region. The semiconductor release layer is under the source/drain regions but not under the channel region. The semiconductor release layer is composed of a semiconductor material different from the three-dimensional germanium-containing body. A gate electrode stack surrounds the channel region with a portion disposed on the insulating structure and laterally adjacent to the semiconductor release layer.

摘要翻译： 描述了形成在全局或局部隔离的基板上的三维锗基半导体器件。 例如，半导体器件包括半导体衬底。 绝缘结构设置在半导体衬底之上。 将三维含锗体设置在设置在绝缘结构上的半导体释放层上。 三维含锗体包括沟道区和沟道区两侧的源极/漏极区。 半导体释放层位于源极/漏极区之下，但不在沟道区下方。 半导体释放层由与三维含锗体不同的半导体材料构成。 栅极电极堆叠围绕沟道区域，其中设置在绝缘结构上并且横向邻近半导体释放层的部分。

公开(公告)号：US20140285980A1

公开(公告)日：2014-09-25

申请号：US13976068

申请日：2012-04-13

申请人： Annalisa Cappellani ,  Van H. Le ,  Glenn A. Glass ,  Kelin J. Kuhn ,  Stephen M. Cea

发明人： Annalisa Cappellani ,  Van H. Le ,  Glenn A. Glass ,  Kelin J. Kuhn ,  Stephen M. Cea

IPC分类号： H01L29/06 ,  H01L21/02 ,  H05K1/18

CPC分类号： H01L29/66795 ,  H01L21/02233 ,  H01L21/02236 ,  H01L21/02238 ,  H01L21/02241 ,  H01L21/02255 ,  H01L21/02304 ,  H01L21/02439 ,  H01L21/0245 ,  H01L21/02455 ,  H01L21/02488 ,  H01L21/02532 ,  H01L21/306 ,  H01L21/76 ,  H01L21/7624 ,  H01L21/76283 ,  H01L29/0603 ,  H01L29/0642 ,  H01L29/0653 ,  H01L29/0657 ,  H01L29/1054 ,  H01L29/7378 ,  H01L29/785 ,  H01L33/12 ,  H05K1/18

摘要： Techniques are disclosed for converting a strain-inducing semiconductor buffer layer into an electrical insulator at one or more locations of the buffer layer, thereby allowing an above device layer to have a number of benefits, which in some embodiments include those that arise from being grown on a strain-inducing buffer and having a buried electrical insulator layer. For instance, having a buried electrical insulator layer (initially used as a strain-inducing buffer during fabrication of the above active device layer) between the Fin and substrate of a non-planar integrated transistor circuit may simultaneously enable a low-doped Fin with high mobility, desirable device electrostatics and elimination or otherwise reduction of substrate junction leakage. Also, the presence of such an electrical insulator under the source and drain regions may further significantly reduce junction leakage. In some embodiments, substantially the entire buffer layer is converted to an electrical insulator.

摘要翻译： 公开了用于将应变诱导半导体缓冲层转化为缓冲层的一个或多个位置处的电绝缘体的技术，从而允许上述器件层具有许多益处，其在一些实施例中包括由于生长而产生的那些 在应变诱导缓冲器上并具有埋入的电绝缘体层。 例如，在非平面集成晶体管电路的Fin和衬底之间具有埋入的电绝缘体层（最初用作制造上述有源器件层期间的应变诱导缓冲器）可以同时使得具有高的低掺杂Fin 移动性，期望的器件静电，以及消除或以其他方式减少衬底结泄漏。 此外，源极和漏极区域下的这种电绝缘体的存在可以进一步显着减少结漏电。 在一些实施例中，基本上整个缓冲层被转换成电绝缘体。

公开(公告)号：US08753942B2

公开(公告)日：2014-06-17

申请号：US12958179

申请日：2010-12-01

申请人： Kelin J. Kuhn ,  Seiyon Kim ,  Rafael Rios ,  Stephen M. Cea ,  Martin D. Giles ,  Annalisa Cappellani ,  Titash Rakshit ,  Peter Chang ,  Willy Rachmady

发明人： Kelin J. Kuhn ,  Seiyon Kim ,  Rafael Rios ,  Stephen M. Cea ,  Martin D. Giles ,  Annalisa Cappellani ,  Titash Rakshit ,  Peter Chang ,  Willy Rachmady

IPC分类号： H01L29/775 ,  H01L29/66 ,  H01L21/336 ,  H01L21/762 ,  H01L29/772 ,  B82Y40/00

CPC分类号： H01L29/0673 ,  B82Y10/00 ,  H01L21/76224 ,  H01L27/0922 ,  H01L27/1203 ,  H01L29/0676 ,  H01L29/1033 ,  H01L29/16 ,  H01L29/165 ,  H01L29/41733 ,  H01L29/42392 ,  H01L29/66439 ,  H01L29/66742 ,  H01L29/66795 ,  H01L29/775 ,  H01L29/7848 ,  H01L29/785 ,  H01L29/78618 ,  H01L29/78654 ,  H01L29/78684 ,  H01L29/78696

摘要： Methods of forming microelectronic structures are described. Embodiments of those methods include forming a nanowire device comprising a substrate comprising source/drain structures adjacent to spacers, and nanowire channel structures disposed between the spacers, wherein the nanowire channel structures are vertically stacked above each other.

摘要翻译： 描述形成微电子结构的方法。 这些方法的实施例包括形成纳米线装置，其包括基板，该基板包括与间隔物相邻的源极/漏极结构，以及设置在间隔物之间​​的纳米线通道结构，其中纳米线通道结构在彼此之上垂直堆叠。