公开(公告)号：US12027656B2

公开(公告)日：2024-07-02

申请号：US17431073

申请日：2020-02-17

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Zitzlsperger ,  Matthias Goldbach ,  Benjamin Höflinger

IPC: H01L27/15 ,  H01L23/495 ,  H01L25/075 ,  H01L33/00 ,  H01L33/48 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L33/62 ,  H01L23/495 ,  H01L25/0753 ,  H01L33/005 ,  H01L33/486 ,  H01L33/60 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: In one embodiment, the optoelectronic semiconductor device comprises at least two metallic lead frame parts and a circuit chip on the lead frame parts. An electrically insulating and opaque matrix material mechanically connects the lead frame parts. The circuit chip is embedded in the matrix material, so that a carrier is formed by the matrix material together with the lead frame parts and the circuit chip. An optoelectronic semiconductor chip is provided on a carrier upper side. Furthermore, the semiconductor device comprises at least one optical component on the carrier upper side.

公开(公告)号：US09876154B2

公开(公告)日：2018-01-23

申请号：US15105539

申请日：2014-12-18

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Zitzlsperger

IPC: H01L25/04 ,  H01L25/075 ,  H01L31/02 ,  H01L31/0232 ,  H01L33/58 ,  H01L33/62 ,  H01L23/495 ,  F21S2/00

CPC classification number: H01L33/62 ,  F21S2/005 ,  H01L23/495 ,  H01L25/042 ,  H01L25/0753 ,  H01L31/02005 ,  H01L31/02327 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An optoelectronic component includes a housing that includes a rectangular basic shape with four sides. The sides each merge into one another at a corner point. At least two carrier arms of two contact elements of a lead frame are guided to an edge of the housing. The two carrier arms are arranged on different sides of the housing. The two carrier arms are each at different spacings from the two corner points of the side on which the carrier arms are arranged. The spacings differ at least in the width of a carrier arm.

公开(公告)号：US09853198B2

公开(公告)日：2017-12-26

申请号：US15022573

申请日：2014-09-18

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Zitzlsperger ,  Christian Ziereis ,  Tobias Gebuhr

IPC: H01L23/00 ,  H01L33/48 ,  H01L33/54 ,  H01L33/62 ,  H01L21/66 ,  H01L33/58

CPC classification number: H01L33/62 ,  H01L22/14 ,  H01L33/483 ,  H01L33/486 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48479 ,  H01L2924/00014 ,  H01L2924/19107 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2224/48471 ,  H01L2924/00 ,  H01L2224/4554

Abstract: An optoelectronic component includes a housing including a plastic material and a first lead frame section at least partly embedded in the plastic material, a first recess and a second recess, wherein a first upper section of an upper side of the first lead frame section is not covered by the plastic material in the first recess, a second upper section of the upper side of the first lead frame section is not covered by the plastic material in the second recess, the first recess and the second recess are separated from one another by a section of the plastic material, an optoelectronic semiconductor chip is arranged in the first recess, and no optoelectronic semiconductor chips is arranged in the second recess.

公开(公告)号：US20170179353A1

公开(公告)日：2017-06-22

申请号：US15327009

申请日：2015-07-14

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Daniel Richter ,  Michael Zitzlsperger ,  Christian Ziereis ,  Stefan Gruber

IPC: H01L33/62 ,  H01L33/48 ,  H01L27/02 ,  H01L25/075 ,  H01L25/16

CPC classification number: H01L23/49541 ,  H01L23/49503 ,  H01L23/4951 ,  H01L23/49575 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/0248 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/49113

Abstract: An electronic component, a leadframe, and a method for producing an electronic component are disclosed. In an embodiment, the electronic component includes a housing and a leadframe section partly embedded in the housing, wherein the leadframe section includes a first quadrant, a second quadrant, a third quadrant and a fourth quadrant, wherein each of the quadrants has a first leadframe part and a second leadframe part, wherein each first leadframe part includes a chip landing area, wherein the chip landing areas of all four quadrants are arranged adjacently to a common central region of the leadframe section, and wherein the four quadrants are configured symmetrically with respect to one another.

公开(公告)号：US20160254424A1

公开(公告)日：2016-09-01

申请号：US15054585

申请日：2016-02-26

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Zitzlsperger ,  Matthias Lermer ,  Roland Fischl

IPC: H01L33/54 ,  H01L33/62 ,  H01L33/44 ,  H01L33/08 ,  H01L33/60

CPC classification number: H01L33/54 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/24245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2924/1815 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2924/00014

Abstract: A method of producing an optoelectronic lighting device includes providing a carrier on which is arranged at least one light-emitting diode including a surface that emits light during operation of the light-emitting diode, carrying out an injection molding process to encapsulate the light-emitting diode by molding as far as the light-emitting surface such that a molded housing is formed within which the light-emitting diode is encapsulated by molding, wherein the light-emitting surface remains at least partly free, shaping a reflector that reflects light emitted by the light-emitting surface during the injection molding process such that the reflector is formed integrally with the housing, at least partly masking the light-emitting surface, coating the reflector with a light-reflecting layer after the masking, and demasking the light-emitting surface after the coating.

Abstract translation: 一种光电子照明装置的制造方法，其特征在于，在所述载体上配置有至少一个发光二极管，所述至少一个发光二极管包括在所述发光二极管的操作期间发光的表面，进行注射成型工艺以封装所述发光二极管 二极管，通过模制到发光表面，使得形成模制外壳，其中通过模制封装发光二极管，其中发光表面保持至少部分自由，成形反射由 在注射成型过程中的发光表面使得反射器与壳体一体地形成，至少部分地遮蔽发光表面，在掩模之后用光反射层涂覆反射器，并且去除发光 表面涂层后。

公开(公告)号：US09231179B2

公开(公告)日：2016-01-05

申请号：US14356554

申请日：2012-12-13

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Zitzlsperger

IPC: H01L23/60 ,  H01L21/66 ,  H01L33/62 ,  H01L33/00 ,  H01L23/00 ,  H01L23/495 ,  H01L33/48

CPC classification number: H01L33/62 ,  H01L22/14 ,  H01L22/32 ,  H01L23/49541 ,  H01L23/49562 ,  H01L23/60 ,  H01L24/97 ,  H01L33/0095 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method for producing a packaged component is disclosed. In one embodiment, a lead frame composite has first lead frame parts, second lead frame parts and test contacts, electrically connecting via first electrical connections the first lead frame parts to the other first lead frame parts. A potting body is formed on the lead frame composite thereby mechanically connecting the first lead frame parts to the second lead frame parts and encapsulating the first electrical connections. First semiconductor components are placed on the first lead frame parts after forming the potting body. The first semiconductor components are electrically connected to the second lead frame parts via second electrical connections. The first semiconductor components are electrically tested at the test contacts prior to singulating the lead frame composite and the potting body. The lead frame composite and the potting body are singulated thereby forming the packaged semiconductor components.

Abstract translation: 公开了一种制造封装件的方法。 在一个实施例中，引线框架复合材料具有第一引线框架部件，第二引线框架部件和测试触点，通过第一电连接将第一引线框架部件电连接到其它第一引线框架部件。 在引线框架复合体上形成灌封体，从而将第一引线框架部件机械地连接到第二引线框架部件并封装第一电连接。 第一半导体部件在形成灌封体之后放置在第一引线框架部件上。 第一半导体部件经由第二电连接与第二引线框部件电连接。 在分离引线框架复合材料和灌封体之前，在测试触点处对第一半导体部件进行电测试。 引线框架复合体和灌封体被分割，从而形成封装的半导体部件。

公开(公告)号：US20150333232A1

公开(公告)日：2015-11-19

申请号：US14654500

申请日：2013-12-17

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Stephan Preuß ,  Michael Zitzlsperger ,  Caroline Kistner

IPC: H01L33/48 ,  H01L33/60 ,  H01L33/62 ,  H01L33/54

CPC classification number: H01L33/486 ,  H01L24/97 ,  H01L33/505 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method for producing an optoelectronic thin-film chip semiconductor device is specified. A conductor structure is applied on a carrier and a multiplicity of optoelectronic semiconductor chips are arranged between the conductor structures. Each of the optoelectronic semiconductor chips includes a layer at a top side. Furthermore, electrical connections between semiconductor chip and the conductor structure are established, for instance using a bonding wire. The semiconductor chips and the conductor structure are surrounded with a molded body. The molded body does not project beyond the optoelectronic semiconductor chips at the top side thereof facing away from the carrier. Moreover, the carrier is removed and the semiconductor chips surrounded by molding are singulated.

Abstract translation: 规定了制造光电薄膜芯片半导体器件的方法。 导体结构被施加在载体上，并且多个光电半导体芯片布置在导体结构之间。 每个光电半导体芯片包括在顶侧的层。 此外，建立了半导体芯片和导体结构之间的电连接，例如使用接合线。 半导体芯片和导体结构被成型体包围。 成型体在远离载体的顶侧不会突出超过光电子半导体芯片。 此外，移除载体，并且通过模制包围的半导体芯片被分割。

公开(公告)号：US20150228873A1

公开(公告)日：2015-08-13

申请号：US14426072

申请日：2013-08-28

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Tobias Gebuhr ,  Matthias Knörr ,  Klaus Müller ,  Thomas Schwarz ,  Frank Singer ,  Michael Zitzlsperger

IPC: H01L33/62 ,  H01L21/56 ,  H01L21/48 ,  H01L51/56 ,  H01L51/52

CPC classification number: H01L33/483 ,  H01L21/4828 ,  H01L21/565 ,  H01L23/49861 ,  H01L24/32 ,  H01L25/0753 ,  H01L33/62 ,  H01L51/5237 ,  H01L51/5246 ,  H01L51/5296 ,  H01L51/56 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/92247 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2933/0066 ,  Y10T29/49121 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A housing for an optical component is provided in various embodiments. The housing has a leadframe section and a mold compound. The leadframe section is formed from an electrically conductive material and has a first side and a second side facing away from the first side. On the first side, the leadframe section has at least one first receiving region for receiving the optical component and/or at least one contact region for electrically contacting the optical component. The leadframe section has at least one trench which is formed in the leadframe section on the first side thereof alongside the receiving region and/or the contact region. The leadframe section is embedded in the mold compound. The mold compound has at least one receiving recess in which the first receiving region and/or the contact region and the trench are arranged.

Abstract translation: 在各种实施例中提供了用于光学部件的壳体。 壳体具有引线框架部分和模具复合体。 引线框架部分由导电材料形成，并且具有背离第一侧的第一侧和第二侧。 在第一侧，引线框架部分具有用于接收光学部件的至少一个第一接收区域和/或用于电接触光学部件的至少一个接触区域。 引线框架部分具有沿着接收区域和/或接触区域在其第一侧上的引线框架部分中形成的至少一个沟槽。 引线框架部分嵌入模具化合物中。 模具化合物具有至少一个容纳凹槽，其中布置有第一接收区域和/或接触区域和沟槽。

公开(公告)号：US20150144985A1

公开(公告)日：2015-05-28

申请号：US14607993

申请日：2015-01-28

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Zitzlsperger ,  Stefan Groetsch

IPC: H05K1/18 ,  H01L31/0203 ,  H01L33/48

CPC classification number: H05K1/181 ,  H01L31/0203 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/16057 ,  H01L2224/16105 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/10106 ,  H05K2201/1084 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: An electronic device includes a base body, which has a top side and also an underside lying opposite the top side. The base body has connection locations at its underside. An electronic component is arranged at the base body at the top side of the base body. The base body has at least one side area having at least one point of inspection having a first region and second region. The second region is embodied as an indentation in the first region. The first and the second region contain different materials.

Abstract translation: 电子设备包括基体，该基体具有顶侧，并且还具有与顶侧相对的下侧。 基体在其下侧具有连接位置。 在基体的顶侧设置有电子部件。 基体具有至少一个具有至少一个检查点的侧面区域，具有第一区域和第二区域。 第二个地区体现为第一个地区的缩进。 第一和第二区域包含不同的材料。

公开(公告)号：US20150108531A1

公开(公告)日：2015-04-23

申请号：US14398557

申请日：2013-05-07

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz ,  Stefan Grötsch ,  Michael Zitzlsperger

IPC: H01L33/62 ,  H01L33/64 ,  H01L21/48 ,  H01L23/495

CPC classification number: H01L33/62 ,  H01L21/4828 ,  H01L23/49568 ,  H01L33/64 ,  H01L33/644 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2933/0066 ,  H01L2933/0075 ,  Y10T29/49121 ,  H01L2924/00 ,  H01L2224/4554

Abstract: A method of producing a component carrier for an electronic component includes a lead frame section including an electrically conductive material, the lead frame section having a first contact section that forms a first electrical contact element, a second contact section that forms a second electrical contact element, and a reception region that receives the electronic component, at least the reception region and the second contact section being electrically conductively connected to one another, a thermally conductive and electrically insulating intermediate element that dissipates heat from the reception region and electrically insulates the reception region formed at least on an opposite side of the lead frame section from the reception region, and a thermal contact that thermally contacts the electronic component formed at least on a side of the intermediate element facing away from the reception region.

Abstract translation: 一种制造电子部件用部件载体的方法包括：引线框架部分，其包括导电材料，所述引线框架部分具有形成第一电接触元件的第一接触部分，形成第二电接触元件的第二接触部分 以及接收电子部件的接收区域，至少所述接收区域和所述第二接触部彼此导电连接，导热和电绝缘的中间元件，其从所述接收区域散热并使所述接收区域电绝缘 至少在引线框架部分的与接收区域相反的一侧上形成热接触部，该热接触部与形成在远离接收区域的中间元件的至少一侧形成的电子部件热接触。