公开(公告)号：US20200303333A1

公开(公告)日：2020-09-24

申请号：US16533751

申请日：2019-08-06

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu

IPC: H01L23/00 ,  H01L23/31 ,  H01L21/56

Abstract: An electronic package is provided. An electronic component and a plurality of conductive pillars electrically connected with the electronic component are embedded in an encapsulating layer. Each of the conductive pillars has a circumferential surface and two end surfaces wider than the circumferential surface in width. The encapsulating layer encapsulates and protects the electronic component effectively, so as to improve the reliability of the electronic package. A method for fabricating the electronic package is also provided.

公开(公告)号：US20200152607A1

公开(公告)日：2020-05-14

申请号：US16740631

申请日：2020-01-13

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu

IPC: H01L25/065 ,  H01L23/495 ,  H01L25/03 ,  H01L25/10 ,  H01L25/16 ,  H01L25/00 ,  H01L23/00 ,  H01L23/552 ,  H01L23/31 ,  H01L21/56

Abstract: An electronic package structure is provided, which includes: a first carrier having an opening; at least a first electronic component and a plurality of conductive elements disposed on the first carrier; a second carrier bonded to the conductive elements; at least a second electronic component disposed on the second carrier and received in the opening of the first carrier; and an encapsulant formed on the first carrier and the second carrier and encapsulating the first electronic component, the second electronic component and the conductive elements. By receiving the second electronic component in the opening of the first carrier, the present disclosure reduces the height of the electronic package structure. The present disclosure further provides a method for fabricating the electronic package structure.

公开(公告)号：US20200090952A1

公开(公告)日：2020-03-19

申请号：US16196503

申请日：2018-11-20

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Yu-Wei Yeh ,  Yen-Hung Lin ,  Chih-Yi Liao ,  Chih-Hsien Chiu

IPC: H01L21/48 ,  H01L23/538 ,  H01L23/31 ,  H01L21/56

Abstract: The present disclosure provides an electronic package and a method for fabricating the same. A protective layer is formed on a carrier of the electronic component. The electronic component and the protective layer are covered by a covering layer. A through hole is formed in the covering layer and extends through the protective layer, such that a portion of a surface of the carrier is exposed to the through hole. A conductive structure is disposed in the through hole and electrically connected with the carrier. Through the formation of the protective layer, the buffering effect of the protective layer can prevent the laser from directly burning through the covering layer and the protective layer to avoid damages to the carrier.

公开(公告)号：US10587041B2

公开(公告)日：2020-03-10

申请号：US15596113

申请日：2017-05-16

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Yuan Shih ,  Chih-Hsien Chiu ,  Yueh-Chiung Chang ,  Tsung-Li Lin ,  Chi-Pin Tsai ,  Chien-Cheng Lin ,  Tsung-Hsien Tsai ,  Heng-Cheng Chu ,  Ming-Fan Tsai

IPC: H01L23/552 ,  H01Q1/52 ,  H01Q9/42 ,  H01Q1/24 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L23/66 ,  H01Q1/22 ,  H01Q1/48

Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.

公开(公告)号：US10230152B2

公开(公告)日：2019-03-12

申请号：US14098490

申请日：2013-12-05

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Heng-Cheng Chu ,  Chien-Cheng Lin ,  Tsung-Hsien Tsai ,  Chao-Ya Yang

IPC: H01Q1/24 ,  H01Q1/22 ,  H01Q1/52 ,  H01L23/552

Abstract: An electronic package is provided, which includes: a substrate; at least an electronic element disposed on the substrate; an antenna structure disposed on the substrate; and an encapsulant formed on the substrate for encapsulating the electronic element and the antenna structure. Therein, the antenna structure has an extension portion and a plurality of support portions connected to the extension portion for supporting the extension portion over the substrate so as to save the surface area of the substrate, thereby meeting the miniaturization requirement of the electronic package.

公开(公告)号：US20180342484A1

公开(公告)日：2018-11-29

申请号：US15694613

申请日：2017-09-01

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Chia-Yang Chen ,  Chih-Chiang He

IPC: H01L25/065 ,  H01L25/00

Abstract: An electronic package and a method for fabricating the same are provided. A metal member including a supporting plate and a plurality of conductive pillars disposed on the supporting plate is provided. A circuit structure is coupled to the conductive pillars. An electronic component is disposed on the metal member and electrically connected to the circuit structure. An encapsulant encapsulates the conductive pillars and the electronic component. Any mold can be used for fabricating the electronic package, no matter what the size of the electronic package is. Therefore, the fabricating cost of the electronic package is reduced.

公开(公告)号：US20180315715A1

公开(公告)日：2018-11-01

申请号：US15660227

申请日：2017-07-26

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Chia-Yang Chen

IPC: H01L23/552 ,  H01L23/66 ,  H01L23/31 ,  H01L21/56

Abstract: An electronic package and a method for fabricating the same are provided. The method includes disposing an electronic component on a lower side of a first carrier and forming an encapsulant on an upper side of the first carrier. A first conductor is disposed on the encapsulant and configured for generating radiation energy by an alternating voltage, an alternating current or radiation variation. As such, the electronic package has a reduced thickness and improved antenna efficiency.

公开(公告)号：US09997477B2

公开(公告)日：2018-06-12

申请号：US15094125

申请日：2016-04-08

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Tsung-Hsien Tsai ,  Heng-Cheng Chu ,  Chien-Cheng Lin ,  Chih-Hsien Chiu ,  Hsin-Lung Chung ,  Yude Chu

IPC: H01L23/66 ,  H01L49/02 ,  H01L23/64 ,  H01L23/00 ,  H01L25/16 ,  H01L25/00 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/66 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/64 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L25/16 ,  H01L25/50 ,  H01L28/00 ,  H01L2223/6661 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package and a method of manufacturing the same are provided. The semiconductor package includes: a substrate having a plurality of conductive lands and a plurality of bonding pads surrounding the conductive lands formed on a surface thereof; a plurality of passive devices mounted on the conductive lands; an insulation layer formed on the surface and having a portion of the passive devices embedded therein; a semiconductor chip mounted on a top surface of the insulation layer; a plurality of bonding wires electrically connecting the semiconductor chip and the bonding pads; an encapsulant formed on the surface of the substrate to encapsulate the insulation layer, the bonding wires and the semiconductor chip, wherein a region of the semiconductor chip projected onto the substrate covers a portion of an outermost one of the passive devices. Therefore, the mounting density of the passive devices is improved.

公开(公告)号：US20180063966A1

公开(公告)日：2018-03-01

申请号：US15607872

申请日：2017-05-30

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Chen-Wen Huang ,  Hsin-Lung Chung ,  Wen-Jung Tsai ,  Jia-Huei Hung ,  Fu-Tang Huang

IPC: H05K3/32 ,  H01L23/00 ,  H01L23/373 ,  H01L21/48

CPC classification number: H05K3/323 ,  H01L21/4853 ,  H01L23/373 ,  H01L24/73

Abstract: An electronic package structure is provided, which includes: a carrier; at least one electronic component and a plurality of conductive elements disposed on the carrier; a metal frame bonded to the conductive elements; and an encapsulant formed on the carrier and the metal frame and encapsulating the electronic component and the conductive elements. The metal frame is exposed from the encapsulant to serve as an electrical contact. As such, instead of using a mold having a particular size corresponding to the electronic package structure as in the prior art, the present disclosure can use a common mold to form the encapsulant, thereby reducing the fabrication cost. The present disclosure further provides a method for fabricating the electronic package structure.

公开(公告)号：US20180061809A1

公开(公告)日：2018-03-01

申请号：US15352822

申请日：2016-11-16

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu

IPC: H01L25/065 ,  H01L23/31 ,  H01L23/495 ,  H01L23/552 ,  H01L21/56 ,  H01L23/00

Abstract: An electronic package structure is provided, which includes: a first carrier having an opening; at least a first electronic component and a plurality of conductive elements disposed on the first carrier; a second carrier bonded to the conductive elements; at least a second electronic component disposed on the second carrier and received in the opening of the first carrier; and an encapsulant formed on the first carrier and the second carrier and encapsulating the first electronic component, the second electronic component and the conductive elements. By receiving the second electronic component in the opening of the first carrier, the present disclosure reduces the height of the electronic package structure. The present disclosure further provides a method for fabricating the electronic package structure.