公开(公告)号：US20160322552A1

公开(公告)日：2016-11-03

申请号：US15140792

申请日：2016-04-28

Applicant: NICHIA CORPORATION

Inventor： Tomohide MIKI

IPC: H01L33/62 ,  H01L21/56 ,  H01L33/60 ,  H01L33/54 ,  H01L33/50 ,  H01L21/48 ,  H01L23/498

Abstract: A package includes a first lead electrode, a second lead electrode, and a resin molded body. The first lead electrode has a first upper surface and a first lower surface defining a depression and opposite to the first upper surface. The second lead electrode has a second upper surface and a second lower surface opposite to the second upper surface. The resin molded body defining a recess with a bottom surface including the first upper surface and the second upper surface, the resin molded body also covering the first lower surface and the second lower surface. The first electrode having a first region closer to the second lead electrode and a second region farther to the second lead electrode than the first region, and having a thickness smaller than a thickness of the first region due to the depression defined in the first lower surface.

Abstract translation: 封装包括第一引线电极，第二引线电极和树脂模制体。 第一引线电极具有限定凹陷并与第一上表面相对的第一上表面和第一下表面。 第二引线电极具有与第二上表面相对的第二上表面和第二下表面。 树脂成型体限定具有包括第一上表面和第二上表面的底面的凹部，树脂成型体也覆盖第一下表面和第二下表面。 所述第一电极具有比所述第一区域更靠近所述第二引线电极的第一区域和比所述第一区域更远离所述第二引线电极的第二区域，并且其厚度小于由所述第一区域的厚度限定在所述第一下表面 。

公开(公告)号：US20160181492A1

公开(公告)日：2016-06-23

申请号：US14973878

申请日：2015-12-18

Applicant: NICHIA CORPORATION

Inventor： Tomohide MIKI

IPC: H01L33/62 ,  H01L33/56

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A light emitting device includes: a package equipped with a lead that has an upper surface and a lower surface, and has a metal board and a plating layer formed on a surface of the metal board, the plating layer including a first plating layer provided to an upper surface of the metal board, and a second plating layer provided to a lower surface of the metal board, the first plating layer including nickel plating layer, gold plating layer and silver plating layer, and the second plating layer including no nickel plating layer and gold plating layer, and a molded resin that holds the lead; a light emitting element mounted in the package; and a sealing member that seals the light emitting element.

Abstract translation: 发光装置包括：具有上表面和下表面的引线的封装，并且在金属板的表面上具有金属板和镀层，所述镀层包括第一镀层，所述第一镀层设置于 金属板的上表面和设置在金属板的下表面的第二镀层，第一镀层包括镀镍层，镀金层和镀银层，第二镀层不包括镀镍层 和镀金层，以及保持铅的模制树脂; 安装在所述封装中的发光元件; 以及密封所述发光元件的密封构件。

公开(公告)号：US20140366369A1

公开(公告)日：2014-12-18

申请号：US14478086

申请日：2014-09-05

Applicant: NICHIA CORPORATION

Inventor： Ryohei YAMASHITA ,  Tomohide MIKI ,  Hiroto TAMAKI

IPC: H05K13/00

CPC classification number: H05K13/00 ,  H01L24/97 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49113 ,  H01L2924/181 ,  Y10T29/49124 ,  Y10T29/49126 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A method for manufacturing a circuit board constituted by a light emitting device and a mounting board includes the steps of: conveying the light emitting device onto the mounting board in a state in which a top face is chucked by a nozzle so that the nozzle and an exposed part of a first terminal part of the light emitting device are in contact; and placing the light emitting device onto the mounting board so that the first terminal part and a wiring component are in contact in a state in which the top face is chucked by the nozzle.

Abstract translation: 一种用于制造由发光器件和安装板构成的电路板的方法，包括以下步骤：在顶表面由喷嘴卡住的状态下将发光器件传送到安装板上，使得喷嘴和 发光装置的第一端子部分的露出部分接触; 以及将所述发光器件放置在所述安装板上，使得所述第一端子部和所述布线部件在所述顶面被所述喷嘴卡住的状态下接触。

公开(公告)号：US20140361318A1

公开(公告)日：2014-12-11

申请号：US14465315

申请日：2014-08-21

Applicant: NICHIA CORPORATION

Inventor： Tomohide MIKI ,  Kenji TAKINE ,  Ryohei YAMASHITA

IPC: H01L33/50 ,  H01L33/54 ,  H01L33/62 ,  H01L25/075

CPC classification number: H01L33/507 ,  H01L25/0753 ,  H01L33/505 ,  H01L33/508 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The light emitting device comprises a substrate (2), a positive electrode (6) and a negative electrode (4) formed on the substrate (2), a light emitting diode (8) connected to the positive electrode (6) and the negative electrode (4), the transparent resin (12 and 14) that covers the light emitting diode (8), a fluorescent material (16) that absorbs at least part of light emitted by the light emitting diode (8) and converts it to light of longer wavelength, and the lens that changes the direction of light emission from the light emitting diode (8) and/or the fluorescent material (16). The resin (12 and 14) includes the fluorescent material (16) and is formed so as to constitute the lens of substantially semi-cylindrical shape, and the fluorescent material (16) included in the resin (12 and 14) is distributed with a higher concentration in a region near the surface of the light emitting diode (8) than in a region near the surface of the portion that constitutes the lens.

公开(公告)号：US20250133878A1

公开(公告)日：2025-04-24

申请号：US19000967

申请日：2024-12-24

Applicant: NICHIA CORPORATION

Inventor： Hirofumi ICHIKAWA ,  Masaki HAYASHI ,  Shimpei SASAOKA ,  Tomohide MIKI

IPC: H10H20/85 ,  B29C45/00 ,  B29C45/14 ,  H01L23/00 ,  H10H20/01 ,  H10H20/851 ,  H10H20/854 ,  H10H20/856 ,  H10H20/857 ,  H10H20/858

Abstract: A light emitting device includes: a resin package comprising a first lead, a second lead, and a resin part; and a light emitting element disposed on the first lead. The resin package has a rectangular shape in top view and comprises a first outer lateral surface, a second outer lateral surface on a side opposite the first outer lateral surface, a third outer lateral surface, and a fourth outer lateral surface on a side opposite the third outer lateral surface. At the first outer lateral surface, the first lead is exposed from the resin part, and the first lead and a portion of the resin part located at a lateral edge of the first lead are substantially coplanar with each other.

公开(公告)号：US20200052177A1

公开(公告)日：2020-02-13

申请号：US16660468

申请日：2019-10-22

Applicant: NICHIA CORPORATION

Inventor： Tomohide MIKI

IPC: H01L33/64 ,  H01L33/60 ,  H01L33/62

Abstract: A light emitting device according to one aspect includes a resin package and a light emitting element. The resin package includes a molded resin part defining a part of a recessed portion, and a pair of leads. The leads are exposed from the molded resin part at a bottom surface of the recessed portion. Each of the leads includes a plating layer and exposed from the molded resin part at a lower surface of the resin package. A height of a first part of the plating layer exposed from the lower surface of the resin package and adjacent to an edge of a corresponding one of the leads is different from a height of a second part of the plating layer exposed from the lower surface of the resin package. The light emitting element is mounted on the bottom surface of the recessed portion.

公开(公告)号：US20180053884A1

公开(公告)日：2018-02-22

申请号：US15678431

申请日：2017-08-16

Applicant: NICHIA CORPORATION

Inventor： Tomohide MIKI ,  Hideki HAYASHI ,  Motokiyo SHIRAHAMA

IPC: H01L33/62 ,  H01L33/00 ,  H01L33/54 ,  H01L33/56

CPC classification number: H01L33/62 ,  H01L33/0095 ,  H01L33/32 ,  H01L33/502 ,  H01L33/507 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2933/005 ,  H01L2933/0066

Abstract: A method of manufacturing a light emitting device includes: providing a light emitting device set that includes a lead frame being plate-like and including pairs of supporting leads each of which pairs consists of a first supporting lead and a second supporting lead, packages respectively supported by the pairs of supporting leads, and light emitting elements respectively mounted on the packages; and removing the packages from the lead frame. The packages each include a resin molded body, the resin molded body includes a first recess open at the first and third outer surfaces, and a second recess open at the second and third outer surfaces. The first supporting lead and the second supporting lead respectively fit into the first recess and the second recess. In the removing step, the packages are each removed from the lead frame by the third outer surface being pushed.

公开(公告)号：US20160181493A1

公开(公告)日：2016-06-23

申请号：US14973896

申请日：2015-12-18

Applicant: NICHIA CORPORATION

Inventor： Tomohide MIKI

IPC: H01L33/62 ,  H01L33/64 ,  H01L33/56

CPC classification number: H01L33/647 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting device, includes: a package equipped with a lead having an upper surface and a lower surface, and a metal board and a plating layer, the upper surface including a mounting portion, the metal board whose main component is copper, the plating layer including a first plating layer and a second plating layer which are provided on the lower surface of the metal board, the first plating layer containing silver and nickel and being formed on the edge of the metal board, and the second plating layer containing no nickel and being formed on at least part of a region below the mounting portion, a molded resin that holds the lead so that the lower face of the lead is exposed to the outside; a light emitting element mounted on the mounting portion; and a sealing member that seals the light emitting element.

Abstract translation: 一种发光装置，包括：具有上表面和下表面的引线的封装，以及金属板和镀层，所述上表面包括安装部，所述金属板的主要成分为铜，所述镀层 所述第一镀层和第二镀层设置在所述金属板的下表面上，所述第一镀层含有银和镍并形成在所述金属板的边缘上，所述第二镀层不含镍 并且形成在所述安装部分下方的区域的至少一部分上;保持所述引线使得所述引线的下表面暴露于外部的模制树脂; 安装在所述安装部上的发光元件; 以及密封所述发光元件的密封构件。

公开(公告)号：US20160049566A1

公开(公告)日：2016-02-18

申请号：US14928570

申请日：2015-10-30

Applicant: NICHIA CORPORATION

Inventor： Hirofumi ICHIKAWA ,  Masaki HAYASHI ,  Shimpei SASAOKA ,  Tomohide MIKI

IPC: H01L33/64 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L33/486 ,  B29C45/0055 ,  B29C45/14655 ,  B29C2793/009 ,  H01L24/97 ,  H01L33/0095 ,  H01L33/504 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means of an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.

Abstract translation: 一种制造具有树脂封装的发光器件的方法，所述树脂封装在热固化之后在350nm和800nm之间的波长处提供等于或大于70％的光学反射率，并且其中树脂部分和引线形成在 在外侧表面上具有大致相同的平面，包括通过上模和下模夹着设置有切口部的引线框架的步骤，将含有光反射材料的热固性树脂转印成型 模具夹在上模具和下模具之间以在引线框架中形成树脂模制体，以及沿切口部分切割树脂模制体和引线框架的步骤。

公开(公告)号：US20150129923A1

公开(公告)日：2015-05-14

申请号：US14603148

申请日：2015-01-22

Applicant: NICHIA CORPORATION

Inventor： Masato FUJITOMO ,  Hiroto TAMAKI ,  Shinji NISHIJIMA ,  Yuichiro TANDA ,  Tomohide MIKI

IPC: H01L33/62 ,  H01L31/0203 ,  H01L33/52 ,  H01L31/02

CPC classification number: H01L33/62 ,  H01L24/97 ,  H01L25/167 ,  H01L31/02002 ,  H01L31/0203 ,  H01L33/486 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2924/00012

Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.

Abstract translation: 一种制造光半导体器件的方法，包括在支撑衬底上形成彼此分开设置的多个第一和第二导电构件; 提供由第一和第二导电构件之间的光阻树脂形成的基底构件; 将光学半导体元件安装在第一和/或第二导电构件上; 通过由半透明树脂形成的密封构件覆盖光学半导体元件; 并且在去除支撑衬底之后获得单独的光学半导体器件。