摘要:
Herein disclosed is a semiconductor integrated circuit device fabricating process for forming MISFETs over the principal surface in those active regions of a substrate, which are surrounded by inactive regions formed of an element separating insulating film and channel stopper regions, comprising: the step of for forming a first mask by a non-oxidizable mask and an etching mask sequentially over the principal surface of the active regions of the substrate; the step of forming a second mask on and in self-alignment with the side walls of the first mask by a non-oxidizable mask thinner than the non-oxidizable mask of the first mask and an etching mask respectively; the step of etching the principal surface of the inactive regions of the substrate by using the first mask and the second mask; the step of forming the element separating insulating film over the principal surface of the inactive regions of the substrate by an oxidization using the first mask and the second mask; and the step of forming the channel stopper regions over the principal surface portions below the element separating insulating film of the substrate by introducing an impurity into all the surface portions including the active regions and the inactive regions of the substrate after the first mask and the second mask have been removed.
摘要:
A spark plug includes a center electrode, a ground electrode, and a noble metal tip. The noble metal tip is joined to an object member of at least one of two electrodes via a fusion zone. A projected overlap region of the noble metal tip and the fusion zone accounts for 70% or more of a projected region of the noble metal tip. The object member contains at least Si out of Al and Si such that the amount of Si is 0.4% by mass or higher and such that the total amount of Al and Si is 0.5% by mass. Multi-fusion spots exist on the surface of the fusion zone. Segments of a baseline which pass through the respective multi-fusion spots have a total length of a predetermined percentage of the length of the baseline. Joining strength to the noble metal tip can thereby be greatly improved when the member to be joined contains Si.
摘要:
The present invention provides a liquid crystal display device with high image visibility at low power consumption and produced at low cost by using an interlayer dielectric film, which has low dielectric constant, high heat-resistant property, high optical transmissivity, high film thickness and high flattening property produced at low cost. An organic siloxane dielectric film is used as an interlayer dielectric film of the liquid crystal display device. A ratio of nitrogen content to silicon content (Ni content/Si content) in the interlayer dielectric film is controlled to 0.04 or more in the element ratio. The limiting film thickness to suppress and limit the cracking caused by the thickening of the interlayer dielectric film is set to 1.5 μm or more.
摘要:
A spark member (70) is formed by joining a noble metal member (71) and an intermediate member (75) and is provided in a spark discharge gap between a center electrode and a ground electrode (30). A bottom surface (80) of the intermediate member (75) is resistance-welded to an inner surface (33) of the ground electrode (30), and a weld metal zone (73) is formed in the region of joint therebetween. As viewed on the section of the spark member (70) which contains a centerline (Q), the weld metal zone (73) is reliably formed within the range of the length (D) of a columnar portion (76) as measured along a direction orthogonal to the projecting direction of the spark member (70) and has a length (d) of at least 0.1 times (10% of) the length (D).
摘要:
A spark plug including: a center electrode as defined herein; a substantially cylindrical insulator as defined herein; a cylindrical metal shell as defined herein; and a ground electrode as defined herein, wherein a spark discharge gap is provided between the leading end portion of the center electrode and the leading end portion of the ground electrode, and the ground electrode has a bulging curved face on a side opposite to a side in which the center electrode is provided, and a maximum of width of the ground electrode within a range of ±1 mm from a center point of the spark discharge gap in the axial direction, as viewed in a direction where the center electrode and the ground electrode overlap, is 105% or less of a width of an ordinary portion having a substantially constant width.
摘要:
The present invention provides a liquid crystal display device with high image visibility at low power consumption and produced at low cost by using an interlayer dielectric film, which has low dielectric constant, high heat-resistant property, high optical transmissivity, high film thickness and high flattening property produced at low cost. An organic siloxane dielectric film is used as an interlayer dielectric film of the liquid crystal display device. A ratio of nitrogen content to silicon content (Ni content/Si content) in the interlayer dielectric film is controlled to 0.04 or more in the element ratio. The limiting film thickness to suppress and limit the cracking caused by the thickening of the interlayer dielectric film is set to 1.5 μm or more.
摘要:
A ground-electrode spark portion 32 is formed from a noble metal which contains Pt as a main component, and is joined to a main metal portion of the ground electrode 4 via an alloy layer which has a thickness ranging from 0.5 μm to 100 μm and in which the noble metal that constitutes the ground-electrode spark portion 32 and the metal that constitutes the main metal portion of the ground electrode 4 are alloyed with each other. The ground-electrode spark portion 32 is configured such that a distal end surface 32t facing a spark discharge gap g is smaller in diameter than a bottom surface 32u joined to the ground electrode 4; and the distal end surface 32t is protrusively located beyond the side surface 4s of the ground electrode 4. When the ground-electrode spark portion 32 is viewed in plane from the distal end surface 32t, a portion of the surface of the ground-electrode spark portion 32 is viewed as a peripheral exposed-region surface 32p which is exposed on the side surface 4s of the ground electrode 4 so as to surround the distal end surface 32t.
摘要:
A spark plug including: a center electrode as defined herein; a substantially cylindrical insulator as defined herein; a cylindrical metal shell as defined herein; and a ground electrode as defined herein, wherein a spark discharge gap is provided between the leading end portion of the center electrode and the leading end portion of the ground electrode, and the ground electrode has a bulging curved face on a side opposite to a side in which the center electrode is provided, and a maximum of width of the ground electrode within a range of ±1 mm from a center point of the spark discharge gap in the axial direction, as viewed in a direction where the center electrode and the ground electrode overlap, is 105% or less of a width of an ordinary portion having a substantially constant width.
摘要:
In a method for manufacturing an FET having a gate insulation film with an SiO2 equivalent thickness of 2 nm or more and capable of suppressing the leak current to 1/100 or less compared with existent SiO2 films, an SiO2 film of 0.5 nm or more is formed at a boundary between an Si substrate (polycrystalline silicon gate) and a high dielectric insulation film, and the temperature for forming the SiO2 film is made higher than the source-drain activating heat treatment temperature in the subsequent steps. As such, a shifting threshold voltage by the generation of static charges or lowering of a drain current caused by degradation of mobility can be prevented so as to reduce electric power consumption and increase current in a field effect transistor of a smaller size.
摘要:
In a method for forming a semiconductor device, the major surface of a substrate is separated into a first element region for forming a first field-effect transistor and a second element region for forming a second field-effect transistor. A silicon nitride film is formed in each of the first and second element regions. Thereafter, the silicon nitride film formed in the second element region is removed, and the substrate is subjected to heat treatment in an ambient that contains nitrogen oxide. Thereby, the silicon nitride film in the first element region is oxidized to form an oxynitride film, and a silicon oxynitride film is formed in the second element region. Thereafter, a high-dielectric-constant film is formed on the silicon oxynitride films in each of the first and second element regions.