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公开(公告)号：US08598468B2
公开(公告)日：2013-12-03
申请号：US13437254
申请日：2012-04-02
申请人： Han Kim , Mi-Ja Han , Hyo-Jic Jung
发明人： Han Kim , Mi-Ja Han , Hyo-Jic Jung
CPC分类号： H01P1/2005 , H01L2224/16 , H01P1/203 , H05K1/0236 , H05K1/0237 , H05K2201/09309 , H05K2201/09518 , H05K2201/096 , H05K2201/09627 , H05K2201/09663 , H05K2201/09681
摘要： An electromagnetic bandgap structure including: at least three conductive plates; a first stitching via, configured to electrically connect any one of the conductive plates to another conductive plate; and a second stitching via, configured to electrically connect the one conductive plate to yet another conductive plate, wherein the first stitching via electrically connects the one conductive plate to another conductive plate by allowing a part of the first stitching via to be connected through a planar surface above or below the one conductive plate, and the second stitching via electrically connects the one conductive plate to yet another conductive plate by allowing a part of the second stitching via to be connected through a planar surface that is different from the planar surface through which the part of the first stitching via is connected, the two planar surfaces being placed in a same direction based on the conductive plates.
摘要翻译： 一种电磁带隙结构，包括：至少三个导电板; 第一缝合通孔，被配置为将任一导电板电连接到另一个导电板; 以及第二缝合通孔，其被配置为将所述一个导电板电连接到另一个导电板，其中所述第一缝合通孔将所述第一缝合通孔的一部分通过平面 表面在一个导电板的上方或下方，并且第二缝合通孔通过允许第二缝合通孔的一部分通过不同于平面的平面表面连接一个导电板到另一个导电板，通过该平面 第一缝合通孔的部分被连接，两个平面被放置在相同的方向上，基于导电板。
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公开(公告)号：US08310840B2
公开(公告)日：2012-11-13
申请号：US12222057
申请日：2008-07-31
申请人： Han Kim , Je-Gwang Yoo , Chang-Sup Ryu
发明人： Han Kim , Je-Gwang Yoo , Chang-Sup Ryu
IPC分类号： H05K7/00
CPC分类号： H05K9/0039 , H01P1/2005 , H05K1/0236 , H05K2201/09309 , H05K2201/09627 , H05K2201/09663
摘要： Disclosed are an electromagnetic bandgap structure and a printed circuit board including the same. In accordance with an embodiment of the present invention, the printed circuit board can include a dielectric layer, a plurality of conductive plates, and a stitching via, which is configured to electrically connect the conductive plates to each other. The stitching via can pass through the dielectric layer, and a part of the stitching via can be placed in a planar surface that is different from a planar surface in which the conductive plates are placed. With the present invention, the electromagnetic bandgap structure can prevent a signal of a predetermined frequency band from being transferred.
摘要翻译： 公开了一种电磁带隙结构和包括该电阻带隙结构的印刷电路板。 根据本发明的实施例，印刷电路板可以包括介电层，多个导电板和缝合通孔，其被配置为将导电板彼此电连接。 缝合通孔可以穿过介电层，并且缝合通孔的一部分可以放置在与放置导电板的平坦表面不同的平面表面中。 利用本发明，电磁带隙结构可以防止预定频带的信号被传送。
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公开(公告)号：US08279616B2
公开(公告)日：2012-10-02
申请号：US13064541
申请日：2011-03-30
申请人： Han Kim , Je-Gwang Yoo , Mi-Ja Han , Dae-Hyun Park
发明人： Han Kim , Je-Gwang Yoo , Mi-Ja Han , Dae-Hyun Park
IPC分类号： H05K1/18
CPC分类号： H05K1/0231 , H01L2224/16225 , H05K1/0236 , H05K1/165 , H05K1/185 , H05K2201/093 , H05K2201/09309 , H05K2201/09509 , H05K2201/09663 , H05K2201/10636 , H05K2201/10643 , Y02P70/611 , Y10T29/4913 , Y10T29/49146
摘要： A printed circuit board having an embedded chip capacitor includes a first conductive layer; a second conductive layer, placed away from the first conductive layer; a chip capacitor, having a first electrode connected to the first conductive layer through being seated in a cavity formed between the first conductive layer and the second conductive layer; a filled material, filled in a space excluding a space occupied by the chip capacitor in the cavity; and a via, penetrating the filled material and connecting the second conductive layer to the second electrode of the chip capacitor.
摘要翻译： 具有嵌入式芯片电容器的印刷电路板包括：第一导电层; 远离所述第一导电层放置的第二导电层; 芯片电容器，其具有通过位于形成在第一导电层和第二导电层之间的空腔中而连接到第一导电层的第一电极; 填充材料，填充在空腔内不包括由片状电容器占据的空间的空间中; 以及通孔，穿透填充材料并将第二导电层连接到片式电容器的第二电极。
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公开(公告)号：US20120162934A1
公开(公告)日：2012-06-28
申请号：US13411005
申请日：2012-03-02
申请人： Dae-Hyun Park , Han Kim , Mi-Ja Han , Ja-Bu Koo
发明人： Dae-Hyun Park , Han Kim , Mi-Ja Han , Ja-Bu Koo
IPC分类号： H05K7/00
CPC分类号： H05K1/0236 , H05K1/0219 , H05K1/0222 , H05K1/115 , H05K2201/09309 , H05K2201/09536 , H05K2201/09618 , H05K2201/09718 , H05K2201/09781 , Y10T29/4913 , Y10T29/49165 , Y10T428/12465
摘要： An electromagnetic bandgap structure and a printed circuit board that solve a mixed signal problem are disclosed. In accordance with embodiments of the present invention, the electromagnetic bandgap structure includes a first metal layer; a first dielectric layer, stacked in the first metal layer; a second metal layer, stacked in the first dielectric layer, and having a holed formed at a position of the second dielectric layer; a second dielectric layer, stacked in the second metal layer; a metal plate, stacked in the second dielectric layer; a first via, penetrating the hole formed in the second metal layer and connecting the first metal layer and the metal plate; a third dielectric layer, stacked in the metal plate and the second dielectric layer; a third metal layer, stacked in the third dielectric layer; and a second via, connecting the second metal layer to the third metal layer.
摘要翻译： 公开了一种解决混合信号问题的电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构包括第一金属层; 第一介电层，堆叠在第一金属层中; 第二金属层，堆叠在第一介电层中，并且具有形成在第二介电层的位置的孔; 第二介电层，堆叠在第二金属层中; 金属板，堆叠在第二介电层中; 穿过形成在第二金属层中的孔并连接第一金属层和金属板的第一通孔; 第三电介质层，堆叠在所述金属板和所述第二介电层中; 第三金属层，堆叠在第三介电层中; 以及将第二金属层连接到第三金属层的第二通孔。
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公开(公告)号：US08169790B2
公开(公告)日：2012-05-01
申请号：US12010561
申请日：2008-01-25
申请人： Han Kim , Je-Gwang Yoo , Chang-Sup Ryu
发明人： Han Kim , Je-Gwang Yoo , Chang-Sup Ryu
IPC分类号： H05K7/00
CPC分类号： H01P1/2005 , H01L2224/16225 , H01Q15/006 , H05K1/0236 , H05K2201/09309 , H05K2201/09627 , H05K2201/09681
摘要： An electromagnetic bandgap structure and a printed circuit board having the electromagnetic bandgap that intercepts the transfer of a signal ranging a frequency band are disclosed. The electromagnetic bandgap structure includes a metal layer; a dielectric layer, stacked on the metal layer; at least two metal plates, stacked on the same planar surface of the dielectric layer; and a stitching via, connecting the adjacent metal plates. The stitching via passes through the dielectric layer, and a part of the stitching via is placed on the same planar surface of the metal layer. With the present invention, the electromagnetic bandgap can decrease the noise of a particular frequency by having a compact size and a low bandgap frequency.
摘要翻译： 公开了一种具有电磁带隙的电磁带隙结构和印刷电路板，该电磁带隙拦截了频带范围内的信号的传送。 电磁带隙结构包括金属层; 介电层，堆叠在金属层上; 至少两个金属板，堆叠在介电层的相同平面上; 和缝合通孔，连接相邻的金属板。 缝合通孔穿过电介质层，并且缝合通孔的一部分被放置在金属层的同一平面上。 利用本发明，电磁带隙可以通过具有紧凑的尺寸和低的带隙频率来降低特定频率的噪声。
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公开(公告)号：US08158889B2
公开(公告)日：2012-04-17
申请号：US12213571
申请日：2008-06-20
申请人： Han Kim , Je-Gwang Yoo
发明人： Han Kim , Je-Gwang Yoo
CPC分类号： H01P1/2005 , H01Q15/006 , H01Q15/008 , H05K1/0236 , H05K2201/09309 , H05K2201/09663 , H05K2201/0969
摘要： An electromagnetic bandgap structure and a printed circuit board are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure includes a mushroom type structure comprising a first metal plate and a via of which one end is connected to the first metal plate; a second metal plate connected to the other end of the via; a first metal layer being connected to the second metal layer through a metal line; a first dielectric layer, layer-built between the first metal layer and the first metal plate; a second dielectric layer, layer-built on the first metal plate and the first dielectric layer; and a second metal layer, layer-built on the second dielectric layer. With the present invention, it is possible to solve the aforementioned mixed signal problem by preventing the EM wave of a certain frequency range from being transferred.
摘要翻译： 公开了电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构包括蘑菇型结构，其包括第一金属板和一端连接到第一金属板的通孔; 连接到所述通孔的另一端的第二金属板; 第一金属层通过金属线连接到第二金属层; 在第一金属层和第一金属板之间层叠的第一介电层; 第二电介质层，其在第一金属板和第一介电层上构建; 以及第二金属层，其被构建在第二介电层上。 利用本发明，可以通过防止某一频率范围的EM波被传送来解决上述混合信号问题。
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公开(公告)号：US08077000B2
公开(公告)日：2011-12-13
申请号：US12232463
申请日：2008-09-17
IPC分类号： H01P1/201
CPC分类号： H01P3/088 , H01L2224/16225 , H01P1/2005 , H05K1/0236 , H05K1/0237 , H05K3/429 , H05K2201/09309 , H05K2201/09663 , H05K2201/09681
摘要： Disclosed are an electromagnetic bandgap structure and a printed circuit board. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a dielectric layer; a plurality of conductive plates; a stitching via, configured to pass through the dielectric layer and have a part electrically connecting the conductive plates to each other by connecting through a planar surface that is different from a planar surface of the conductive plates, and a through via. Here, the dielectric layer, the conductive plates and the stitching via can be placed between any two conductive layers, and the through via can be configured to pass through a clearance hole formed in the conductive layer and electrically connect the two conductive layers to each other.
摘要翻译： 公开了电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构可以包括电介质层; 多个导电板; 缝合通孔，其构造成穿过介电层并且具有通过连接通过不同于导电板的平坦表面的平坦表面和通孔而将导电板彼此电连接的部分。 这里，电介质层，导电板和缝合通孔可以放置在任何两个导电层之间，并且通孔可以被配置为穿过形成在导电层中的间隙孔并将两个导电层彼此电连接 。
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公开(公告)号：US20110163823A1
公开(公告)日：2011-07-07
申请号：US12983073
申请日：2010-12-31
申请人： Dae-Hyun PARK , Han Kim , Myung-Sam Kang
发明人： Dae-Hyun PARK , Han Kim , Myung-Sam Kang
IPC分类号： H04B3/28
CPC分类号： H05K1/0236 , H05K1/165 , H05K2201/09309 , H05K2201/09627 , H05K2201/097
摘要： In an electromagnetic bandgap structure including a plurality of conductive plates and a stitching via part, in which the plurality of conductive plates are placed on a first planar surface, the stitching via part includes a first via having one end part connected to one of the two conductive plates, a second via having one end part connected to the other of the two conductive plates, a spiral connector forming a spirally-shaped serial link structure on at least one vertical planar surface that is perpendicular to the first planar surface, a first conductive pattern connecting one end part of the spiral connector and the other end part of the first via with each other and a second conductive connecting pattern connecting the other end part of the spiral connector and the other end part of the second via with each other.
摘要翻译： 在包括多个导电板和缝合通孔部分的电磁带隙结构中，其中多个导电板被放置在第一平坦表面上，该缝合通孔部分包括第一通孔，该第一通孔的一个端部连接到两个 导电板，具有连接到两个导电板中的另一个的一个端部的第二通孔，在垂直于第一平坦表面的至少一个垂直平面上形成螺旋形串联结构的螺旋形连接器，第一导电 螺旋连接器的一个端部和第一通孔的另一个端部彼此连接的图案，以及将螺旋形连接器的另一个端部和第二通孔的另一个端部彼此连接的第二导电连接图案。
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