公开(公告)号：US07622364B2

公开(公告)日：2009-11-24

申请号：US11465622

申请日：2006-08-18

Applicant: James W. Adkisson ,  Jeffrey P. Gambino ,  Mark D. Jaffe ,  Richard J. Rassel

Inventor： James W. Adkisson ,  Jeffrey P. Gambino ,  Mark D. Jaffe ,  Richard J. Rassel

IPC: H01L21/00

CPC classification number: H01L24/05 ,  H01L23/3114 ,  H01L23/485 ,  H01L23/562 ,  H01L23/585 ,  H01L24/03 ,  H01L2224/05553 ,  H01L2224/0558 ,  H01L2224/05624 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An electronic packaging having at least one bond pad positioned on a chip for effectuating through-wafer connections to an integrated circuit. The electronic package is equipped with an edge seal between the bond pad region and an active circuit region, and includes a crack stop, which is adapted to protect the arrangement from the entry of deleterious moisture and combination into the active regions of the chip containing the bond pads.

Abstract translation: 一种电子封装，其具有位于芯片上的至少一个接合焊盘，用于实现与集成电路的晶圆连接。 电子封装在接合焊盘区域和有源电路区域之间配备有边缘密封，并且包括裂缝停止件，其适于保护布置免受有害水分和组合进入含有 接合垫

公开(公告)号：US07620931B2

公开(公告)日：2009-11-17

申请号：US11859890

申请日：2007-09-24

Applicant: James W. Adkisson ,  Greg Bazan ,  John M. Cohn ,  Matthew S. Grady ,  Thomas G. Sopchak ,  David P. Vallett

Inventor： James W. Adkisson ,  Greg Bazan ,  John M. Cohn ,  Matthew S. Grady ,  Thomas G. Sopchak ,  David P. Vallett

IPC: G06F17/50

CPC classification number: H01L22/20 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An integrated circuit, a method and a system for designing and a method fabricating the integrated circuit. The method including: (a) generating a photomask level design of an integrated circuit design of the integrated circuit, the photomask level design comprising a multiplicity of integrated circuit element shapes; (b) designating regions of the photomask level design between adjacent integrated circuit element shapes, the designated regions large enough to require placement of fill shapes between the adjacent integrated circuit elements based on fill shape rules, the fill shapes not required for the operation of the integrated circuit; and (c) placing one or more monitor structure shapes of a monitor structure in at least one of the designated regions, the monitor structure not required for the operation of the integrated circuit.

Abstract translation: 一种用于设计的集成电路，方法和系统以及制造集成电路的方法。 该方法包括：（a）生成集成电路的集成电路设计的光掩模级设计，光掩模级设计包括多个集成电路元件形状; （b）指定相邻集成电路元件形状之间的光掩模级设计的区域，指定区域足够大以至于基于填充形状规则需要在相邻集成电路元件之间放置填充形状， 集成电路; 以及（c）将监视器结构的一个或多个监视器结构形状放置在指定区域中的至少一个中，该集成电路的操作不需要监视器结构。

公开(公告)号：US20090180010A1

公开(公告)日：2009-07-16

申请号：US12013826

申请日：2008-01-14

Applicant: James W. Adkisson ,  Andres Bryant ,  John J. Ellis-Monaghan

Inventor： James W. Adkisson ,  Andres Bryant ,  John J. Ellis-Monaghan

IPC: H04N3/14 ,  H01L31/18

CPC classification number: H01L31/103 ,  H04N5/353 ,  H04N5/374 ,  H04N5/3745

Abstract: A method of forming a CMOS active pixel sensor (APS) cell structure having at least one transfer gate device and method of operation. A first transfer gate device comprises a diodic or split transfer gate conductor structure having a first doped region of first conductivity type material and a second doped region of a second conductivity type material. A photosensing device is formed adjacent the first doped region for collecting charge carriers in response to light incident thereto, and, a diffusion region of a second conductivity type material is formed at or below the substrate surface adjacent the second doped region of the transfer gate device for receiving charges transferred from the photosensing device while preventing spillback of charges to the photosensing device upon timed voltage bias to the diodic or split transfer gate conductor structure. Alternately, an intermediate charge storage device and second transfer gate device may be provided which may first temporarily receive charge carriers from the photosensing device, and, upon activating the second transfer gate device in a further timed fashion, read out the charge stored at the intermediate charge storage device for transfer to the second transfer gate device while preventing spillback of charges to the photosensing device. The APS cell structure is further adapted for a global shutter mode of operation, and further comprises a light shield element is further provided to ensure no light reaches the photosensing and charge storage devices during charge transfer operation.

Abstract translation: 一种形成具有至少一个传输栅极器件和操作方法的CMOS有源像素传感器（APS）单元结构的方法。 第一传输栅极器件包括具有第一导电类型材料的第一掺杂区域和第二导电类型材料的第二掺杂区域的二极或分裂传输栅极导体结构。 光敏装置形成在第一掺杂区域附近，用于响应于入射到其上的光而收集电荷载流子，并且第二导电类型材料的扩散区域形成在与传输栅极器件的第二掺杂区域相邻的衬底表面处或下方 用于接收从光敏装置转移的电荷，同时防止在针对二极或分离转移栅极导体结构的定时电压偏压时对光敏装置的电荷溢出。 或者，可以提供中间电荷存储装置和第二传输门装置，其可以首先临时从光敏装置接收电荷载体，并且在以另外的定时方式激活第二传输门装置时，读出存储在中间 电荷存储装置，用于传送到第二传输门装置，同时防止电荷向光感器件溢出。 APS单元结构进一步适用于全局快门操作模式，并且进一步包括遮光元件，以在电荷转移操作期间确保没有光到达光敏和电荷存储装置。

公开(公告)号：US07494748B2

公开(公告)日：2009-02-24

申请号：US10904308

申请日：2004-11-03

Applicant: James W. Adkisson ,  Eric M. Coker ,  Christopher K. Magg ,  Jed H. Rankin ,  Anthony K. Stamper

Inventor： James W. Adkisson ,  Eric M. Coker ,  Christopher K. Magg ,  Jed H. Rankin ,  Anthony K. Stamper

IPC: G03F1/00

CPC classification number: G03F1/72 ,  G03F1/70

Abstract: A method for correction of defects in lithography masks includes determining the existence of mask defects on an original mask, and identifying a stitchable zone around each of the mask defects found on the original mask. Each of the identified stitchable zones on the original mask is blocked out such that circuitry within the stitchable zones is not printed out during exposure of the original mask. A repair mask is formed, the repair mask including corrected circuit patterns from each of the identified stitchable zones.

Abstract translation: 用于校正光刻掩模中的缺陷的方法包括确定原始掩模上的掩模缺陷的存在，以及识别在原始掩模上发现的每个掩模缺陷周围的可缝合区域。 原始掩模上的每个识别的可缝合区域被阻挡，使得在原始掩模曝光期间不能打印出可缝合区域内的电路。 形成修复掩模，修复掩模包括来自每个识别的可缝合区域的校正电路图案。

公开(公告)号：US20080272399A1

公开(公告)日：2008-11-06

申请号：US12172305

申请日：2008-07-14

Applicant: James W. Adkisson ,  Andres Bryant ,  John J. Ellis-Monaghan ,  Mark D. Jaffe ,  Jeffrey B. Johnson ,  Alain Loiseau

Inventor： James W. Adkisson ,  Andres Bryant ,  John J. Ellis-Monaghan ,  Mark D. Jaffe ,  Jeffrey B. Johnson ,  Alain Loiseau

IPC: H01L31/00

CPC classification number: H01L27/14603 ,  H01L27/14609 ,  H01L27/14689 ,  H01L31/035281

Abstract: The present invention is a pixel sensor cell and method of making the same. The pixel sensor cell approximately doubles the available signal for a given quanta of light. The device of the present invention utilizes the holes produced by impinging photons in a pixel sensor cell circuit. A pixel sensor cell having reduced complexity includes an n-type collection well region formed beneath a surface of a substrate for collecting electrons generated by electromagnetic radiation impinging on the pixel sensor cell and a p-type collection well region formed beneath the surface of the substrate for collecting holes generated by the impinging photons. A circuit structure having a first input is coupled to the n-type collection well region and a second input is coupled to the p-type collection well region, wherein an output signal of the pixel sensor cell is the magnitude of the difference of a signal of the first input and a signal of the second input.

公开(公告)号：US20080116537A1

公开(公告)日：2008-05-22

申请号：US11560882

申请日：2006-11-17

Applicant: James W. Adkisson ,  Jeffrey P. Gambino ,  Zhong-Xiang He ,  Mark D. Jaffe ,  Robert K. Leidy ,  Stephen E. Luce ,  Richard J. Rassel ,  Edmund J. Sprogis

Inventor： James W. Adkisson ,  Jeffrey P. Gambino ,  Zhong-Xiang He ,  Mark D. Jaffe ,  Robert K. Leidy ,  Stephen E. Luce ,  Richard J. Rassel ,  Edmund J. Sprogis

IPC: H01L27/146 ,  H01L21/04

CPC classification number: H01L27/14687 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14685 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05124 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/05647 ,  H01L2224/13 ,  H01L2924/00014

Abstract: A CMOS image sensor array and method of fabrication. The CMOS imager sensor array comprises a substrate; an array of light receiving pixel structures formed above the substrate, the array having formed therein “m” levels of conductive structures, each level formed in a corresponding interlevel dielectric material layer; a dense logic wiring region formed adjacent to the array of light receiving pixel structures having “n” levels of conductive structures, each level formed in a corresponding interlevel dielectric material layer, where n>m. A microlens array having microlenses and color filters formed above the interlevel dielectric material layer, a microlens and respective color filter in alignment with a respective light receiving structure formed at a surface of the substrate. A top surface of the interlevel dielectric material layer beneath the microlens array is recessed from a top surface of the interlevel dielectric material layers of the dense logic wiring region.

Abstract translation: CMOS图像传感器阵列及其制造方法。 CMOS成像器传感器阵列包括衬底; 形成在衬底上方的光接收像素结构的阵列，阵列中形成有“m”级的导电结构，每个级形成在相应的层间介电材料层中; 与具有“n”级的导电结构的光接收像素结构的阵列相邻形成的密集的逻辑布线区域，每个层级形成在相应的层间电介质材料层中，其中n> m。 具有形成在层间电介质材料层上方的微透镜和滤色器的微透镜阵列，与形成在衬底表面处的各个光接收结构对准的微透镜和相应的滤色器。 微透镜阵列下面的层间介电材料层的顶表面从密集逻辑布线区域的层间介电材料层的顶表面凹陷。

公开(公告)号：US20080029844A1

公开(公告)日：2008-02-07

申请号：US11462070

申请日：2006-08-03

Applicant: James W. Adkisson ,  Jeffrey P. Gambino ,  Kirk D. Peterson ,  William R. Tonti

Inventor： James W. Adkisson ,  Jeffrey P. Gambino ,  Kirk D. Peterson ,  William R. Tonti

IPC: H01L29/00

CPC classification number: H01L23/5252 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An anti-fuse structure and a related method for fabricating the anti-fuse structure include a doped well within a semiconductor substrate. A first aperture and a second aperture that expose the doped well are located within a dielectric layer located over the semiconductor substrate and the doped well. A first conductor layer is located within the first aperture and a second conductor layer is located within the second aperture. At least a first anti-fuse material layer contacts the first conductor layer. The first conductor layer and the second conductor layer may comprise doped conductor materials that upon fusing of the anti-fuse structure provide an anti-fuse diode or an anti-fuse resistor.

Abstract translation: 用于制造抗熔丝结构的反熔丝结构和相关方法包括半导体衬底内的掺杂阱。 暴露掺杂阱的第一孔径和第二孔径位于位于半导体衬底和掺杂阱上方的电介质层内。 第一导体层位于第一孔内，第二导体层位于第二孔内。 至少第一反熔丝材料层接触第一导体层。 第一导体层和第二导体层可以包括掺杂的导体材料，其在抗熔丝结构融合时提供抗熔丝二极管或抗熔丝电阻器。

公开(公告)号：US07141836B1

公开(公告)日：2006-11-28

申请号：US10908885

申请日：2005-05-31

Applicant: James W. Adkisson ,  Mark D. Jaffe ,  Robert K. Leidy

Inventor： James W. Adkisson ,  Mark D. Jaffe ,  Robert K. Leidy

IPC: H01L27/148

CPC classification number: H01L27/14603 ,  H01L27/1463 ,  H01L27/14643 ,  H01L27/14683

Abstract: A novel pixel sensor structure formed on a substrate of a first conductivity type includes a photosensitive device of a second conductivity type and a surface pinning layer of the first conductivity type. An isolation structure is formed adjacent to the photosensitive device pinning layer. The isolation structure includes a dopant region comprising material of the first conductivity type selectively formed along a sidewall of the isolation structure that is adapted to electrically couple the surface pinning layer to the underlying substrate. The corresponding method for forming the dopant region selectively formed along the sidewall of the isolation structure comprises an out-diffusion process whereby dopant materials present in a doped material layer formed along selected portions in the isolation structure are driven into the underlying substrate during an anneal. Alternately, or in conjunction, an angled ion implantation of dopant material in the isolation structure sidewall may be performed by first fabricating a photoresist layer and reducing its size by removing a corner, or a corner portion thereof, which may block the angled implant material.

Abstract translation: 形成在第一导电类型的衬底上的新型像素传感器结构包括第二导电类型的光敏器件和第一导电类型的表面钉扎层。 在光敏器件钉扎层附近形成隔离结构。 隔离结构包括掺杂区域，该掺杂剂区域包括沿着隔离结构的侧壁选择性地形成的第一导电类型的材料，其适于将表面钉扎层电耦合到下面的衬底。 用于形成沿着隔离结构的侧壁选择性地形成的掺杂剂区域的相应方法包括外扩散工艺，由此在退火期间，存在于沿隔离结构中的选定部分形成的掺杂材料层中的掺杂剂材料被驱动到下面的衬底中。 替代地或结合地，隔离结构侧壁中的掺杂剂材料的成角度的离子注入可以通过首先制造光致抗蚀剂层并通过去除可能阻挡成角度的植入材料的角部或其角部来减小其尺寸来执行。

公开(公告)号：US06590259B2

公开(公告)日：2003-07-08

申请号：US10000198

申请日：2001-11-02

Applicant: James W. Adkisson ,  Ramachandra Divakaruni ,  Jeffrey P. Gambino ,  Jack A. Mandelman

Inventor： James W. Adkisson ,  Ramachandra Divakaruni ,  Jeffrey P. Gambino ,  Jack A. Mandelman

IPC: H01L2701

CPC classification number: H01L27/10864 ,  H01L21/84 ,  H01L27/1087 ,  H01L27/1203 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor device is presented which is directed to a method of forming embedded DRAM and logic devices, where the DRAM devices are formed in bulk, single crystalline semiconductor regions and logic devices are formed in silicon-on-insulator (“SOI”) regions and where buried, doped glass is used as a mask to form deep trenches for storage in the bulk region. The resulting structure is also disclosed.

Abstract translation: 提出了一种半导体器件，其涉及一种形成嵌入式DRAM和逻辑器件的方法，其中DRAM器件以块状形成，单晶半导体区域和逻辑器件形成在绝缘体上硅（“SOI”）区域中， 其中掩埋的掺杂玻璃用作掩模以形成用于存储在本体区域中的深沟槽。 还公开了所得到的结构。

公开(公告)号：US06448590B1

公开(公告)日：2002-09-10

申请号：US09695199

申请日：2000-10-24

Applicant: James W. Adkisson ,  Arne W. Ballantine ,  Ramachandra Divakaruni ,  Jeffrey B. Johnson ,  Erin C. Jones ,  Hon-Sum P. Wong

Inventor： James W. Adkisson ,  Arne W. Ballantine ,  Ramachandra Divakaruni ,  Jeffrey B. Johnson ,  Erin C. Jones ,  Hon-Sum P. Wong

IPC: H01L2710

CPC classification number: H01L29/4916 ,  H01L21/82345 ,  H01L29/4238 ,  H01L29/495 ,  H01L29/4966 ,  H01L29/66666 ,  H01L29/7827

Abstract: A shorter gate length FET for very large scale integrated circuit chips is achieved by providing a wafer with multiple threshold voltages. Multiple threshold voltages are developed by combining multiple work function gate materials. The gate materials are geometrically aligned in a predetermined pattern so that each gate material is adjacent to other gate materials. A patterned linear array embodiment is developed for a multiple threshold voltage design. The method of forming a multiple threshold voltage FET requires disposing different gate materials in aligned trenches within a semiconductor wafer, wherein each gate material represents a separate work function. The gate materials are arranged to be in close proximity to one another to accommodate small gate length designs.

Abstract translation: 通过提供具有多个阈值电压的晶片来实现用于非常大规模集成电路芯片的较短栅长FET。 通过组合多个功能门极材料来开发多个阈值电压。 栅极材料以预定图案几何对准，使得每个栅极材料与其它栅极材料相邻。 开发了用于多阈值电压设计的图案化线性阵列实施例。 形成多阈值电压FET的方法需要在半导体晶片内的对准沟槽中布置不同的栅极材料，其中每个栅极材料表示单独的功函数。 栅极材料被布置成彼此靠近以适应小栅极长度设计。