公开(公告)号：US20090315194A1

公开(公告)日：2009-12-24

申请号：US12232528

申请日：2008-09-18

申请人： Jae Kul Lee ,  Yul Kyo Chung

发明人： Jae Kul Lee ,  Yul Kyo Chung

IPC分类号： H01L23/544 ,  H01L21/76

CPC分类号： H01L23/544 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3114 ,  H01L24/02 ,  H01L24/16 ,  H01L24/25 ,  H01L24/82 ,  H01L2223/54426 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/19 ,  H01L2224/83121 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K1/0269 ,  H05K1/185 ,  H05K3/4602 ,  H05K3/4679 ,  H05K2201/09918

摘要： Disclosed is a semiconductor chip having an alignment mark which is formed on the surface of the semiconductor chip where no external connection bump is formed, and which has the position information of the external connection bump. A method of manufacturing the semiconductor chip having an alignment mark is also provided. Because the semiconductor chip includes the alignment mark having the position information of the external connection bump, the external connection bump is matched with a via which is formed in the external circuit layer of a printed circuit board including the semiconductor chip, thus improving electrical connection with the printed circuit board, and increasing the reliability of the printed circuit board including the semiconductor chip.

摘要翻译： 公开了一种具有对准标记的半导体芯片，其形成在半导体芯片的没有形成外部连接凸块的表面上，并具有外部连接凸块的位置信息。 还提供了具有对准标记的制造半导体芯片的方法。 由于半导体芯片包括具有外部连接凸块的位置信息的对准标记，所以外部连接凸块与形成在包括半导体芯片的印刷电路板的外部电路层中的通路匹配，从而改善与 印刷电路板，并且增加包括半导体芯片的印刷电路板的可靠性。

公开(公告)号：US20090208640A1

公开(公告)日：2009-08-20

申请号：US12432221

申请日：2009-04-29

申请人： Won Hoon SONG ,  Yul Kyo Chung ,  Sung Taek Lim

发明人： Won Hoon SONG ,  Yul Kyo Chung ,  Sung Taek Lim

IPC分类号： B05D5/12 ,  C23C14/34

CPC分类号： H01L21/02197 ,  H01G4/33 ,  H01L21/02186 ,  H01L21/02282 ,  H01L21/31683 ,  H01L21/31691 ,  H05K1/162 ,  H05K2201/0175 ,  H05K2201/0179

摘要： The invention relates to a fabrication method of a composite metal oxide dielectric film containing at least two metallic elements on a substrate, and a composite metal oxide dielectric film fabricated thereby. The method includes: forming an amorphous film containing at least one of the metallic elements; preparing a hydrothermal solution where a precursor of the remaining element of the metallic elements is mixed; immersing the amorphous film into the hydrothermal solution; and hydrothermally treating the amorphous film so that the remaining one of the metallic elements is synthesized to the amorphous film, thereby forming a crystallized composite metal oxide film.

摘要翻译： 本发明涉及在基板上含有至少两种金属元素的复合金属氧化物电介质膜的制造方法以及由此制造的复合金属氧化物电介质膜。 该方法包括：形成含有至少一种金属元素的非晶膜; 制备其中混合金属元素的剩余元素的前体的水热溶液; 将非晶膜浸入水热溶液中; 对该非晶质膜进行水热处理，使残留的金属元素与非晶质膜合成，从而形成结晶化复合金属氧化物膜。

公开(公告)号：US08547132B2

公开(公告)日：2013-10-01

申请号：US12870347

申请日：2010-08-27

申请人： Hyun Ho Kim ,  Won Geun Jung ,  Yul Kyo Chung

发明人： Hyun Ho Kim ,  Won Geun Jung ,  Yul Kyo Chung

IPC分类号： G01R31/28

CPC分类号： G01R31/2818 ,  G01R31/2812 ,  H05K1/0268 ,  H05K1/185 ,  H05K2203/162

摘要： A circuit board includes an active device, a signal pad on a surface of the circuit board, at least one passive device electrically connecting the active device to the signal pad, and at least one test pad on the surface of the circuit board and electrically connected to a connection point between the active device and the at least one passive device. When a first passive device and a second passive device and a first test pad and a second test pad are provided, the first passive device and the second passive device are connected in series between the active device and the signal pad in this order, the first test pad is connected to a connection point between the active device and the first passive device, and the second test pad is connected to a connection point between the first passive device and the second passive device.

摘要翻译： 电路板包括有源器件，电路板表面上的信号焊盘，至少一个将有源器件电连接到信号焊盘的无源器件，以及电路板表面上的至少一个测试焊盘，并电连接 到活动设备和至少一个无源设备之间的连接点。 当提供第一无源器件和第二无源器件以及第一测试焊盘和第二测试焊盘时，第一无源器件和第二无源器件依次连接在有源器件和信号焊盘之间，第一无源器件 测试垫连接到有源器件和第一无源器件之间的连接点，第二测试焊盘连接到第一无源器件和第二无源器件之间的连接点。

公开(公告)号：US07886436B2

公开(公告)日：2011-02-15

申请号：US12370818

申请日：2009-02-13

申请人： Jin Seok Moon ,  Yul Kyo Chung ,  Soo Hyun Lyoo ,  Seung Hyun Sohn

发明人： Jin Seok Moon ,  Yul Kyo Chung ,  Soo Hyun Lyoo ,  Seung Hyun Sohn

IPC分类号： H05K3/10

CPC分类号： H05K1/162 ,  H05K3/388 ,  H05K2201/0175 ,  H05K2201/0179 ,  Y10T29/417 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155

摘要： Disclosed herein is a printed circuit board with an embedded thin-film capacitor, and a method of manufacturing the same.Specifically, the present invention relates to a printed circuit board with an embedded thin-film capacitor, comprising a lower electrode formed on an insulating substrate; an amorphous paraelectric film formed on the lower electrode; a metal seed layer formed on the paraelectric film; and an upper electrode formed on the metal seed layer and having a surface roughness (Ra) of more than 300 nm; and a method of manufacturing a printed circuit board with an embedded thin-film capacitor, comprising forming a lower electrode on an insulating substrate; forming an amorphous paraelectric film on the lower electrode, using a low-temperature film formation process; forming a metal seed layer on the paraelectric film; and forming an upper electrode having a surface roughness (Ra) of more than 300 nm on the metal seed layer, using an electroplating method.

摘要翻译： 这里公开了具有嵌入式薄膜电容器的印刷电路板及其制造方法。 具体地说，本发明涉及一种具有嵌入式薄膜电容器的印刷电路板，包括形成在绝缘基板上的下电极; 形成在下电极上的非晶顺电膜; 形成在顺电膜上的金属种子层; 和形成在金属籽晶层上并具有大于300nm的表面粗糙度（Ra）的上电极; 以及制造具有嵌入式薄膜电容器的印刷电路板的方法，包括在绝缘基板上形成下电极; 使用低温成膜法在下电极上形成非晶顺电膜; 在顺电膜上形成金属种子层; 并且使用电镀方法在金属籽晶层上形成表面粗糙度（Ra）大于300nm的上电极。

公开(公告)号：US07675756B2

公开(公告)日：2010-03-09

申请号：US11593088

申请日：2006-11-06

申请人： Jin Seok Moon ,  Yul Kyo Chung ,  Soo Hyun Lyoo ,  Seung Hyun Sohn

发明人： Jin Seok Moon ,  Yul Kyo Chung ,  Soo Hyun Lyoo ,  Seung Hyun Sohn

IPC分类号： H05K1/16

CPC分类号： H05K1/162 ,  H05K3/388 ,  H05K2201/0175 ,  H05K2201/0179 ,  Y10T29/417 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155

摘要： Disclosed herein is a printed circuit board with an embedded thin-film capacitor, and a method of manufacturing the same.Specifically, the present invention relates to a printed circuit board with an embedded thin-film capacitor, comprising a lower electrode formed on an insulating substrate; an amorphous paraelectric film formed on the lower electrode; a metal seed layer formed on the paraelectric film; and an upper electrode formed on the metal seed layer and having a surface roughness (Ra) of more than 300 nm; anda method of manufacturing a printed circuit board with an embedded thin-film capacitor, comprising forming a lower electrode on an insulating substrate; forming an amorphous paraelectric film on the lower electrode, using a low-temperature film formation process; forming a metal seed layer on the paraelectric film; and forming an upper electrode having a surface roughness (Ra) of more than 300 nm on the metal seed layer, using an electroplating method.

摘要翻译： 这里公开了具有嵌入式薄膜电容器的印刷电路板及其制造方法。 具体地说，本发明涉及一种具有嵌入式薄膜电容器的印刷电路板，包括形成在绝缘基板上的下电极; 形成在下电极上的非晶顺电膜; 形成在顺电膜上的金属种子层; 和形成在金属籽晶层上并具有大于300nm的表面粗糙度（Ra）的上电极; 以及制造具有嵌入式薄膜电容器的印刷电路板的方法，包括在绝缘基板上形成下电极; 使用低温成膜法在下电极上形成非晶顺电膜; 在顺电膜上形成金属种子层; 并且使用电镀方法在金属籽晶层上形成表面粗糙度（Ra）大于300nm的上电极。

公开(公告)号：US20090301766A1

公开(公告)日：2009-12-10

申请号：US12219441

申请日：2008-07-22

申请人： Hwa Sun Park ,  Yul Kyo Chung ,  Jin Won Lee ,  Jin Soo Jeong

发明人： Hwa Sun Park ,  Yul Kyo Chung ,  Jin Won Lee ,  Jin Soo Jeong

IPC分类号： H05K1/03 ,  H01R43/00

CPC分类号： H05K1/185 ,  H01L23/3121 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K3/4602 ,  H05K2201/0394 ,  H05K2201/10674 ,  H05K2201/10969 ,  Y10T29/49171

摘要： Disclosed herein is a printed circuit board including an electronic component embedded therein, as the electronic component is supported on the metal layer of core substrate, thus supporting and radiation performances are improved, production costs are reduced, and the manufacturing process is simplified.

摘要翻译： 这里公开了包括嵌入其中的电子部件的印刷电路板，由于电子部件被支撑在芯基板的金属层上，因此支撑和辐射性能得到改善，生产成本降低，并且制造过程简化。

公开(公告)号：US20090223706A1

公开(公告)日：2009-09-10

申请号：US12466841

申请日：2009-05-15

申请人： Jung Won LEE ,  Yul Kyo Chung ,  In Hyung Lee

发明人： Jung Won LEE ,  Yul Kyo Chung ,  In Hyung Lee

IPC分类号： H05K1/16 ,  H01G4/002 ,  H05K3/10

CPC分类号： H05K1/162 ,  H01G4/33 ,  H01G13/00 ,  H01L21/4857 ,  H01L23/50 ,  H01L2924/0002 ,  H05K2201/0108 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2203/016 ,  H05K2203/107 ,  Y10T29/43 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

摘要： A method for manufacturing a printed circuit board with a capacitor embedded therein which has a dielectric film using laser lift off, and a capacitor manufactured thereby. In the method, a dielectric film is formed on a transparent substrate and heat-treated. A first conductive layer is formed on the heat-treated dielectric film. A laser beam is irradiated onto a stack formed, from below the transparent substrate, to separate the transparent substrate from the stack. After the transparent substrate is separated from the stack, a second conductive layer is formed with a predetermined pattern on the dielectric film. Also, an insulating layer and a third conductive layer are formed on the first and second conductive layers to alternate with each other in a predetermined number.

摘要翻译： 一种制造其中嵌有电容器的印刷电路板的方法，其中具有使用激光剥离的电介质膜，以及由此制造的电容器。 在该方法中，在透明基板上形成电介质膜并进行热处理。 在热处理电介质膜上形成第一导电层。 将激光束照射到从透明基板的下方形成的堆叠上，以将透明基板与堆叠分离。 在将透明基板与堆叠体分离之后，在电介质膜上形成具有预定图案的第二导电层。 此外，绝缘层和第三导电层形成在第一和第二导电层上，以预定数量相互交替。

公开(公告)号：US08039759B2

公开(公告)日：2011-10-18

申请号：US11808298

申请日：2007-06-08

申请人： Jung Won Lee ,  Yul Kyo Chung ,  In Hyung Lee

发明人： Jung Won Lee ,  Yul Kyo Chung ,  In Hyung Lee

IPC分类号： H05K1/16

CPC分类号： H05K1/162 ,  H01G4/33 ,  H01G13/00 ,  H01L21/4857 ,  H01L23/50 ,  H01L2924/0002 ,  H05K2201/0108 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2203/016 ,  H05K2203/107 ,  Y10T29/43 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

摘要： A method for manufacturing a printed circuit board with a capacitor embedded therein which has a dielectric film using laser lift off, and a capacitor manufactured thereby. In the method, a dielectric film is formed on a transparent substrate and heat-treated. A first conductive layer is formed on the heat-treated dielectric film. A laser beam is irradiated onto a stack formed, from below the transparent substrate, to separate the transparent substrate from the stack. After the transparent substrate is separated from the stack, a second conductive layer is formed with a predetermined pattern on the dielectric film. Also, an insulating layer and a third conductive layer are formed on the first and second conductive layers to alternate with each other in a predetermined number.

公开(公告)号：US20110034606A1

公开(公告)日：2011-02-10

申请号：US12906540

申请日：2010-10-18

申请人： Eun Tae PARK ,  Yul Kyo Chung ,  Seung Hyun Sohn ,  Min Ji Ko

发明人： Eun Tae PARK ,  Yul Kyo Chung ,  Seung Hyun Sohn ,  Min Ji Ko

IPC分类号： C08K3/22

CPC分类号： H05K1/162 ,  H01G4/206 ,  H01L2924/0002 ,  H05K2201/0209 ,  H01L2924/00

摘要： Disclosed herein is a composite dielectric composition having a small variation of capacitance with temperature, comprising a combination of a polymer matrix exhibiting a positive or negative variation of capacitance with temperature and a ceramic filler exhibiting a negative or positive variation of capacitance with temperature which is reciprocal to that of the polymer matrix; and a signal-matching embedded capacitor prepared by using the same composition. Particularly, the present invention provides a composite dielectric composition comprising a polymer matrix exhibiting a positive or negative variation of capacitance with temperature and a ceramic filler exhibiting a variation of capacitance which is reciprocal to that of the polymer matrix; and a signal-matching embedded capacitor formed of the same composition and having a variation of capacitance with temperature, ΔC/C×100(%), of not more than 5%. The composite dielectric composition of the present invention can be used in preparation of the signal-matching embedded capacitor due to a small variation of capacitance with temperature.

摘要翻译： 本文公开了一种具有小的电容变化与温度的复合电介质组合物，其包括表现出电容与温度的正或负变化的聚合物基体和陶瓷填料的组合，所述陶瓷填料表现出与温度成反比的电容的负或正变化 与聚合物基体的相同; 以及通过使用相同组成制备的信号匹配嵌入式电容器。 特别地，本发明提供一种复合电介质组合物，其包含显示电容与温度的正或负变化的聚合物基质和表现出与聚合物基体相反的电容变化的陶瓷填料; 以及具有相同组成并且具有不大于5％的电容与温度变化的信号匹配嵌入式电容器，并且Dgr; C / C×100（％）。 本发明的复合电介质组合物由于电容随温度的变化小而可用于制备信号匹配嵌入式电容器。

公开(公告)号：US20090152121A1

公开(公告)日：2009-06-18

申请号：US12370818

申请日：2009-02-13

申请人： Jin Seok MOON ,  Yul Kyo Chung ,  Soo Hyun Lyoo ,  Seung Hyun Sohn

发明人： Jin Seok MOON ,  Yul Kyo Chung ,  Soo Hyun Lyoo ,  Seung Hyun Sohn

IPC分类号： C25D5/00

CPC分类号： H05K1/162 ,  H05K3/388 ,  H05K2201/0175 ,  H05K2201/0179 ,  Y10T29/417 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155

摘要： Disclosed herein is a printed circuit board with an embedded thin-film capacitor, and a method of manufacturing the same.Specifically, the present invention relates to a printed circuit board with an embedded thin-film capacitor, comprising a lower electrode formed on an insulating substrate; an amorphous paraelectric film formed on the lower electrode; a metal seed layer formed on the paraelectric film; and an upper electrode formed on the metal seed layer and having a surface roughness (Ra) of more than 300 nm; anda method of manufacturing a printed circuit board with an embedded thin-film capacitor, comprising forming a lower electrode on an insulating substrate; forming an amorphous paraelectric film on the lower electrode, using a low-temperature film formation process; forming a metal seed layer on the paraelectric film; and forming an upper electrode having a surface roughness (Ra) of more than 300 nm on the metal seed layer, using an electroplating method.

摘要翻译： 这里公开了具有嵌入式薄膜电容器的印刷电路板及其制造方法。 具体地说，本发明涉及一种具有嵌入式薄膜电容器的印刷电路板，包括形成在绝缘基板上的下电极; 形成在下电极上的非晶顺电膜; 形成在顺电膜上的金属种子层; 和形成在金属籽晶层上并具有大于300nm的表面粗糙度（Ra）的上电极; 以及制造具有嵌入式薄膜电容器的印刷电路板的方法，包括在绝缘基板上形成下电极; 使用低温成膜法在下电极上形成非晶顺电膜; 在顺电膜上形成金属种子层; 并且使用电镀方法在金属籽晶层上形成表面粗糙度（Ra）大于300nm的上电极。