Light-enhancement device, and appliance having the same

    公开(公告)号:US10386629B2

    公开(公告)日:2019-08-20

    申请号:US15729649

    申请日:2017-10-10

    Abstract: A light-enhancement device includes a wavelength conversion member and a wavelength controlling element. The wavelength conversion member includes a light-transmissive substrate and wavelength conversion material which is disposed within the light-transmissive substrate for converting a portion of light with a first wavelength into another light with a second wavelength. The wavelength controlling element is disposed on a surface of the light-transmissive substrate for reflecting another portion of the light with the first wavelength into the light-transmissive substrate and enabling the portion of the light with the second wavelength to pass through the wavelength controlling element. A roughness of the surface of the light-transmissive substrate facing towards the wavelength controlling element is configured to be 0-1 μm.

    Display device and manufacturing method thereof

    公开(公告)号:US11469352B2

    公开(公告)日:2022-10-11

    申请号:US16698980

    申请日:2019-11-28

    Abstract: A display device includes a substrate, a plurality of white light-emitting units, and a color filter layer. The white light-emitting units are arranged on the substrate at intervals, and the white light-emitting units are chip scale package (CSP). The color filter layer is above the white light-emitting units. Each of the white light-emitting units includes a light-emitting diode chip and a wavelength conversion film. The wavelength conversion film directly covers a top surface and side surfaces of the light-emitting diode chip, and the wavelength conversion film converts light emitted by the light-emitting diode chip into white light.

    Display Device and Manufacturing Method Thereof

    公开(公告)号:US20210135063A1

    公开(公告)日:2021-05-06

    申请号:US16698980

    申请日:2019-11-28

    Abstract: A display device includes a substrate, a plurality of white light-emitting units, and a color filter layer. The white light-emitting units are arranged on the substrate at intervals, and the white light-emitting units are chip scale package (CSP). The color filter layer is above the white light-emitting units. Each of the white light-emitting units includes a light-emitting diode chip and a wavelength conversion film. The wavelength conversion film directly covers a top surface and side surfaces of the light-emitting diode chip, and the wavelength conversion film converts light emitted by the light-emitting diode chip into white light.

    LIGHT-EMITTING DIODE PACKAGE
    30.
    发明申请
    LIGHT-EMITTING DIODE PACKAGE 审中-公开
    发光二极管封装

    公开(公告)号:US20170069809A1

    公开(公告)日:2017-03-09

    申请号:US15227067

    申请日:2016-08-03

    Abstract: A light-emitting diode package is provided. The light-emitting diode package includes a lead-frame, a reflective cup and a die. The lead-frame is made of a silver-free material. The reflective cup has the cavity. The die is disposed on the lead-frame in a face-down orientation, and is further electrically connected to the lead-frame and located within the cavity.

    Abstract translation: 提供了一种发光二极管封装。 发光二极管封装包括引线框架,反射杯和模具。 引线框由无银材料制成。 反射杯有空腔。 模具以正面朝下的方式设置在引线框架上,并且进一步电连接到引线框架并且位于空腔内。

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