公开(公告)号：US11828877B2

公开(公告)日：2023-11-28

申请号：US17015521

申请日：2020-09-09

Applicant: STMicroelectronics PTE LTD

Inventor： Jing-En Luan

IPC: G01S7/481

CPC classification number: G01S7/4813

Abstract: The present disclosure is directed to an optical sensor package with a first assembly and a second assembly with an encapsulant extending between and coupling the first assembly and the second assembly. The first assembly includes a first substrate, a first die on the first substrate, a transparent material on the first die, and an infrared filter on the transparent material. The second assembly includes a second substrate, a second die on the second substrate, a transparent material on the second die, and an infrared filter on the transparent material. Apertures are formed through the encapsulant aligned with the first die and the second die. The first die is configured to transmit light through one aperture, wherein the light reflects off an object to be detected and is received at the second die through another one of the apertures.

公开(公告)号：US10269583B2

公开(公告)日：2019-04-23

申请号：US14981338

申请日：2015-12-28

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En Luan

IPC: H01L23/495 ,  H01L25/00 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31 ,  H01L25/065 ,  H01L23/29

Abstract: The embodiments of the present disclosure relate to a semiconductor device and a manufacturing method therefor. The semiconductor device comprises: a die attachment pad; a stud bump located on the die attachment pad and in direct contact with the die attachment pad; a first die located on the stud bump and electrically coupled to the stud bump; and a conductive attachment material located between the die attachment pad and the first die.

公开(公告)号：US10244638B2

公开(公告)日：2019-03-26

申请号：US14981185

申请日：2015-12-28

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En Luan

IPC: H05K1/18 ,  H05K3/32 ,  H05K3/28 ,  H05K3/30

Abstract: A proximity sensor is provided according to the embodiments of the present disclosure, comprising: a sensor chip; a light-emitting device; a substrate, the sensor chip and the light-emitting device being located on the substrate; a transparent molding material covering a light-emitting surface of the light-emitting device; and a non-transparent molding material separating the transparent molding material from the sensor chip.

公开(公告)号：US10126462B2

公开(公告)日：2018-11-13

申请号：US14982518

申请日：2015-12-29

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En Luan

IPC: G01V8/12 ,  G01V13/00

Abstract: The embodiments of the present disclosure provide a proximity sensor, an electronic apparatus and a method for manufacturing a proximity sensor. The proximity sensor comprises a sensor chip, a light-emitting device, a transparent molding material and a non-transparent molding material, wherein the sensor chip comprises a sensor region; the light-emitting device is located on the sensor chip and is electrically coupled to the sensor chip; the transparent molding material at least covers a light-emitting surface of the light-emitting device; and the non-transparent molding material isolates the transparent molding material from the sensor region.

公开(公告)号：US10038108B2

公开(公告)日：2018-07-31

申请号：US15340216

申请日：2016-11-01

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En Luan ,  Laurent Herard ,  Yong Jiang Lei

IPC: H01L31/12 ,  G06M7/00 ,  H01L31/0203 ,  H01L31/18 ,  G01S7/481 ,  H01L31/153 ,  H01L25/00

CPC classification number: H01L31/0203 ,  G01S7/481 ,  G01S7/4813 ,  G01S17/026 ,  G01S17/46 ,  H01L25/50 ,  H01L31/125 ,  H01L31/153 ,  H01L31/173 ,  H01L31/18

Abstract: One or more embodiments are directed to system in package (SiP) for optical devices, such as proximity sensing or optical ranging devices. One embodiment is directed to an optical sensor package that includes a substrate, a sensor die coupled to the substrate, a light-emitting device coupled to the substrate, and a cap. The cap is positioned around side surfaces of the sensor die and covers at least a portion of the substrate. The cap includes first and second sidewalls, an inner wall having first and second side surfaces and a mounting surface, and a cover in contact with the first and second sidewalls and the inner wall. The first and second side surfaces are transverse to the mounting surface, and the inner wall includes an opening extending into the inner wall from the mounting surface. A first adhesive material is provided on the sensor die and at least partially within the opening, and secures the inner wall to the sensor die.

公开(公告)号：US09698105B2

公开(公告)日：2017-07-04

申请号：US15251209

申请日：2016-08-30

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En Luan

IPC: H01L23/34 ,  H01L23/00 ,  H01L23/373 ,  H01L23/498 ,  H01L23/367 ,  H01L23/31 ,  H01L21/48 ,  H01L23/538 ,  H01L21/56 ,  H01L21/78 ,  H01L23/18

CPC classification number: H01L23/562 ,  H01L21/4846 ,  H01L21/4853 ,  H01L21/4871 ,  H01L21/4882 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/78 ,  H01L23/18 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/373 ,  H01L23/3737 ,  H01L23/498 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16235 ,  H01L2224/18 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2924/3511

Abstract: A method includes forming a molded panel that includes a number of integrated circuits, fan-out components and stiffeners embedded in an encapsulation material. A redistribution layer is formed over the integrated circuits and the fan-out components. The redistribution layer is electrically coupled to contacts of the integrated circuits. The molded panel is singulated to form electronic devices. Each electronic device each an integrated circuit that is separated from a fan-out component by a portion of the encapsulation material and a stiffener separated from the fan-out component by a second portion of the encapsulation material.

公开(公告)号：US20170186674A1

公开(公告)日：2017-06-29

申请号：US15019617

申请日：2016-02-09

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En Luan

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/49568 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/4334 ,  H01L23/49513 ,  H01L23/49562 ,  H01L23/49582 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/04042 ,  H01L2224/29294 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/85 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/01047

Abstract: One or more embodiments are directed to a semiconductor package that includes an integrated heatsink and methods of forming same. In one embodiment, the semiconductor package includes a semiconductor die coupled to a first surface of a die pad. A heatsink is coupled to a second surface of the die pad. Encapsulation material is located around the die and die pad and over a portion of the heatsink. A bottom portion of the heatsink may remain exposed from the encapsulation material. Furthermore, a portion of the heatsink may extend from a side of the encapsulation material.