公开(公告)号：US20050091081A1

公开(公告)日：2005-04-28

申请号：US10777072

申请日：2004-02-13

申请人： Soo Jun Park ,  Tae Hyun Kim ,  Hyun Sook Lee ,  Hyun Chul Jang ,  Seon Hee Park

发明人： Soo Jun Park ,  Tae Hyun Kim ,  Hyun Sook Lee ,  Hyun Chul Jang ,  Seon Hee Park

IPC分类号： G06F17/20 ,  G06Q50/00 ,  G06F17/60

CPC分类号： G06Q50/22 ,  G06F19/00 ,  Y10S707/99933 ,  Y10S707/99943

摘要： The present invention relates to an apparatus and method for recognizing biological named entity from biological literature based on united medical language system (UMLS). The apparatus and the method receives metathesaurus from the UMLS, constructs a concept name database, a single name database and a category keyterm database, which are language resources to be used recognize a named entity, receives each concept name stored in the concept name database, extracts features of each of the concept names by using data stored in the single name database and the category keyterm database, constructs a rule database by creating rules used to recognize the named entity and filtering the rules by using the extracted features, receives a biological literature, extracts nouns and noun phrases that are candidate named entities, applies the rules stored in the rule database to the nouns and the noun phrases, and recognizes the named entities. In the present invention, the biological named entities can be effectively extracted which can be used as important information individual in input literature.

摘要翻译： 本发明涉及一种基于联合医学语言系统（UMLS）从生物文献识别生物命名实体的装置和方法。 该装置和方法从UMLS接收metathesaurus，构建一个概念名称数据库，一个单一名称数据库和一个类别keyterm数据库，它们是用于识别命名实体的语言资源，接收存储在概念名称数据库中的每个概念名称， 通过使用存储在单个名称数据库和类别keyterm数据库中的数据来提取每个概念名称的特征，通过创建用于识别命名实体的规则并通过使用提取的特征来过滤规则来构建规则数据库，接收生物文献 提取作为候选名称实体的名词和名词短语，将存储在规则数据库中的规则应用于名词和名词短语，并识别命名实体。 在本发明中，可以有效地提取生物名称的实体，其可以用作输入文献中个体的重要信息。

公开(公告)号：US08638590B2

公开(公告)日：2014-01-28

申请号：US12892237

申请日：2010-09-28

申请人： Wuyang Hao ,  Jungwon Suh ,  Kangho Lee ,  Tae Hyun Kim ,  Jung Pill Kim ,  Seung H. Kang

发明人： Wuyang Hao ,  Jungwon Suh ,  Kangho Lee ,  Tae Hyun Kim ,  Jung Pill Kim ,  Seung H. Kang

IPC分类号： G11C11/00

CPC分类号： G11C13/0069 ,  G11C11/16 ,  G11C11/1653 ,  G11C11/1659 ,  G11C11/1673 ,  G11C11/1675 ,  G11C13/0002 ,  G11C13/003 ,  G11C2213/72 ,  G11C2213/74

摘要： A resistance-based memory has a two-diode access device. In a particular embodiment, a method includes biasing a bit line and a sense line to generate a current through a resistance-based memory element via a first diode or a second diode. A cathode of the first diode is coupled to the bit line and an anode of the second diode is coupled to the sense line.

摘要翻译： 基于电阻的存储器具有二极管存取装置。 在特定实施例中，一种方法包括偏置位线和感测线以经由第一二极管或第二二极管通过基于电阻的存储器元件产生电流。 第一二极管的阴极耦合到位线，并且第二二极管的阳极耦合到感测线。

公开(公告)号：US08587994B2

公开(公告)日：2013-11-19

申请号：US13177992

申请日：2011-07-07

申请人： Jung Pill Kim ,  Tae Hyun Kim

发明人： Jung Pill Kim ,  Tae Hyun Kim

IPC分类号： G11C11/00 ,  G11C7/02

CPC分类号： G11C11/1693 ,  G11C11/1673

摘要： Resistance memory cells of MRAM arrays are designated as reference cells and programmed to binary 0 and binary 1 states, reference cells from one MRAM array at binary 0 and at binary 1 are concurrently accessed to obtain a reference voltage to read resistance memory cells of another MRAM array, reference cells from the other MRAM array at binary 0 and binary 1 are concurrently accessed to obtain a reference voltage to read resistance memory cells of the one MRAM array.

摘要翻译： 将MRAM阵列的电阻存储单元指定为参考单元，并编程为二进制0和二进制1状态，同时访问来自二进制0和二进制1的一个MRAM阵列的参考单元以获得参考电压以读取另一MRAM的电阻存储单元 数组，二进制0和二进制1的另一个MRAM阵列的参考单元被同时访问，以获得读取一个MRAM阵列的电阻存储单元的参考电压。

公开(公告)号：US08420152B2

公开(公告)日：2013-04-16

申请号：US12598157

申请日：2008-05-07

申请人： Deuk Hoi Kim ,  Tae Hyun Kim

发明人： Deuk Hoi Kim ,  Tae Hyun Kim

IPC分类号： A23L1/305

CPC分类号： A23L33/175 ,  A23L27/40

摘要： Disclosed herein is a salt substitute obtained from a Salicornia species. The salt substitute has a high content of phyto-organic minerals from a Salicornia species and low sodium content, which are beneficial to the health of humans. The salt substitute also contains minerals, such as potassium or magnesium, which facilitate sodium excretion from the body and thus reduce the harmful effects of sodium accumulated in the body. Further, the salt substitute has a mineral balance created by the plant's innate metabolism and tastes salty enough for use as a substitute for table salt, and contains organic nutrients including amino acids, which are nutritionally beneficial and reduce the bitterness of minerals present in large amounts, thereby providing a good taste.

摘要翻译： 本文公开了从Salicornia物种获得的盐替代物。 盐替代物具有高含量的Salicornia物种的植物有机矿物质和低钠含量，这有利于人类的健康。 盐替代物还含有矿物质，例如钾或镁，其促进体内钠的排泄，从而减少积累在体内的钠的有害影响。 此外，盐替代物具有由植物的先天代谢产生的矿物平衡，并且具有足够的咸味，可用作表盐的替代物，并且含有营养有益的有机营养物质，并且减少大量存在的矿物质的苦味 ，从而提供良好的味道。

公开(公告)号：US08309399B2

公开(公告)日：2012-11-13

申请号：US13246615

申请日：2011-09-27

申请人： Shan Gao ,  Seog Moon Choi ,  Tae Hyun Kim ,  Ju Pyo Hong ,  Bum Sik Jang ,  Ji Hyun Park

发明人： Shan Gao ,  Seog Moon Choi ,  Tae Hyun Kim ,  Ju Pyo Hong ,  Bum Sik Jang ,  Ji Hyun Park

IPC分类号： H01L21/50

CPC分类号： H01L25/072 ,  H01L23/3121 ,  H01L23/3735 ,  H01L23/427 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/071 ,  H01L25/50 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed herein is a power semiconductor module. The module includes metal plates each having a first through hole, with an anodic oxidation layer formed on a surface of metal plates and an interior of the first through hole. A cooling member has a second through hole at a position corresponding to the first through hole, and the metal plates are attached to both sides of the cooling member. A circuit layer is formed on the anodic oxidation layer and performs an interlayer connection through a via formed in the first and second through holes. A power device is connected to the circuit layer. A resin encapsulant encloses the circuit layer and the power device. A housing is installed to each of the metal plates to form a sealing space for the resin encapsulant.

摘要翻译： 这里公开了功率半导体模块。 模块包括各自具有第一通孔的金属板，阳极氧化层形成在金属板的表面和第一通孔的内部。 冷却构件在与第一通孔对应的位置具有第二通孔，并且金属板附接到冷却构件的两侧。 在阳极氧化层上形成电路层，通过在第一和第二通孔中形成的通孔进行层间连接。 电源设备连接到电路层。 树脂密封剂包围电路层和功率器件。 每个金属板上安装有一个壳体，以形成树脂密封剂的密封空间。

公开(公告)号：US08173404B1

公开(公告)日：2012-05-08

申请号：US12381890

申请日：2009-03-17

申请人： Tae Hyun Kim ,  Kevin Hicks ,  Frank Taylor

发明人： Tae Hyun Kim ,  Kevin Hicks ,  Frank Taylor

IPC分类号： C12P7/58

CPC分类号： C12P19/02 ,  C12P7/10 ,  C12P19/14 ,  C12P2201/00 ,  C13K1/02 ,  Y02E50/16

摘要： A process for obtaining fermentable sugars from barley, involving treating hulled barley with H2SO4 to produce acid treated barley and treating the acid treated barley with enzymes to produce fermentable sugars.

摘要翻译： 一种从大麦获得可发酵糖的方法，包括用H 2 SO 4处理外壳大麦以产生酸处理的大麦，并用酶处理酸处理的大麦以产生可发酵的糖。

公开(公告)号：US20110042130A1

公开(公告)日：2011-02-24

申请号：US12654529

申请日：2009-12-22

申请人： Chang Hyun Lim ,  Tae Hoon Kim ,  Young Ki Lee ,  Tae Hyun Kim ,  Ki Ho Seo

发明人： Chang Hyun Lim ,  Tae Hoon Kim ,  Young Ki Lee ,  Tae Hyun Kim ,  Ki Ho Seo

IPC分类号： H05K1/11 ,  H01K3/10 ,  H05K3/36

CPC分类号： H05K3/4641 ,  H05K1/053 ,  H05K3/445 ,  H05K3/4623 ,  H05K2203/0315 ,  Y10T29/49126 ,  Y10T29/49162

摘要： A multilayered wiring substrate and a manufacturing method thereof are disclosed. The multilayered wiring substrate includes: a stacked body including an insulating member and first and second metal cores stacked with the insulating member interposed therebetween, and having a through hole penetrating the first and second metal cores; first and second insulation layers formed on an external surface, excluding an inner wall of the through hole, of the first and second metal cores, respectively; first and second inner layer circuit patterns and first and second outer layer circuit patterns formed on the first and second insulation layers, respectively; first and second via electrodes electrically connecting the first and second inner layer circuit patterns and the first and second outer layer circuit patterns; a third insulation layer formed on the inner wall of the through hole; and a through electrode made of a conductive material filled in the through hole and electrically connecting the first and second outer layer circuit patterns.

摘要翻译： 公开了一种多层布线基板及其制造方法。 所述多层布线基板包括：堆叠体，其包括绝缘部件和被插入其间的所述绝缘部件堆叠的第一和第二金属芯体，并且具有穿过所述第一和第二金属芯体的通孔; 第一和第二绝缘层分别形成在第一和第二金属芯的外表面上，不包括通孔的内壁; 分别形成在第一绝缘层和第二绝缘层上的第一和第二内层电路图案和第一和第二外层电路图案; 第一和第二通孔电极，电连接第一和第二内层电路图案以及第一和第二外层电路图案; 形成在所述通孔的内壁上的第三绝缘层; 以及由填充在所述通孔中的导电材料制成的电连接电连接所述第一外层电路图案和所述第二外层电路图案的贯通电极。

公开(公告)号：US07679928B2

公开(公告)日：2010-03-16

申请号：US12232251

申请日：2008-09-12

申请人： Tae Hyun Kim ,  Sung Taek Kwon ,  Tae Ha Lee ,  Dong Kuk Kim

发明人： Tae Hyun Kim ,  Sung Taek Kwon ,  Tae Ha Lee ,  Dong Kuk Kim

IPC分类号： H05K7/10

CPC分类号： H01L24/33 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/04042 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： Provided is a system-in-package module including a system circuit board; a first element that is disposed on the system circuit board; a second element that is disposed on the first element so as to be shifted to one side from the center of the first element, while partially exposing the first element; a third element that is electrically connected to the system circuit board and is disposed on the second element; and a plurality of bump pads that are disposed on the bottom surface of the system circuit board.

摘要翻译： 提供了一种包括系统电路板的系统级封装模块; 布置在所述系统电路板上的第一元件; 第二元件，其设置在第一元件上，以便从第一元件的中心偏移到一侧，同时部分地暴露第一元件; 电连接到所述系统电路板并设置在所述第二元件上的第三元件; 以及设置在所述系统电路板的底面上的多个凸点焊盘。

公开(公告)号：US20100032409A1

公开(公告)日：2010-02-11

申请号：US12211006

申请日：2008-09-15

申请人： Seunghun Hong ,  Joohyung Lee ,  Tae Hyun Kim

发明人： Seunghun Hong ,  Joohyung Lee ,  Tae Hyun Kim

IPC分类号： B44C1/22

CPC分类号： H01L29/16 ,  B82Y10/00 ,  H01L21/3081 ,  H01L21/3083 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/1606

摘要： Nanoscale graphene structure fabrication techniques are provided. An oxide nanowire useful as a mask is formed on a graphene layer and then ion beam etching is performed. A nanoscale graphene structure is fabricated by removing a remaining oxide nanowire after the ion beam etching.

摘要翻译： 提供了纳米级石墨烯结构制造技术。 在石墨烯层上形成可用作掩模的氧化物纳米线，然后进行离子束蚀刻。 通过在离子束蚀刻之后去除剩余的氧化物纳米线来制造纳米尺度的石墨烯结构。

公开(公告)号：US20090316373A1

公开(公告)日：2009-12-24

申请号：US12230942

申请日：2008-09-08

申请人： Dong Kuk Kim ,  Tae Hyun Kim

发明人： Dong Kuk Kim ,  Tae Hyun Kim

IPC分类号： H05K1/18 ,  H05K3/36

CPC分类号： H05K1/185 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H05K1/186 ,  H05K1/188 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/10378 ,  H05K2201/10674 ,  Y10T29/49126

摘要： Provided is a PCB having chips embedded therein, the PCB including a first core substrate that has a first chip embedded therein, the first chip having a plurality of first pads provided on the top surface thereof, and first circuit patterns provided on both surfaces thereof; a second core substrate that is disposed under the first core substrate so as to be spaced at a predetermined space from the first core substrate and has a second chip embedded therein, the second chip having a plurality of second pads provided on the bottom surface thereof, and second circuit patterns provided on both surfaces thereof; a first insulating layer that is laminated on the first core substrate and has a plurality of first conductive bumps formed therein, the first conductive bumps passing through the first insulating layer and being connected to the first circuit patterns and the first pads; a second insulating layer that is laminated between the first core substrate and the second core substrate and has a plurality of second conductive bumps formed therein, the second conductive bumps passing through the second insulating layer and connecting the first circuit patterns to the second circuit patterns; and a third insulating layer that is laminated under the second core substrate and has a plurality of third conductive bumps formed therein, the third conductive bumps passing through the third insulating layer and being connected to the second circuit patterns and the second pads.

摘要翻译： 提供了具有嵌入其中的芯片的PCB，PCB包括具有嵌入其中的第一芯片的第一芯基板，第一芯片具有设置在其顶表面上的多个第一焊盘，以及设置在其两个表面上的第一电路图案; 第二芯基板，其设置在所述第一芯基板的下方，以与所述第一芯基板隔开预定空间，并且具有嵌入其中的第二芯片，所述第二芯片具有设置在其底表面上的多个第二焊盘， 和在其两个表面上提供的第二电路图案; 第一绝缘层，层叠在第一芯基板上，并且在其中形成有多个第一导电凸块，第一导电凸块穿过第一绝缘层并连接到第一电路图案和第一焊盘; 第二绝缘层，层叠在第一芯基板和第二芯基板之间，并且在其中形成有多个第二导电凸块，第二导电凸块穿过第二绝缘层并将第一电路图案连接到第二电路图案; 以及第三绝缘层，层叠在所述第二芯基板的下方，并且在其中形成有多个第三导电凸块，所述第三导电凸块通过所述第三绝缘层并且连接到所述第二电路图案和所述第二焊盘。