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    Pane having an electrical connection element
    25.
    发明授权
    Pane having an electrical connection element 有权
    叶片具有电连接元件

    公开(公告)号：US09484651B2

    公开(公告)日：2016-11-01

    申请号：US14421993

    申请日：2013-07-24

    Applicant: SAINT-GOBAIN GLASS FRANCE

    Inventor： Mitja Rateiczak ,  Bernhard Reul ,  Klaus Schmalbuch

    IPC: H05B3/08 ,  H01R13/02 ,  H01R43/02 ,  B23K1/00 ,  B23K1/20

    CPC classification number: H01R13/02 ,  B23K1/0008 ,  B23K1/0016 ,  B23K1/20 ,  B23K35/26 ,  H01R43/02 ,  H01R43/0235 ,  H05B3/06 ,  H05B3/84 ,  Y10T29/49169

    Abstract: A pane having a connection element, having; a substrate having an electrically conductive structure on at least a subregion of the substrate, the electrical connection element on at least a subregion of the electrically conductive structure, and a lead-free soldering compound which connects the electrical connection element to the electrically conductive structure in at least a subregion, wherein the lead-free soldering compound contains 58 to 62% by weight indium, 35 to 38% by weight tin, 1 to 3.5% by weight silver and 0.5 to 2% by weight copper.

    Abstract translation: 具有连接元件的窗格，具有： 在所述基板的至少一个子区域上具有导电结构的基板，所述导电结构的至少一个子区域上的所述电连接元件以及将所述电连接元件连接到所述导电结构的无铅焊接化合物 至少一个子区域，其中无铅焊料化合物含有58至62重量％的铟，35至38重量％的锡，1至3.5重量％的银和0.5至2重量％的铜。

    DISK HAVING AN ELECTRIC CONNECTING ELEMENT AND COMPENSATOR PLATES
    26.
    发明申请
    DISK HAVING AN ELECTRIC CONNECTING ELEMENT AND COMPENSATOR PLATES 有权
    具有电气连接元件和补偿板的磁盘

    公开(公告)号：US20150296569A1

    公开(公告)日：2015-10-15

    申请号：US14439652

    申请日：2013-07-18

    Applicant: SAINT-GOBAIN GLASS FRANCE

    Inventor： Mitja Rateiczak ,  Bernhard Reul ,  Klaus Schmalbuch

    IPC: H05B3/84

    CPC classification number: H05B3/84 ,  H05B3/06 ,  H05B2203/016

    Abstract: A disk with at least one connecting element having compensator plates, including: a substrate having an electrically conductive structure on at least one partial region of the substrate, at least one compensator plate on at least one partial region of the conductive structure, at least one electric connecting element on at least one partial region of the at least one compensator plate, a lead-free soldering mass which connects the compensator plate via at least one contact surface including: one partial region of the electrically conductive structure, wherein the difference of the thermal expansion coefficient of the substrate and the compensator plate is less than 5×10−6/° C. and wherein the connecting element comprises copper.

    Abstract translation: 具有至少一个具有补偿板的连接元件的盘包括：在所述基底的至少一个部分区域上具有导电结构的基底，在所述导电结构的至少一个部分区域上的至少一个补偿板，至少一个 所述至少一个补偿板的至少一个部分区域上的电连接元件，经由至少一个接触表面连接所述补偿板的无铅焊接质量块，所述至少一个接触表面包括：所述导电结构的一个部分区域， 基板和补偿板的热膨胀系数小于5×10 -6 /℃，连接元件包括铜。

    COMPOSITE PANE WITH ELECTRICAL CONTACT-MAKING MEANS
    27.
    发明申请
    COMPOSITE PANE WITH ELECTRICAL CONTACT-MAKING MEANS 审中-公开
    具有电接触制造方式的复合板

    公开(公告)号：US20150244089A1

    公开(公告)日：2015-08-27

    申请号：US14416056

    申请日：2013-06-28

    Applicant: SAINT-GOBAIN GLASS FRANCE

    Inventor： Bernhard Reul ,  Guenther Schall

    IPC: H01R12/70 ,  B32B37/02 ,  H01R43/00 ,  H01R4/00

    CPC classification number: H01R12/70 ,  B32B17/10036 ,  B32B17/10183 ,  B32B17/10229 ,  B32B17/10495 ,  B32B17/10761 ,  B32B37/02 ,  B32B2307/202 ,  H01R4/00 ,  H01R43/00 ,  H05B3/06 ,  H05B3/86 ,  H05B2203/011 ,  H05B2203/013

    Abstract: A composite pane with electrical contact-making means is described, having: a first pane and a second pane, which panes are connected to one another over their surface by means of a thermoplastic intermediate layer, at least one electrically conductive coating at least on the inner surface of the first pane, at least one busbar on a region of the electrically conductive coating, and at least one electrically conductive contact strip on at least one region of the busbar, wherein the contact strip is connected to at least one electrical feed line, and at least one region of the contact strip is in direct contact with the busbar.

    Abstract translation: 描述了具有电接触制造装置的复合板，其具有：第一窗格和第二窗格，其中玻璃板通过热塑性中间层在其表面上彼此连接，至少一个导电涂层至少在 所述第一窗格的内表面，所述导电涂层的区域上的至少一个母线以及所述母线的至少一个区域上的至少一个导电接触条，其中所述接触带连接到至少一个电馈线 并且接触带的至少一个区域与母线直接接触。

    Flat conductor connection element
    29.
    发明授权
    Flat conductor connection element 有权

    公开(公告)号：US12068553B2

    公开(公告)日：2024-08-20

    申请号：US17797975

    申请日：2021-02-05

    Applicant: SAINT-GOBAIN GLASS FRANCE

    Inventor： François Hermange ,  Bernhard Reul

    IPC: H05K1/02 ,  H01R4/70 ,  H01R12/62 ,  H01R12/73 ,  H01R24/30 ,  H01R24/48 ,  H01R43/02 ,  H01R43/16 ,  H01R43/20 ,  H05K3/14

    CPC classification number: H01R12/62 ,  H01R4/70 ,  H01R43/02

    Abstract: A flat-conductor connection element for an electrically conductive structure applied to a pane, includes at least one conductor, containing a flat conductor, having a first connection region at a first end and a second connection region at a second end, the first connection region having a connection surface for electrically connecting to the electrically conductive structure and having a contact surface opposite the connection surface for contact with a soldering tool; an encapsulation layer made of an electrically insulating material, which encapsulation layer surrounds the conductor at least in a conductor portion containing the first connection region, the encapsulation layer having a through-hole, through which the connection surface and the contact surface of the first connection region are accessible, the first connection region of the conductor being within the through-hole in a view perpendicularly through the plane of the encapsulation layer.

    Pane having an electrical connection element
    30.
    发明授权
    Pane having an electrical connection element 有权

    公开(公告)号：US11456546B2

    公开(公告)日：2022-09-27

    申请号：US16428236

    申请日：2019-05-31

    Applicant: SAINT-GOBAIN GLASS FRANCE

    Inventor： Christoph Degen ,  Bernhard Reul ,  Mitja Rateiczak ,  Andreas Schlarb ,  Lothar Lesmeister

    IPC: H01R4/62 ,  H05B3/84 ,  H01R4/02

    Abstract: A pane, includes a substrate, an electrically conductive structure on a region of the substrate, a layer of a solder material on a region of the electrically conductive structure, and at least two soldering points of the at least one electrical connection element on the solder material, wherein the at least two soldering points form at least one contact surface between the at least one electrical connection element and the electrically conductive structure, and a shape of the at least one contact surface has at least one segment of an oval, an ellipse, or a circle with a central angle α of at least 90°.

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