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    Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
    25.
    发明授权
    Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates 有权
    电介质材料和/或使用电介质基片的电化学制造方法

    公开(公告)号：US09546431B2

    公开(公告)日：2017-01-17

    申请号：US14185613

    申请日：2014-02-20

    Applicant: Microfabrica Inc.

    Inventor： Adam L. Cohen ,  Michael S. Lockard ,  Kieun Kim ,  Qui T. Le ,  Gang Zhang ,  Uri Frodis ,  Dale S. McPherson ,  Dennis R. Smalley

    IPC: C25D5/02 ,  C25D1/00 ,  C23C18/16 ,  B81C1/00

    CPC classification number: C25D5/022 ,  B81C1/00126 ,  B81C2201/0109 ,  B81C2201/019 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  Y10T156/11 ,  Y10T156/19

    Abstract: Some embodiments of the present invention are directed to techniques for building up single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while other embodiments use an intervening adhesion layer material. Some embodiments use different seed layer materials and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while other embodiments apply the materials in blanket fashion. Some embodiments remove extraneous depositions (e.g. depositions to regions unintended to form part of a layer) via planarization operations while other embodiments remove the extraneous material via etching operations. Other embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer.

    Abstract translation: 本发明的一些实施例涉及在电介质或部分电介质基底上建立单层或多层结构的技术。 某些实施方案将种子层材料直接沉积到基底材料上，而其它实施例使用中间粘合层材料。 一些实施例使用不同种子层材料和/或用于牺牲和结构导电建筑材料的粘合层材料。 一些实施例将种子层和/或粘合层材料应用于有选择性的方式，而其它实施例以毯子的方式应用材料。 一些实施例通过平面化操作去除外来沉积物（例如沉积到不想要形成层的一部分的区域），而其他实施例通过蚀刻操作去除外来材料。 其它实施方案涉及使用至少一种导电结构材料，至少一种导电牺牲材料和至少一种电介质材料形成的多层中尺度或微结构结构的电化学制造。 在一些实施方案中，电介质材料是可UV固化的光聚合物。

    Batch Methods of Forming Microscale or Millimeter Scale Structures Using Electro Discharge Machining Alone or In Combination with Other Fabrication Methods
    27.
    发明申请
    Batch Methods of Forming Microscale or Millimeter Scale Structures Using Electro Discharge Machining Alone or In Combination with Other Fabrication Methods 审中-公开
    使用单独或与其他制作方法组合的电子放电加工形成微尺度或毫米级结构的批量方法

    公开(公告)号：US20150021299A1

    公开(公告)日：2015-01-22

    申请号：US14333476

    申请日：2014-07-16

    Applicant: Microfabrica Inc.

    Inventor： Heath A. Jensen ,  Uri Frodis ,  Christopher G. Wiita ,  Michael S. Lockard

    IPC: B23H1/04

    CPC classification number: B23H1/04

    Abstract: Embodiments are directed to forming three-dimensional millimeter scale or micro-scale structures from single or multiple sheets or layers of material via electro discharge machining (EDM). In some embodiments, the electrodes are formed by single layer or multi-layer, single material or multi-material deposition processes. In some embodiments single electrodes form a plurality of parts or structures simultaneously. In some embodiments a sacrificial bridging material is used to hold parts together during and after EDM processing.

    Abstract translation: 实施例涉及通过放电加工（EDM）从单个或多个片材或材料层形成三维毫米级或微尺度结构。 在一些实施例中，电极通过单层或多层单材料或多材料沉积工艺形成。 在一些实施例中，单个电极同时形成多个部件或结构。 在一些实施例中，牺牲桥接材料用于在EDM处理期间和之后将部件保持在一起。

    Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric Substrates
    28.
    发明申请
    Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric Substrates 有权
    电介质材料和/或使用介质基片的电化学制造方法

    公开(公告)号：US20140209473A1

    公开(公告)日：2014-07-31

    申请号：US14185613

    申请日：2014-02-20

    Applicant: Microfabrica Inc.

    Inventor： Adam L. Cohen ,  Michael S. Lockard ,  Kieun Kim ,  Qui T. Le ,  Gang Zhang ,  Uri Frodis ,  Dale S. McPherson ,  Dennis R. Smalley

    IPC: C25D5/02

    CPC classification number: C25D5/022 ,  B81C1/00126 ,  B81C2201/0109 ,  B81C2201/019 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  Y10T156/11 ,  Y10T156/19

    Abstract: Some embodiments of the present invention are directed to techniques for building up single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while other embodiments use an intervening adhesion layer material. Some embodiments use different seed layer materials and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while other embodiments apply the materials in blanket fashion. Some embodiments remove extraneous depositions (e.g. depositions to regions unintended to form part of a layer) via planarization operations while other embodiments remove the extraneous material via etching operations. Other embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer.

    Abstract translation: 本发明的一些实施例涉及在电介质或部分电介质基底上建立单层或多层结构的技术。 某些实施方案将种子层材料直接沉积到基底材料上，而其它实施例使用中间粘合层材料。 一些实施例使用不同种子层材料和/或用于牺牲和结构导电建筑材料的粘合层材料。 一些实施例将种子层和/或粘合层材料应用于有选择性的方式，而其它实施例以毯子的方式应用材料。 一些实施例通过平面化操作去除外来沉积物（例如沉积到不想要形成层的一部分的区域），而其他实施例通过蚀刻操作去除外来材料。 其它实施方案涉及使用至少一种导电结构材料，至少一种导电牺牲材料和至少一种电介质材料形成的多层中尺度或微结构结构的电化学制造。 在一些实施方案中，电介质材料是可UV固化的光聚合物。

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