公开(公告)号：US20050189959A1

公开(公告)日：2005-09-01

申请号：US11029182

申请日：2005-01-03

Applicant: Adam Cohen ,  Ananda Kumar ,  Michael Lockard ,  Dennis Smalley

Inventor： Adam Cohen ,  Ananda Kumar ,  Michael Lockard ,  Dennis Smalley

IPC: G01R31/02 ,  H01L21/20

CPC classification number: B81C1/00111 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  G01R3/00

Abstract: Some embodiments of the invention are directed to the electrochemical fabrication of microprobes which are formed from a core material and a material that partially coats the surface of the probe. Other embodiments are directed to the electrochemical fabrication of microprobes which are formed from a core material and a material that completely coats the surface of each layer from which the probe is formed including interlayer regions. These first two groups of embodiments incorporate both the core material and the coating material during the formation of each layer. Still other embodiments are directed to the electrochemical fabrication of microprobe arrays that are partially encapsulated by a dielectric material during a post layer formation coating process. In even further embodiments, the electrochemical fabrication of microprobes from two or more materials may occur by incorporating a coating material around each layer of the structure without locating the coating material in inter-layer regions.

Abstract translation: 本发明的一些实施方案涉及由芯材料和部分涂覆探针的表面的材料形成的微针的电化学制造。 其它实施方案涉及由核心材料形成的微结构的电化学制造，以及完全涂覆形成探针的每个层的表面的材料，包括中间层区域。 这些前两组实施例在形成每个层期间都包括芯材料和涂层材料。 另外的其它实施例涉及在后层形成涂覆过程中由电介质材料部分封装的微探针阵列的电化学制造。 在甚至进一步的实施方案中，来自两种或更多种材料的微结构的电化学制造可以通过在结构的每一层周围并入涂层材料而不将涂层材料定位在层间区域中而进行。

公开(公告)号：US20050142739A1

公开(公告)日：2005-06-30

申请号：US11028958

申请日：2005-01-03

Applicant: Ananda Kumar ,  Ezekiel Kruglick ,  Adam Cohen ,  Kieun Kim ,  Gang Zhang

Inventor： Ananda Kumar ,  Ezekiel Kruglick ,  Adam Cohen ,  Kieun Kim ,  Gang Zhang

IPC: H01L21/8242

CPC classification number: G01R3/00 ,  G01R1/06738 ,  G01R1/07378

Abstract: Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates.

Abstract translation: 本发明的实施例涉及在临时衬底上形成微探针（即柔性电气或电子接触元件），切割单独的探针阵列，然后将阵列转移到空间变压器或其它永久衬底。

公开(公告)号：US20050016684A1

公开(公告)日：2005-01-27

申请号：US10627213

申请日：2003-07-25

Applicant: Jennifer Sun ,  Ananda Kumar ,  Senh Thach

Inventor： Jennifer Sun ,  Ananda Kumar ,  Senh Thach

IPC: H01L21/3065 ,  H01J37/32 ,  C23F1/00

CPC classification number: H01J37/32477 ,  H01J37/32642

Abstract: A process kit is described that resists plasma erosion, preserves the spatial uniformity of plasma properties, reduces particle generation in the chamber, and significantly enhances the lifetime of the process kit. A layer of polymer material covers the top surface of the process kit. The polymer material is fluorocarbon-based and not reactive with the species in the plasma. The polymer material not only protects the process kit from progressive erosion, but also prevents the generation of particles in the chamber. The polymer material has similar permittivity to that of the process kit and therefore maintains the spatial uniformity of plasma properties, e.g., etch rate, near the wafer perimeter. The thickness of the layer is controlled between 0.5 and 1.5 mm such that the difference between its coefficient of thermal expansion and that of the process kit will not cause the layer to peel off the process kit's top surface.

Abstract translation: 描述了一种防止等离子体侵蚀的过程套件，保持了等离子体性质的空间均匀性，减少了腔室中的颗粒产生，并显着提高了工艺套件的使用寿命。 一层聚合物材料覆盖了工艺套件的顶面。 聚合物材料是基于碳氟化合物的，并且不与等离子体中的物质反应。 聚合物材料不仅可保护工艺套件免受逐渐侵蚀，还可防止腔室中产生颗粒。 聚合物材料具有与处理试剂盒相似的介电常数，因此在晶片周边附近保持等离子体特性（例如蚀刻速率）的空间均匀性。 将该层的厚度控制在0.5至1.5mm之间，使得其热膨胀系数与处理套件的热导率差不会导致该层从工艺套件的顶部表面剥离。

公开(公告)号：US09224904B1

公开(公告)日：2015-12-29

申请号：US13557209

申请日：2012-07-25

Applicant: Ananda Kumar ,  Tue Nguyen

Inventor： Ananda Kumar ,  Tue Nguyen

IPC: H01L31/18 ,  H01L21/762 ,  H01L31/0224

CPC classification number: H01L31/1804 ,  H01L21/76254 ,  H01L31/022425

Abstract: Composite substrates include a silicon layer disposed on a ceramic layer. Different thermal expansion coefficient for the composite substrates can be achieved by changing the thermal expansion coefficient of the ceramic layer. Composite substrates can include two layers of silicon sandwiching a layer of ceramic.

Abstract translation: 复合衬底包括设置在陶瓷层上的硅层。 可以通过改变陶瓷层的热膨胀系数来实现复合衬底的不同热膨胀系数。 复合基板可以包括夹着一层陶瓷的两层硅。

公开(公告)号：US08004281B2

公开(公告)日：2011-08-23

申请号：US12879430

申请日：2010-09-10

Applicant: Paul A. Bottomley ,  Ananda Kumar

Inventor： Paul A. Bottomley ,  Ananda Kumar

IPC: G01V3/00

CPC classification number: G01R33/3415 ,  G01R33/3678

Abstract: Featured is a device for NMR or MRI signals from excited nuclei as well as related apparatus, systems and methods. The device includes a strip array antenna including one or more conductor and N reactive tuning components, where N is an integer ≧1 at least one of the N reactive components is electrically coupled to each of the one or more conductors as well as to ground/virtual ground. The apparent electrical length of the conductors is tuned with the reactive tuning components so it is equal to be about nλ/4, where n is an integer ≧1 and λ is the wavelength of the signal to be detected. The length of the strip also is such as to be substantially in the approximate range of 1.3 times the depth of interest. The strip conductors are also combined with loop coils to form quadrature detectors.

Abstract translation: 特色是用于激发核的NMR或MRI信号以及相关设备，系统和方法的设备。 该装置包括带状阵列天线，其包括一个或多个导体和N个非反应调谐组件，其中N是整数≥1，N个无功分量中的至少一个电耦合到一个或多个导体中的每一个以及接地/ 虚拟地面。 导体的表观电长度用无功调谐分量进行调谐，因此等于大约nλ/ 4，其中n是整数≧1，λ是待检测信号的波长。 条的长度也基本上在感兴趣深度的1.3倍的近似范围内。 带状导体也与环形线圈组合以形成正交检测器。

公开(公告)号：US20080213496A1

公开(公告)日：2008-09-04

申请号：US11890221

申请日：2007-08-02

Applicant: Jennifer Y. Sun ,  Shun Jackson Wu ,  Senh Thach ,  Ananda Kumar ,  Robert W. Wu ,  Hong Wang ,  Yixing Lin ,  Clifford C. Stow ,  Jim Dempster ,  Li Xu ,  Kenneth S. Collins ,  Ren-Guan Duan ,  Thomas Graves ,  Xiaoming He ,  Jie Yuan

Inventor： Jennifer Y. Sun ,  Shun Jackson Wu ,  Senh Thach ,  Ananda Kumar ,  Robert W. Wu ,  Hong Wang ,  Yixing Lin ,  Clifford C. Stow ,  Jim Dempster ,  Li Xu ,  Kenneth S. Collins ,  Ren-Guan Duan ,  Thomas Graves ,  Xiaoming He ,  Jie Yuan

IPC: C23C4/10 ,  C23C14/34

CPC classification number: C23C28/042 ,  C23C4/11 ,  C23C4/18 ,  C23C16/4404

Abstract: Methods of applying specialty ceramic materials to semiconductor processing apparatus, where the specialty ceramic materials are resistant to halogen-comprising plasmas. The specialty ceramic materials contain at least one yttrium oxide-comprising solid solution. Some embodiments of the specialty ceramic materials have been modified to provide a resistivity which reduces the possibility of arcing within a semiconductor processing chamber.

Abstract translation: 将特种陶瓷材料应用于半导体加工设备的方法，其中特种陶瓷材料耐卤素等离子体。 特种陶瓷材料含有至少一种含氧化钇的固溶体。 已经修改了特种陶瓷材料的一些实施例以提供降低半导体处理室内的电弧的可能性的电阻率。

公开(公告)号：US20080108221A1

公开(公告)日：2008-05-08

申请号：US11931308

申请日：2007-10-31

Applicant: Kieun Kim ,  Adam Cohen ,  Willa Larsen ,  Richard Chen ,  Ananda Kumar ,  Ezekiel Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael Lockard ,  Christopher Bang

Inventor： Kieun Kim ,  Adam Cohen ,  Willa Larsen ,  Richard Chen ,  Ananda Kumar ,  Ezekiel Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael Lockard ,  Christopher Bang

IPC: H01L21/44

CPC classification number: C25D1/00 ,  C25D1/003 ,  C25D7/123

Abstract: Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of the tip material around carefully sized and placed etching shields, via hot pressing, and the like.

Abstract translation: 本发明的实施例涉及形成具有各种构造的微探针尖元件。 在一些实施例中，尖端由与探针本身相同的建筑材料形成，而在其它实施例中，尖端可以由不同的材料形成和/或可以包括涂层材料。 在一些实施例中，尖端在探针的主要部分之前形成，并且尖端形成在临时衬底附近或与临时衬底接触。 探针尖端图案化可以以各种不同的方式发生，包括例如通过在各向异性或各向异性地蚀刻硅的图案化孔中模制，通过在曝光的光致抗蚀剂中形成的空隙中模制，通过在牺牲材料中的空隙中模制， 由于牺牲材料通过电介质材料的细小尺寸和定位的区域，经由热压等等仔细地尺寸和放置的蚀刻屏蔽部分上的尖端材料的各向同性蚀刻而形成。

公开(公告)号：US20060286829A1

公开(公告)日：2006-12-21

申请号：US11028962

申请日：2005-01-03

Applicant: Kieun Kim ,  Adam Cohen ,  Willa Larsen ,  Richard Chen ,  Ananda Kumar ,  Ezekiel Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael Lockard

Inventor： Kieun Kim ,  Adam Cohen ,  Willa Larsen ,  Richard Chen ,  Ananda Kumar ,  Ezekiel Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael Lockard

IPC: H01R12/00

CPC classification number: G01R3/00 ,  G01R1/06744 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49222

Abstract: Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in over exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of a the tip material around carefully sized placed etching shields, via hot pressing, and the like.

Abstract translation: 本发明的实施例涉及形成具有各种构造的微探针尖元件。 在一些实施例中，尖端由与探针本身相同的建筑材料形成，而在其它实施例中，尖端可以由不同的材料形成和/或可以包括涂层材料。 在一些实施例中，尖端在探针的主要部分之前形成，并且尖端形成在临时衬底附近或与临时衬底接触。 探针尖端图案化可以以各种不同的方式发生，包括例如通过在各向异性或各向异性地蚀刻硅的图案化孔中模制，通过在暴露在光致抗蚀剂中的空隙中模制，通过在牺牲材料中的空隙中模制， 由于牺牲材料在电介质材料的精细尺寸和定位的区域上的形成，通过各种各向同性的蚀刻尖端材料，围绕小心尺寸放置的蚀刻屏蔽件，通过热压等形成。

公开(公告)号：US20060112550A1

公开(公告)日：2006-06-01

申请号：US11178145

申请日：2005-07-07

Applicant: Kieun Kim ,  Adam Cohen ,  Willa Larsen ,  Richard Chen ,  Ananda Kumar ,  Ezekiel Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael Lockard ,  Christopher Bang

Inventor： Kieun Kim ,  Adam Cohen ,  Willa Larsen ,  Richard Chen ,  Ananda Kumar ,  Ezekiel Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael Lockard ,  Christopher Bang

IPC: H01R43/00

CPC classification number: C25D1/003 ,  G01R3/00 ,  Y10T29/49222

Abstract: Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of the tip material around carefully sized and placed etching shields, via hot pressing, and the like.

公开(公告)号：US20060108678A1

公开(公告)日：2006-05-25

申请号：US11173241

申请日：2005-06-30

Applicant: Ananda Kumar ,  Ezekiel Kruglick ,  Adam Cohen ,  Kieun Kim ,  Gang Zhang ,  Richard Chen ,  Christopher Bang ,  Vacit Arat ,  Michael Lockard ,  Uri Frodis ,  Pavel Lembrikov ,  Jeffrey Thompson

Inventor： Ananda Kumar ,  Ezekiel Kruglick ,  Adam Cohen ,  Kieun Kim ,  Gang Zhang ,  Richard Chen ,  Christopher Bang ,  Vacit Arat ,  Michael Lockard ,  Uri Frodis ,  Pavel Lembrikov ,  Jeffrey Thompson

IPC: H01L23/48

CPC classification number: B23K35/0222 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  C25D1/12 ,  G01R1/06744 ,  G01R1/07307 ,  G01R1/07314 ,  G01R3/00 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L24/95 ,  H01L2221/68313 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/10126 ,  H01L2224/1147 ,  H01L2224/11831 ,  H01L2224/1184 ,  H01L2224/1191 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/81001 ,  H01L2224/81054 ,  H01L2224/81136 ,  H01L2224/8121 ,  H01L2224/8181 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/3651 ,  H01L2924/3841 ,  H01L2224/13099 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/00012

Abstract: Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates. Some embodiments of the invention transfer probes to permanent substrates prior to separating the probes from a temporary substrate on which the probes were formed while other embodiments do the opposite. Some embodiments, remove sacrificial material prior to transfer while other embodiments remove sacrificial material after transfer. Some embodiments are directed to the bonding of first and second electric components together using one or more solder bumps with enhanced aspect ratios (i.e. height to width ratios) obtained as a result of surrounding the bumps at least in part with rings of a retention material. The retention material may act be a solder mask material.

Abstract translation: 本发明的实施例涉及在临时衬底上形成微探针（即柔性电气或电子接触元件），切割单独的探针阵列，然后将阵列转移到空间变压器或其它永久衬底。 在将探针从其上形成探针的临时基底分离出来之前，本发明的一些实施方案将探针转移到永久性基底上，而其他实施方案相反。 一些实施例，在转移之前去除牺牲材料，而其它实施例在转移后去除牺牲材料。 一些实施例涉及使用一个或多个具有增强的纵横比（即，高度与宽度比）的焊料凸块来将第一和第二电气部件接合在一起，这是由于至少部分地由保持材料的环围绕凸块而得到的。 保留材料可以用作焊接掩模材料。