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162 条记录 (耗时 0.037 秒)

    Laser-induced optical wiring apparatus
    22.
    发明授权
    Laser-induced optical wiring apparatus 有权
    激光诱导光线路装置

    公开(公告)号：US07656928B2

    公开(公告)日：2010-02-02

    申请号：US11735570

    申请日：2007-04-16

    申请人： Hideto Furuyama

    发明人： Hideto Furuyama

    IPC分类号： H01S3/083

    CPC分类号： H01S5/1071 ,  H01S5/0625 ,  H01S5/1032 ,  H01S5/2224 ,  H01S5/227

    摘要： A laser-induced optical wiring apparatus is provided wherein optical wiring is realized by digital operations of a laser oscillator. The apparatus includes optical ring resonator formed of a loop-shaped optical waveguide on substrate. At least two optical gain sections are provided on the optical ring resonator. When each optical gain section is activated, a laser oscillator including the optical ring resonator and optical gain sections is enabled to oscillate. In this state, the gain of at least one of the optical gain sections is changed in accordance with an input signal, thereby changing the optical route gain of the optical ring resonator to change the oscillation state of the laser oscillator. A change in the laser oscillation state is detected by the optical gain section other than the at least one optical gain section, whereby an output signal is acquired.

    摘要翻译： 提供一种激光诱导光线路装置，其中通过激光振荡器的数字操作实现光布线。 该装置包括由基板上的环形光波导形成的光环谐振器。 在光环谐振器上设置至少两个光增益部分。 当每个光学增益部分被激活时，包括光环谐振器和光学增益部分的激光振荡器能够振荡。 在这种状态下，根据输入信号改变至少一个光增益部分的增益，由此改变光环谐振器的光路增益以改变激光振荡器的振荡状态。 通过除了至少一个光学增益部分之外的光学增益部分检测激光振荡状态的变化，由此获取输出信号。

    Wiring board and a semiconductor device using the same
    23.
    发明授权
    Wiring board and a semiconductor device using the same 失效
    接线板和使用其的半导体器件

    公开(公告)号：US07589282B2

    公开(公告)日：2009-09-15

    申请号：US10899154

    申请日：2004-07-27

    申请人： Hiroshi Yamada ,  Keiji Takaoka ,  Hideto Furuyama

    发明人： Hiroshi Yamada ,  Keiji Takaoka ,  Hideto Furuyama

    IPC分类号： H05K1/03

    CPC分类号： G02B6/43 ,  G02B6/4214 ,  G02B6/4232 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K1/0274 ,  H05K1/183 ,  H05K3/4602

    摘要： A wiring board includes a core composite layer having first and second core boards and an optical transmission portion; first electrodes disposed on one part of the core composite layer, being adapted to mount an optical semiconductor module on the core composite layer; upper and lower core board wirings disposed on another part of and beneath the core composite layer; and upper and lower build-up wirings stacked on the upper and lower core board wirings, being adapted to mount semiconductor modules.

    摘要翻译： 布线板包括具有第一和第二芯板的芯复合层和光传输部分; 设置在所述芯复合层的一部分上的第一电极，适于将光学半导体模块安装在所述芯复合层上; 上下芯板布线布置在芯复合层的另一部分和下面; 以及堆叠在上下芯板布线上的上下叠层布线，适于安装半导体模块。

    Optical fiber connector and connecting method
    25.
    发明授权
    Optical fiber connector and connecting method 失效
    光纤连接器及连接方式

    公开(公告)号：US07314317B2

    公开(公告)日：2008-01-01

    申请号：US11049758

    申请日：2005-02-04

    申请人： Hiroshi Hamasaki ,  Hideto Furuyama

    发明人： Hiroshi Hamasaki ,  Hideto Furuyama

    IPC分类号： G02B6/38

    CPC分类号： G02B6/3801 ,  G02B6/3887

    摘要： An optical fiber connector is used to optically connect a pair of optical fibers with their tips opposing each other. The optical fiber connector is formed of a material having a higher thermal deformation temperature than the coverings of the optical fibers. The connector has a guide hole for inserting therein the optical fibers with their tips opposing each other. The connector has fiber-fixing groove portions circumferentially formed in the wall of the guide hole. When the coverings of the optical fibers are thermally deformed, parts of the coverings bite the groove portions, whereby the optical fibers are fixed in the guide hole.

    摘要翻译： 光纤连接器用于将一对光纤与其尖端相对地光学连接。 光纤连接器由具有比光纤的覆盖物更高的热变形温度的材料形成。 连接器具有用于在其中插入其光纤的引导孔，其末端彼此相对。 连接器具有周向地形成在导向孔的壁中的纤维固定槽部。 当光纤的覆盖物热变形时，部分覆盖物咬住槽部，由此将光纤固定在引导孔中。

    Production method of opto-electronic device array
    26.
    发明授权
    Production method of opto-electronic device array 有权
    光电器件阵列的生产方法

    公开(公告)号：US07153361B2

    公开(公告)日：2006-12-26

    申请号：US10743087

    申请日：2003-12-23

    申请人： Hideto Furuyama

    发明人： Hideto Furuyama

    IPC分类号： C30B25/12 ,  C30B25/14

    CPC分类号： H01L31/1876 ,  H01L31/1844 ,  Y02E10/544 ,  Y02P70/521

    摘要： An opto-electronic device array is made from a multilayer epitaxial film by the following steps. The multilayer epitaxial film is separated into a plurality of segments. The segments are transferred to a first substrate to be arranged in an array substantially. Active regions are respectively confined in the segments so that the active regions form the array.

    摘要翻译： 通过以下步骤由多层外延膜制成光电器件阵列。 将多层外延膜分离为多个片段。 片段被传送到第一衬底，以基本上排列成阵列。 活性区域分别限制在片段中，使得活性区域形成阵列。

    Optical multiplexing interconnect module
    27.
    发明授权
    Optical multiplexing interconnect module 有权

    公开(公告)号：US07139481B2

    公开(公告)日：2006-11-21

    申请号：US11197344

    申请日：2005-08-05

    申请人： Hideto Furuyama

    发明人： Hideto Furuyama

    IPC分类号： H04B10/04

    CPC分类号： G02B6/4249 ,  H04L7/0008 ,  H04L7/0075

    摘要： In an optical multiplexing interconnection module, first and second NRZ input signals synchronous by clock signal are inputted to its input section. The first NRZ input signal is converted to a first RZ signal according to a logical product with a clock signal CLK by a drive circuit and the second NRZ input signal is converted to a second RZ signal according to a logical product with an inversion clock signal by a drive circuit. Then, light emitting devices are driven according to the first and second RZ signals from these drive circuits and two optical signals from the light emitting devices are inputted to an optical channel and multiplexed therein and then, a multiplexed optical signal is transmitted through an optical channel.

    LSI package provided with interface module
    29.
    发明申请
    LSI package provided with interface module 失效
    LSI封装提供了接口模块

    公开(公告)号：US20050156304A1

    公开(公告)日：2005-07-21

    申请号：US11015013

    申请日：2004-12-20

    申请人： Hideto Furuyama ,  Hiroshi Hamasaki

    发明人： Hideto Furuyama ,  Hiroshi Hamasaki

    IPC分类号： G02B6/42 ,  H01L23/12 ,  H01L23/48 ,  H01L23/498 ,  H01L23/50 ,  H01L23/52 ,  H01L25/10 ,  H01L25/16 ,  H01L31/0232 ,  H05K1/02 ,  H05K1/14 ,  H05K7/02

    CPC分类号： H01L23/49827 ,  H01L25/18 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/0268 ,  H05K1/141 ,  H05K7/023 ,  H05K2201/049 ,  H05K2201/10704 ,  H05K2201/10719 ,  H01L2924/00

    摘要： A LSI package encompasses: an interposer having board-connecting joints, which facilitate connection with a printed wiring board, and module-connecting terminals, part of the module-connecting terminals are assigned as interposer-site monitoring terminals; a signal processing LSI mounted on the interposer; and an I/F module having a plurality of interposer-connecting terminals, which are arranged to correspond to arrangement of the module-connecting terminals, and a transmission line to establish an external interconnection of signal, which is transmitted from the signal processing LSI, part of the interposer-connecting terminals are assigned as module-site monitoring terminals. The interposer-site and module-site monitoring terminals are configured to flow a monitoring current to confirm electric contact between the signal processing LSI and the I/F module.

    摘要翻译： LSI封装包括：具有板连接接头的插入件，其便于与印刷线路板的连接，以及模块连接端子，部分模块连接端子被分配为插入器位置监视端子; 安装在所述插入器上的信号处理LSI; 以及具有多个插入器连接端子的I / F模块，其被配置为对应于模块连接端子的布置，以及用于建立从信号处理LSI发送的信号的外部互连的传输线， 插入器连接端子的一部分被分配为模块站点监视终端。 中介站点和模块现场监视终端被配置为流动监视电流以确认信号处理LSI和I / F模块之间的电接触。

    Optical semiconductor module and its manufacturing method
    30.
    发明申请
    Optical semiconductor module and its manufacturing method 有权
    光半导体模块及其制造方法

    公开(公告)号：US20050063651A1

    公开(公告)日：2005-03-24

    申请号：US10898337

    申请日：2004-07-26

    申请人： Hiroshi Hamasaki ,  Hideto Furuyama ,  Hideo Numata ,  Takashi Imoto

    发明人： Hiroshi Hamasaki ,  Hideto Furuyama ,  Hideo Numata ,  Takashi Imoto

    IPC分类号： G02B6/42 ,  H01L31/0232 ,  H01L33/08 ,  H01L33/56 ,  H01L33/62 ,  H01L29/10

    CPC分类号： G02B6/4249 ,  G02B6/423

    摘要： An optical semiconductor module comprises an optical transmission channel including a waveguide transmitting a light beam, a holding member whose holding member holds the channel with the end of the channel being exposed from the surface, electric wiring formed on the surface, an optical semiconductor element, mounted above the surface, including an active area to emit or receive a light beam and an electrode pad electrically connected to the electric wiring, the active area optically coupled to the waveguide at the end of the channel, and an electrical insulation film between the optical semiconductor element and the holding member, including openings each corresponding to an electrical connection between the electrode pad and the electric wiring, and an optically coupling portion between the active area and the waveguide, the electrical insulation film being in contact with a portion of the end of the channel.

    摘要翻译： 光学半导体模块包括：光传输通道，其包括透射光束的波导;保持部件，其保持部件保持沟道的端部从表面露出，形成在表面上的电布线，光学半导体元件， 安装在所述表面上方，包括发射或接收光束的有源区域和电连接到所述电线路的电极焊盘，所述有源区域在所述通道的端部处光耦合到所述波导，以及在所述光学器件之间的电绝缘膜 半导体元件和保持构件，包括各自对应于电极焊盘和电布线之间的电连接的开口以及有源区域和波导之间的光学耦合部分，电绝缘膜与端部的一部分接触 的频道。