公开(公告)号：US08377748B2

公开(公告)日：2013-02-19

申请号：US13137669

申请日：2011-09-01

申请人： Eung Suek Lee ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Jun Oh Hwang ,  Jun Heyoung Park ,  Jee Soo Mok

发明人： Eung Suek Lee ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Jun Oh Hwang ,  Jun Heyoung Park ,  Jee Soo Mok

IPC分类号： H01L23/467

CPC分类号： H01L23/373 ,  B82Y30/00 ,  C04B35/80 ,  C04B2235/3217 ,  C04B2235/3418 ,  C04B2235/407 ,  C04B2235/408 ,  C04B2235/5288 ,  F28F3/02 ,  F28F21/02 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/3025 ,  Y10T29/49002 ,  Y10T29/4935 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacturing a cooling fin and package substrate that includes preparing a mold, which has a support base and a resin layer formed on the support base and including on a side thereof a groove, which is configured to form a cooling fin; printing fireable paste containing a carbon component on a side of the mold that has the groove configured to form a cooling fin; removing the support base to leave a cooling object; and firing the cooling object.

摘要翻译： 一种冷却翅片和封装基板的制造方法，其特征在于，包括：准备模具，所述模具具有支撑基体和树脂层，所述支撑基部和树脂层形成在所述支撑基部上，并且在其一侧包括凹槽，所述凹槽被构造成形成冷却翅片; 在所述模具的侧面上印刷含有碳成分的可燃性糊料，所述成型体具有形成冷却翅片的所述凹槽; 移除支撑底座以留下冷却物体; 并发射冷却对象。

公开(公告)号：US20120222299A1

公开(公告)日：2012-09-06

申请号：US13474388

申请日：2012-05-17

申请人： Jee Soo MOK ,  Je Gwang Yoo ,  Chang Sup Ryu

发明人： Jee Soo MOK ,  Je Gwang Yoo ,  Chang Sup Ryu

IPC分类号： H05K3/10

CPC分类号： H05K3/4069 ,  H05K3/06 ,  H05K3/107 ,  H05K3/28 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2201/0376 ,  H05K2201/09481 ,  H05K2203/0278 ,  H05K2203/1461 ,  Y10T29/49144 ,  Y10T29/49155

摘要： A printed circuit board and a method of manufacturing the printed circuit board, in which the printed circuit board includes an insulating layer, a circuit layer embedded in the insulating layer and having a connection pad that is embedded in the insulating layer such that one side of the connection pad is flush with a surface of the insulating layer, and insulating materials configured to protect the circuit layer from an external environment and having an opening through which the connection pad is exposed. The printed circuit board is made slim, and reliability and the degree of design freedom are increased.

摘要翻译： 一种印刷电路板和印刷电路板的制造方法，其中印刷电路板包括绝缘层，嵌入绝缘层中的电路层，并且具有嵌入在绝缘层中的连接焊盘，使得 所述连接垫与所述绝缘层的表面齐平，以及被配置为保护所述电路层免受外部环境并且具有所述连接焊盘暴露的开口的绝缘材料。 印刷电路板变薄，可靠性和设计自由度提高。

公开(公告)号：US20120005894A1

公开(公告)日：2012-01-12

申请号：US13137934

申请日：2011-09-21

申请人： Jee Soo Mok ,  Je Gwang Yoo ,  Chang Sup Ryu

发明人： Jee Soo Mok ,  Je Gwang Yoo ,  Chang Sup Ryu

IPC分类号： H05K3/06 ,  H05K3/46

CPC分类号： H05K3/1258 ,  H01L2224/11 ,  H05K3/4069 ,  H05K3/4602 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09545 ,  H05K2201/096 ,  H05K2203/0568 ,  H05K2203/1152 ,  Y10T29/49156

摘要： A method of manufacturing a multilayered circuit board, including: providing a double-sided copper clad laminate including via holes formed therethrough and openings for forming circuit patterns, formed by patterning copper foil formed on one side thereof; filling the via holes and the openings with conductive paste; removing the copper foil from the double-sided copper clad laminate to form a first circuit layer including circuit patterns on one side thereof and to form a second circuit layer including connecting pads for attaching solder balls thereto on the other side thereof; forming a build-up layer on the first circuit layer, the build-up layer including a plurality of insulating layers and a plurality of circuit layers; and forming a solder resist layer on an outermost layer of the build-up layer.

摘要翻译： 一种制造多层电路板的方法，包括：提供一种双面铜箔层压板，其包括形成的通孔和用于形成电路图案的开口，其形成在其一侧形成的铜箔; 用导电浆填充通孔和开孔; 从双面覆铜层压板上除去铜箔，以形成包括其一侧上的电路图案的第一电路层，并形成第二电路层，该第二电路层包括在其另一侧上附着焊球的连接焊盘; 在第一电路层上形成堆积层，所述堆积层包括多个绝缘层和多个电路层; 以及在积层层的最外层上形成阻焊层。

公开(公告)号：US20090250259A1

公开(公告)日：2009-10-08

申请号：US12216435

申请日：2008-07-03

申请人： Jee Soo Mok ,  Je Gwang Yoo ,  Chang Sup Ryu

发明人： Jee Soo Mok ,  Je Gwang Yoo ,  Chang Sup Ryu

IPC分类号： H01R12/02 ,  B05D5/12 ,  B32B38/10

CPC分类号： H05K3/4007 ,  H01R12/523 ,  H05K3/0017 ,  H05K3/207 ,  H05K3/4644 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/096 ,  H05K2203/016 ,  H05K2203/1536

摘要： Disclosed herein is a multilayered printed circuit board, including: a build-up layer including a plurality of insulating layers and a plurality of circuit layers; an insulating resin layer, including bumps, formed on the outermost circuit layer of one side of the build-up layer; and a solder resist layer formed on the outermost layer of the other side of the build-up layer. The multilayered printed circuit board is manufactured by sequentially placing a build-up layer and a solder resist layer on one side of an insulating resin layer, the other side of which is provided with bumps. The present invention is advantageous in that the thickness of the multilayered printed circuit board is decreased, the production processes thereof is simplified, and the production efficiency is increased.

摘要翻译： 本文公开了一种多层印刷电路板，包括：包括多个绝缘层和多个电路层的堆积层; 包含凸起的绝缘树脂层，形成在构成层一侧的最外层电路层上; 以及形成在积层的另一侧的最外层上的阻焊层。 多层印刷电路板通过在绝缘树脂层的一侧依次放置积层和阻焊层，另一侧设置有凸块来制造。 本发明的优点在于，多层印刷电路板的厚度减小，其制造工艺简化，生产效率提高。

公开(公告)号：US20090223044A1

公开(公告)日：2009-09-10

申请号：US12453616

申请日：2009-05-15

申请人： Han Seo Cho ,  Je Gwang Yoo ,  Sang-Hoon Kim ,  Joon-Sung Kim

发明人： Han Seo Cho ,  Je Gwang Yoo ,  Sang-Hoon Kim ,  Joon-Sung Kim

IPC分类号： H05K3/10

CPC分类号： G02B6/1221 ,  G02B6/136 ,  G02B6/28 ,  G02B6/4214 ,  H05K1/0274 ,  H05K3/20 ,  Y10T29/49155

摘要： A method of manufacturing a printed circuit board in which optical waveguides are formed for transmitting optical signals together with electrical signals, which includes a cladding, a core embedded in the cladding that transmits optical signals, and a wiring pattern embedded in the cladding that transmits electrical signals, can offer improved optical connection efficiency and reduced material costs by enabling the cladding to act as an insulation layer and embedding the wiring pattern in the cladding.

摘要翻译： 一种制造印刷电路板的方法，其中形成光波导以及电信号一起传输光信号，电信号包括包层，嵌入在传播光信号的包层中的芯，以及嵌入在包层中的布线图案，其传输电 信号，可以通过使包层充当绝缘层并且将布线图案嵌入包层中来提供改善的光学连接效率和降低的材料成本。

公开(公告)号：US08942004B2

公开(公告)日：2015-01-27

申请号：US12972371

申请日：2010-12-17

申请人： Suk Chang Hong ,  Bong Kyu Choi ,  Je Gwang Yoo ,  Sang Wuk Jun ,  Sang Kab Park ,  Jung Soo Byun

发明人： Suk Chang Hong ,  Bong Kyu Choi ,  Je Gwang Yoo ,  Sang Wuk Jun ,  Sang Kab Park ,  Jung Soo Byun

IPC分类号： H05K1/18 ,  H01L23/538 ,  H05K3/46 ,  H01L23/00 ,  H01L23/498

CPC分类号： H05K1/185 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/15153 ,  H05K3/4608 ,  H05K3/4661 ,  H01L2924/00

摘要： Disclosed herein is a printed circuit board having electronic components embedded therein. The printed circuit board having electronic components embedded therein includes: a metal core layer connected to a ground terminal of an external power supply to be grounded and having a cavity or a groove part formed thereon; an electronic component accommodated in the cavity and having a plurality of terminals, a ground terminal included in the plurality of terminals being connected to the metal core layer; an internal insulating layer stacked on both sides of the metal core layer; and circuit patterns formed on an external surface of the internal insulating layer.

摘要翻译： 这里公开了具有嵌入其中的电子部件的印刷电路板。 具有嵌入其中的电子部件的印刷电路板包括：连接到待接地的外部电源的接地端子并且具有形成在其上的空腔或沟槽部分的金属芯层; 容纳在所述空腔中并具有多个端子的电子部件，包括在所述多个端子中的接地端子连接到所述金属芯层; 堆叠在所述金属芯层的两侧的内部绝缘层; 以及形成在内部绝缘层的外表面上的电路图案。

公开(公告)号：US06525463B1

公开(公告)日：2003-02-25

申请号：US09323520

申请日：1999-06-01

申请人： Pan Kyu Choi ,  Je Gwang Yoo ,  Chang Ho Song

发明人： Pan Kyu Choi ,  Je Gwang Yoo ,  Chang Ho Song

IPC分类号： H01J150

CPC分类号： H01J29/68 ,  H01J31/127

摘要： A flat panel display device comprises a cathode on a first substrate for emitting electrons, a magnetic plate including first region focusing electrons emitted from the cathode to display an image and second region for applying the uniform magnetic field into the holes in the first region, and a fluorescent layer on the second substrate, on which the electrons outputted from the holes are impacted. In the second region, there are holes having the same shape and pitch as the first region.

摘要翻译： 平板显示装置包括用于发射电子的第一基板上的阴极，包括聚焦从阴极发射的电子以显示图像的第一区域的磁性板和用于将均匀磁场施加到第一区域中的孔的第二区域，以及 在第二基板上的从孔中输出的电子受到冲击的荧光层。 在第二区域中，具有与第一区域相同的形状和间距的孔。

公开(公告)号：US20120087097A1

公开(公告)日：2012-04-12

申请号：US12972371

申请日：2010-12-17

申请人： Suk Chang HONG ,  Bong Kyu CHOI ,  Je Gwang Yoo ,  Sang Wuk JUN ,  Sang Kab PARK ,  Jung Soo Byun

发明人： Suk Chang HONG ,  Bong Kyu CHOI ,  Je Gwang Yoo ,  Sang Wuk JUN ,  Sang Kab PARK ,  Jung Soo Byun

IPC分类号： H05K1/18

CPC分类号： H05K1/185 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/15153 ,  H05K3/4608 ,  H05K3/4661 ,  H01L2924/00

摘要： Disclosed herein is a printed circuit board having electronic components embedded therein. The printed circuit board having electronic components embedded therein includes: a metal core layer connected to a ground terminal of an external power supply to be grounded and having a cavity or a groove part formed thereon; an electronic component accommodated in the cavity and having a plurality of terminals, a ground terminal included in the plurality of terminals being connected to the metal core layer; an internal insulating layer stacked on both sides of the metal core layer; and circuit patterns formed on an external surface of the internal insulating layer.

摘要翻译： 这里公开了具有嵌入其中的电子部件的印刷电路板。 具有嵌入其中的电子部件的印刷电路板包括：连接到待接地的外部电源的接地端子并且具有形成在其上的空腔或沟槽部分的金属芯层; 容纳在所述空腔中并具有多个端子的电子部件，包括在所述多个端子中的接地端子连接到所述金属芯层; 堆叠在所述金属芯层的两侧的内部绝缘层; 以及形成在内部绝缘层的外表面上的电路图案。

公开(公告)号：US20090290832A1

公开(公告)日：2009-11-26

申请号：US12216995

申请日：2008-07-14

申请人： Sang Hoon Kim ,  Je Gwang Yoo ,  Joon Sung Kim ,  Jae Hyun Jung ,  Han Seo Cho

发明人： Sang Hoon Kim ,  Je Gwang Yoo ,  Joon Sung Kim ,  Jae Hyun Jung ,  Han Seo Cho

IPC分类号： G02B6/12

CPC分类号： G02B6/43 ,  G02B6/132 ,  G02B6/4214 ,  H05K1/0274 ,  H05K3/4602

摘要： Disclosed herein is a printed circuit board including an optical waveguide and a method of manufacturing the board. In the board, the optical waveguide includes a metal layer extending portion integrally connected to a metal layer constituting a mirror formed in the optical waveguide. Since the method of the present invention creates the mirror using electroless plating, which is typically used in a process of manufacturing general printed circuit boards, it is suitable for the manufacture of printed circuit boards having a large area, and the mirror has high reflectivity and is efficient in terms of material consumption.

摘要翻译： 这里公开了包括光波导的印刷电路板和制造该板的方法。 在该板中，光波导包括与构成在光波导中形成的反射镜的金属层一体连接的金属层延伸部。 由于本发明的方法使用通常用于制造一般印刷电路板的工艺中的化学镀的镜子，所以适用于制造面积大的印刷电路板，并且镜具有高反射率和 在材料消耗方面效率高。

公开(公告)号：US20120080224A1

公开(公告)日：2012-04-05

申请号：US13137871

申请日：2011-09-20

申请人： Je Gwang Yoo ,  Bong Kyu Choi ,  Yong Soo An

发明人： Je Gwang Yoo ,  Bong Kyu Choi ,  Yong Soo An

IPC分类号： H05K9/00 ,  H05K3/02 ,  H05K3/46

CPC分类号： H05K1/0221 ,  H05K3/28 ,  H05K2201/0195 ,  Y10T29/49155 ,  Y10T29/49156

摘要： Provided is a circuit board for signal transmission and a method of manufacturing the same. The circuit board for signal transmission includes a first insulating layer, a plurality of signal interconnection disposed on the first insulating layer, ground interconnections disposed on the first insulating layer at both sides of the plurality of signal interconnections, a second insulating layer disposed on the first insulating layer including the plurality of signal interconnections and ground interconnections, a first shield layer disposed on the second insulating layer, a first shield wall for electrically connecting the ground interconnections and the first shield layer and passing through the second insulating layer, a second shield layer disposed under the first insulating layer, and a second shield wall for electrically connecting the ground interconnections and the second shield layer and passing through the first insulating layer.

摘要翻译： 提供了一种用于信号传输的电路板及其制造方法。 用于信号传输的电路板包括第一绝缘层，布置在第一绝缘层上的多个信号互连，布置在多个信号互连两侧的第一绝缘层上的接地互连，设置在第一绝缘层上的第一绝缘层 包括多个信号互连和接地互连的绝缘层，设置在第二绝缘层上的第一屏蔽层，用于电连接接地互连和第一屏蔽层并穿过第二绝缘层的第一屏蔽层，第二屏蔽层 设置在第一绝缘层下面的第二屏蔽壁和用于电连接接地互连和第二屏蔽层并穿过第一绝缘层的第二屏蔽壁。