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    DEVICE FOR DISPLAYING IDENTIFICATION INFORMATION ON OTHER DEVICE AND METHOD THEREOF
    23.
    发明申请
    DEVICE FOR DISPLAYING IDENTIFICATION INFORMATION ON OTHER DEVICE AND METHOD THEREOF 审中-公开
    用于显示其他设备的识别信息的装置及其方法

    公开(公告)号：US20150373187A1

    公开(公告)日：2015-12-24

    申请号：US14730732

    申请日：2015-06-04

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jong Kyu BAE ,  Jae Hyun PARK ,  Hey Young PARK ,  Ki Won LEE ,  Ki Young LIM ,  Woo Hyuk JANG ,  Han Seong JUNG

    IPC: H04M3/42 ,  H04M3/436 ,  H04W4/16

    CPC classification number: H04M3/42042 ,  H04M1/575 ,  H04M3/42382 ,  H04M3/436 ,  H04M2203/655 ,  H04W4/16

    Abstract: A method for display, at a first electronic device, identification information about a second electronic device is provided. The method includes receiving a call or a message from the second electronic device, requesting identification information about the second electronic device to a server, receiving the requested identification information from the server, and displaying the received identification information on a screen. The identification information comprises relation information between the first electronic device and the second electronic device.

    Abstract translation: 提供了一种在第一电子设备处显示关于第二电子设备的识别信息的方法。 所述方法包括从所述第二电子设备接收呼叫或消息，向服务器请求关于所述第二电子设备的标识信息，从所述服务器接收所请求的标识信息，以及在屏幕上显示所接收的标识信息。 识别信息包括第一电子设备和第二电子设备之间的关系信息。

    SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
    24.
    发明公开
    SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME 审中-公开

    公开(公告)号：US20240258430A1

    公开(公告)日：2024-08-01

    申请号：US18383065

    申请日：2023-10-24

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Sung Il PARK ,  Min Jun LEE ,  Jae Hyun PARK

    IPC: H01L29/78 ,  H01L29/08 ,  H01L29/423 ,  H01L29/66

    CPC classification number: H01L29/7851 ,  H01L29/0865 ,  H01L29/0882 ,  H01L29/42376 ,  H01L29/66545 ,  H01L29/66795

    Abstract: Disclosed is a semiconductor device including a first channel layer on a substrate, and a second channel layer on the first channel layer, the first and second channel layers extending in a first direction while being spaced apart from the substrate, and including a 2D semiconductor material, a gate structure on the substrate, the gate structure extending in a second direction, and being penetrated by the first and second channel layers, and source/drain contacts on side surfaces of the gate structure and being connected to the first and second channel layers. The gate structure includes a first gate portion between the substrate and the first channel layer and having a first gate length, a second gate portion between the first and second channel layers and having a second gate length, and a third gate portion on an upper surface of the second channel layer and having a third gate length.

    SEMICONDUCTOR DEVICES WITH STACKED TRANSISTOR STRUCTURES
    25.
    发明公开
    SEMICONDUCTOR DEVICES WITH STACKED TRANSISTOR STRUCTURES 审中-公开

    公开(公告)号：US20240120401A1

    公开(公告)日：2024-04-11

    申请号：US18390246

    申请日：2023-12-20

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Sungil PARK ,  Jae Hyun PARK ,  Kyungho KIM ,  Cheoljin YUN ,  Daewon HA

    IPC: H01L29/423 ,  H01L29/786

    CPC classification number: H01L29/42392 ,  H01L29/78618 ,  H01L29/78696

    Abstract: A semiconductor device includes a lower channel pattern and an upper channel pattern stacked on a substrate in a first direction perpendicular to a top surface of the substrate, lower source/drain patterns on the substrate and at a first side and a second side of the lower channel pattern, upper source/drain patterns stacked on the lower source/drain patterns and at a third side and a fourth side of the upper channel pattern, a first barrier pattern between the lower source/drain patterns and the upper source/drain patterns, and a second barrier pattern between the first barrier pattern and the upper source/drain patterns. The first barrier pattern includes a first material and the second barrier pattern includes a second material, wherein the first material and the second material are different.

    ANALOG FRONT-END RECEIVER AND ELECTRONIC DEVICE INCLUDING THE SAME
    26.
    发明申请
    ANALOG FRONT-END RECEIVER AND ELECTRONIC DEVICE INCLUDING THE SAME 有权

    公开(公告)号：US20220109467A1

    公开(公告)日：2022-04-07

    申请号：US17380779

    申请日：2021-07-20

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Byeong Gyu PARK ,  Jae Hyun PARK ,  Jun Han BAE ,  Ho-Bin SONG

    IPC: H04B3/14

    Abstract: Provided is an analog front-end receiver including: a first equalizer including a first block switch configured to receive a first differential signal through a first node, and configured to block the first differential signal in a first operation mode; a second equalizer including a second block switch configured to receive a second differential signal through a second node, and configured to block the second differential signal in the first operation mode; a terminating resistor provided between the first node and the second node, and configured to receive the first differential signal via the first node, and receive the second differential signal via the second node; and a low pass filter configured to receive a third differential signal converted by the terminating resistor from the first differential signal, and configured to receive a fourth differential signal converted by the terminating resistor from the second differential signal.

    OPERATING METHOD AND DEVICE FOR DISASTER INFORMATION
    27.
    发明申请
    OPERATING METHOD AND DEVICE FOR DISASTER INFORMATION 审中-公开
    灾害信息的操作方法和设备

    公开(公告)号：US20160029194A1

    公开(公告)日：2016-01-28

    申请号：US14795259

    申请日：2015-07-09

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Woo Hyuk JANG ,  Jae Hyun PARK ,  Hey Young PARK ,  Jong Kyu BAE ,  Yeo Rok YOON ,  Ki Won LEE ,  Je Hyun LEE ,  Ki Young LIM ,  Jong Yeol CHOI

    IPC: H04W4/22 ,  H04W4/02

    CPC classification number: H04W4/029 ,  G06F21/6209 ,  G06F2221/2111 ,  G06F2221/2149 ,  G06Q10/10 ,  G06Q50/265 ,  H04W4/02 ,  H04W4/021 ,  H04W4/90

    Abstract: Disclosed is an electronic device including a memory storing collected location information of the electronic device, and a processor configured to convert the collected location information into code information which represents a specific area of the earth. The electronic device transmits the code information to a disaster information providing device for which location information management is required in association with the provision of disaster information. Further disclosed is a disaster information providing system including the providing device and a plurality of mobile electronic devices. Disaster-related information is provided to those devices determined to be located within a damage zone, as determined by location information obtained by the respective devices and provided to the disaster information providing device.

    Abstract translation: 公开了一种电子设备，包括存储收集的电子设备的位置信息的存储器和被配置为将收集的位置信息转换为代表地球的特定区域的代码信息的处理器。 电子设备将代码信息发送到与提供灾害信息相关联的需要位置信息管理的灾害信息提供设备。 还公开了包括提供装置和多个移动电子装置的灾害信息提供系统。 灾害相关信息被提供给被确定为位于损伤区域内的那些设备，由通过各个设备获得并提供给灾害信息提供设备的位置信息确定。

    THREE DIMENSIONAL DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF
    28.
    发明申请
    THREE DIMENSIONAL DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF 有权
    三维显示设备及其制造方法

    公开(公告)号：US20150177541A1

    公开(公告)日：2015-06-25

    申请号：US14575299

    申请日：2014-12-18

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jae Hyun PARK

    IPC: G02F1/1339 ,  G02F1/1333 ,  G02F1/1335 ,  G02B27/22

    CPC classification number: G02F1/1339 ,  G02B27/2228 ,  G02B27/225 ,  G02B27/2278 ,  G02F1/133305 ,  G02F1/133308 ,  G02F1/133603 ,  G02F1/133606 ,  G02F1/133608 ,  G02F1/1347 ,  G02F2001/133314 ,  G02F2001/133317 ,  G02F2001/13332 ,  H04N13/302 ,  H04N13/395 ,  H04N2213/001

    Abstract: A three-dimensional (3D) display apparatus, display module, and a manufacturing method thereof, are provided. The 3D display apparatus includes a display module including a first display panel configured to display a two-dimensional (2D) image, a second display panel disposed in front of the first display panel and spaced apart from the first display panel, and configured to display another 2D image that when combined with the 2D image displayed by the first display panel generates a 3D image, and a spacing panel comprising a rear surface on which the first display panel is attached and a front surface on which the second display panel is attached, the spacing panel providing an amount of space between the first display panel and the second display panel.

    Abstract translation: 提供三维（3D）显示装置，显示模块及其制造方法。 3D显示装置包括：显示模块，包括被配置为显示二维（2D）图像的第一显示面板，设置在第一显示面板前方并与第一显示面板间隔开的第二显示面板， 当与第一显示面板显示的2D图像组合的另一2D图像生成3D图像，并且间隔面板包括其上附接有第一显示面板的后表面和附接有第二显示面板的前表面， 所述间隔面板在所述第一显示面板和所述第二显示面板之间提供一定量的空间。

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