公开(公告)号：US20150102368A1

公开(公告)日：2015-04-16

申请号：US14575913

申请日：2014-12-18

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Ralph Wirth ,  Alexander Linkov

IPC: H01L27/15 ,  H01L33/50 ,  H01L33/48 ,  H01L33/60

CPC classification number: H01L25/0753 ,  H01L27/15 ,  H01L33/30 ,  H01L33/32 ,  H01L33/483 ,  H01L33/50 ,  H01L33/502 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2933/0091 ,  H01L2924/00

Abstract: An optoelectronic component can be used for mixing electromagnetic radiation having different wavelengths, in particular in the far field. The optoelectronic component includes a carrier. A first semiconductor chip has a first radiation exit surface for emitting electromagnetic radiation in a first spectral range is provided on the carrier and a second semiconductor chip as a second radiation exit surface for emitting electromagnetic radiation in a second spectral range is provided on the carrier. A diffusing layer is provided on the radiation exit surfaces of the semiconductor chips which face away from the carrier.

Abstract translation: 光电子部件可用于混合具有不同波长的电磁辐射，特别是在远场中。 光电子部件包括载体。 第一半导体芯片具有用于在第一光谱范围内发射电磁辐射的第一辐射出射表面，并且在载体上设置第二半导体芯片作为用于在第二光谱范围内发射电磁辐射的第二辐射出射表面。 在半导体芯片的远离载体的辐射出射表面上设置漫射层。

公开(公告)号：US20130140580A1

公开(公告)日：2013-06-06

申请号：US13750966

申请日：2013-01-25

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Ralph Wirth ,  Alexander Linkov

IPC: H01L33/30

CPC classification number: H01L25/0753 ,  H01L27/15 ,  H01L33/30 ,  H01L33/32 ,  H01L33/483 ,  H01L33/50 ,  H01L33/502 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2933/0091 ,  H01L2924/00

Abstract: An optoelectronic component can be used for mixing electromagnetic radiation having different wavelengths, in particular in the far field. The optoelectronic component includes a carrier. A first semiconductor chip has a first radiation exit surface for emitting electromagnetic radiation in a first spectral range is provided on the carrier and a second semiconductor chip as a second radiation exit surface for emitting electromagnetic radiation in a second spectral range is provided on the carrier. A diffusing layer is provided on the radiation exit surfaces of the semiconductor chips which face away from the carrier.

公开(公告)号：US20230352617A1

公开(公告)日：2023-11-02

申请号：US18212935

申请日：2023-06-22

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Karl Weidner ,  Ralph Wirth ,  Axel Kaltenbacher ,  Walter Wegleiter ,  Bernd Barchmann ,  Oliver Wutz ,  Jan Marfeld

IPC: H01L33/00 ,  H01L33/48 ,  H01L33/62 ,  H01L25/075 ,  H01L23/31 ,  H01L31/0232 ,  H01L33/60 ,  H01L31/0203 ,  H01L33/56 ,  H01L25/04 ,  H01L31/02 ,  H01L33/50 ,  H01L31/18

CPC classification number: H01L33/0093 ,  H01L33/486 ,  H01L33/62 ,  H01L25/0753 ,  H01L23/3185 ,  H01L31/0232 ,  H01L33/60 ,  H01L31/0203 ,  H01L31/02327 ,  H01L33/483 ,  H01L33/56 ,  H01L23/3107 ,  H01L25/042 ,  H01L31/02005 ,  H01L33/502 ,  H01L31/02322 ,  H01L31/1892 ,  H01L33/54

Abstract: An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a top area at a top side, a bottom area at an underside, at least one side area connecting the top area and the bottom area; electrical contact locations at the top area or at the bottom area of the optoelectronic semiconductor chip; and a molded body, wherein the molded body surrounds the optoelectronic semiconductor chip at all side areas at least in places, the molded body is electrically insulating, and the molded body is free of any conductive element that completely penetrates the molded body.

公开(公告)号：US20220151564A1

公开(公告)日：2022-05-19

申请号：US17440657

申请日：2020-03-24

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Sergey Kudaev ,  Reiner Windisch ,  Dennis Sprenger ,  Ralph Wirth ,  Thomas Klafta

IPC: A61B5/00 ,  A61B5/024

Abstract: In an embodiment a vital sign sensor includes an emitter component configured to emit light, a detector component configured to detect light, a first layer of a substantially transparent material, wherein the emitter component is embedded in the first layer, and a second layer of a light scattering material arranged on the first layer, wherein the second layer includes converter particles, and wherein the first layer and the second layer are surrounded by at least one wall of a reflective material.

公开(公告)号：US10355174B2

公开(公告)日：2019-07-16

申请号：US15738427

申请日：2016-07-12

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus Maute ,  Lutz Höppel ,  Jürgen Moosburger ,  Thomas Schwarz ,  Matthias Sabathil ,  Ralph Wirth ,  Alexander Linkov ,  Johannes Baur

IPC: H01L33/20 ,  H01L33/24 ,  H01L33/30 ,  H01L33/38 ,  H01L33/40 ,  H01L33/46 ,  H01L33/60 ,  H01L33/62

Abstract: A component includes a carrier and a semiconductor body arranged on the carrier, wherein the semiconductor body has an active layer arranged between the first and second semiconductor layers and is configured to generate, during operation of the component, an electromagnetic radiation that can be coupled out from the component through a first main surface, the first main surface of the component has an electrical contact layer configured to electrically contact a first semiconductor layer and in a plan view the carrier covers the first main surface in places, and in direct vicinity of the electrical contact layer the component includes a shielding structure configured to prevent electromagnetic radiation generated by the active layer from impinging onto the contact layer.

公开(公告)号：US10050022B2

公开(公告)日：2018-08-14

申请号：US15342261

申请日：2016-11-03

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Ralph Wirth ,  Alexander Linkov

IPC: H01L33/60 ,  H01L33/56 ,  H01L33/54 ,  H01L25/075 ,  H01L33/50 ,  H01L27/15 ,  H01L33/48 ,  H01L33/58 ,  H01L33/30 ,  H01L33/32

Abstract: An optoelectronic component for mixing electromagnetic radiation having different wavelengths, for example, for the far field is disclosed. In an embodiment the optoelectronic component includes a carrier, at least one first semiconductor chip arranged on the carrier and having a first radiation exit surface for emitting electromagnetic radiation in a first spectral range and at least one second semiconductor chip arranged on the carrier and having a second radiation exit surface for emitting electromagnetic radiation in a second spectral range, wherein a diffusing layer is arranged on the first and second radiation exit surfaces of the semiconductor chips that face away from the carrier and wherein a reflecting layer is arranged between the first semiconductor chip and the second semiconductor chip, the first and second radiation exit surfaces being free from the reflecting layer at least in regions.

公开(公告)号：US20180182926A1

公开(公告)日：2018-06-28

申请号：US15738427

申请日：2016-07-12

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus Maute ,  Lutz Höppel ,  Jürgen Moosburger ,  Thomas Schwarz ,  Matthias Sabathil ,  Ralph Wirth ,  Alexander Linkov ,  Johannes Baur

IPC: H01L33/46 ,  H01L33/62 ,  H01L33/38 ,  H01L33/24 ,  H01L33/60

CPC classification number: H01L33/46 ,  H01L33/20 ,  H01L33/24 ,  H01L33/30 ,  H01L33/382 ,  H01L33/385 ,  H01L33/405 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0083 ,  H01L2933/0091

Abstract: A component includes a carrier and a semiconductor body arranged on the carrier, wherein the semiconductor body has an active layer arranged between the first and second semiconductor layers and is configured to generate, during operation of the component, an electromagnetic radiation that can be coupled out from the component through a first main surface, the first main surface of the component has an electrical contact layer configured to electrically contact a first semiconductor layer and in a plan view the carrier covers the first main surface in places, and in direct vicinity of the electrical contact layer the component includes a shielding structure configured to prevent electromagnetic radiation generated by the active layer from impinging onto the contact layer.