公开(公告)号：US10509163B2

公开(公告)日：2019-12-17

申请号：US15426823

申请日：2017-02-07

Applicant: Skorpios Technologies, Inc.

Inventor： Guoliang Li ,  Stephen B. Krasulick ,  Samir Desai

IPC: G02B6/12 ,  H04B10/50 ,  H01S5/022 ,  G02B6/122 ,  G02B6/136 ,  H01S5/02 ,  H01S5/028 ,  H01S5/22 ,  H01S5/343 ,  H01S5/40 ,  H01S5/30 ,  H04J14/02 ,  H01S5/026

Abstract: A 400 Gb/s transmitter is integrated on a silicon substrate. The transmitter uses four gain chips, sixteen lasers, four modulators to modulate the sixteen lasers at 25 Gb/s, and four multiplexers to produce four optical outputs. Each optical output can transmit at 100 Gb/s to produce a 400 Gb/s transmitter. Other variations are also described.

公开(公告)号：US20190170572A1

公开(公告)日：2019-06-06

申请号：US16178840

申请日：2018-11-02

Applicant: Skorpios Technologies, Inc.

Inventor： Robert J. Stone ,  Stephen B. Krasulick

IPC: G01J1/08 ,  H04B17/00 ,  H04B10/073 ,  G01J1/42 ,  G01R31/3187 ,  H04B10/077 ,  H04B10/035

CPC classification number: G01J1/08 ,  G01J1/42 ,  G01J2001/083 ,  G01J2001/4247 ,  G01R31/3187 ,  H04B10/035 ,  H04B10/0731 ,  H04B10/0779 ,  H04B17/0082

Abstract: A photonics system includes a transmit photonics module and a receive photonics module. The photonics system also includes a transmit waveguide coupled to the transmit photonics module, a first optical switch integrated with the transmit waveguide, and a diagnostics waveguide optically coupled to the first optical switch. The photonics system further includes a receive waveguide coupled to the receive photonics module and a second optical switch integrated with the receive waveguide and optically coupled to the diagnostics waveguide.

公开(公告)号：US20180308834A1

公开(公告)日：2018-10-25

申请号：US15900590

申请日：2018-02-20

Applicant: Skorpios Technologies, Inc.

Inventor： Stephen B. Krasulick ,  Timothy Creazzo ,  Elton Marchena ,  John Dallesasse

IPC: H01L25/00 ,  G02B6/13 ,  H01L21/48 ,  H01L21/74 ,  H01L21/762 ,  H01L31/18 ,  H01L21/8258 ,  H01L21/84 ,  G02B6/00 ,  H01L33/00 ,  H01L25/16 ,  H01S5/02 ,  H01S5/022

CPC classification number: H01L25/50 ,  G02B6/00 ,  G02B6/13 ,  H01L21/4857 ,  H01L21/746 ,  H01L21/76251 ,  H01L21/76254 ,  H01L21/8258 ,  H01L21/84 ,  H01L25/167 ,  H01L31/18 ,  H01L33/0079 ,  H01L2224/04105 ,  H01L2224/16225 ,  H01L2224/18 ,  H01L2224/24 ,  H01L2224/73259 ,  H01L2224/73267 ,  H01L2224/82 ,  H01L2224/92224 ,  H01L2224/92244 ,  H01L2924/0002 ,  H01S5/021 ,  H01S5/0215 ,  H01S5/0224 ,  H01L2924/00

Abstract: Fabricating a multilevel composite semiconductor structure includes providing a first substrate comprising a first material; dicing a second substrate to provide a plurality of dies; mounting the plurality of dies on a third substrate; joining the first substrate and the third substrate to form a composite structure; and joining a fourth substrate and the composite structure.

公开(公告)号：US09922967B2

公开(公告)日：2018-03-20

申请号：US14862435

申请日：2015-09-23

Applicant: Skorpios Technologies, Inc.

Inventor： Stephen B. Krasulick

IPC: H01L25/16 ,  H01L25/00 ,  H01L21/48 ,  H01L21/74 ,  H01L21/84 ,  G02B6/13 ,  H01L21/8258 ,  H01L21/762 ,  H01L31/18 ,  H01S5/02 ,  H01L33/00 ,  H01S5/022

CPC classification number: H01L25/50 ,  G02B6/00 ,  G02B6/13 ,  H01L21/4857 ,  H01L21/746 ,  H01L21/76251 ,  H01L21/76254 ,  H01L21/8258 ,  H01L21/84 ,  H01L25/167 ,  H01L31/18 ,  H01L33/0079 ,  H01L2224/04105 ,  H01L2224/16225 ,  H01L2224/18 ,  H01L2224/24 ,  H01L2224/73259 ,  H01L2224/73267 ,  H01L2224/82 ,  H01L2224/92224 ,  H01L2224/92244 ,  H01L2924/0002 ,  H01S5/021 ,  H01S5/0215 ,  H01S5/0224 ,  H01L2924/00

Abstract: Fabricating a multilevel composite semiconductor structure includes providing a first substrate comprising a first material; dicing a second substrate to provide a plurality of dies; mounting the plurality of dies on a third substrate; joining the first substrate and the third substrate to form a composite structure; and joining a fourth substrate and the composite structure.

公开(公告)号：US20180052283A1

公开(公告)日：2018-02-22

申请号：US15633343

申请日：2017-06-26

Applicant: Skorpios Technologies, Inc.

Inventor： Stephen B. Krasulick ,  John Dallesasse

IPC: G02B6/122 ,  G02B6/136 ,  G02B6/12 ,  H01S5/022 ,  H01L25/16 ,  H01L25/00 ,  H01L33/44 ,  H01L33/48 ,  H01L33/62 ,  H01S5/02 ,  H01L33/00

CPC classification number: H01L25/167 ,  G02B6/12002 ,  G02B6/1225 ,  G02B6/136 ,  G02B2006/12061 ,  G02B2006/12147 ,  H01L25/0753 ,  H01L25/16 ,  H01L25/50 ,  H01L33/0079 ,  H01L33/44 ,  H01L33/486 ,  H01L33/62 ,  H01L2924/00 ,  H01L2924/0002 ,  H01S5/021 ,  H01S5/02272 ,  H01S5/1003

Abstract: A method of fabricating a composite integrated optical device includes providing a substrate comprising a silicon layer, forming a waveguide in the silicon layer, and forming a layer comprising a metal material coupled to the silicon layer. The method also includes providing an optical detector, forming a metal-assisted bond between the metal material and a first portion of the optical detector, forming a direct semiconductor-semiconductor bond between the waveguide, and a second portion of the optical detector.

公开(公告)号：US09882073B2

公开(公告)日：2018-01-30

申请号：US14509979

申请日：2014-10-08

Applicant: Skorpios Technologies, Inc.

Inventor： Stephen B. Krasulick ,  John Dallesasse ,  Amit Mizrahi ,  Timothy Creazzo ,  Elton Marchena ,  John Y. Spann

IPC: H01L31/102 ,  H01L31/0232 ,  H01S5/022 ,  H01S5/026 ,  H01S5/30 ,  H01S5/02

CPC classification number: H01L31/02327 ,  G02B6/423 ,  H01S5/0207 ,  H01S5/021 ,  H01S5/0217 ,  H01S5/0218 ,  H01S5/0224 ,  H01S5/02248 ,  H01S5/02252 ,  H01S5/02268 ,  H01S5/02272 ,  H01S5/02469 ,  H01S5/026 ,  H01S5/3013 ,  H01S2301/176

Abstract: A composite photonic device comprises a platform, a chip, and a contact layer. The platform comprises silicon. The chip is made of a III-V material. The contact layer has indentations to help control a flow of solder during bonding of the platform with the chip. In some embodiments, pedestals are placed under an optical path to prevent solder from flowing between the chip and the platform at the optical path.

公开(公告)号：US20170108649A1

公开(公告)日：2017-04-20

申请号：US15246925

申请日：2016-08-25

Applicant: Skorpios Technologies, Inc.

Inventor： John Dallesasse ,  Stephen B. Krasulick

IPC: G02B6/27 ,  G02F1/09 ,  G02F1/00 ,  G02B6/126

CPC classification number: G02B6/2746 ,  G02B5/3058 ,  G02B6/105 ,  G02B6/126 ,  G02B6/26 ,  G02B6/2726 ,  G02B6/2766 ,  G02B2006/12061 ,  G02F1/0036 ,  G02F1/093

Abstract: An integrated non-reciprocal polarization rotator comprises a substrate, a Faraday crystal, a first waveguide, and a second waveguide. The substrate has a recess extending to a predetermined depth. The Faraday crystal is mounted in the recess and optically coupled with the first waveguide and the second waveguide.

公开(公告)号：US20160248516A1

公开(公告)日：2016-08-25

申请号：US15048222

申请日：2016-02-19

Applicant: Skorpios Technologies, Inc.

Inventor： Stephen B. Krasulick ,  Timothy Creazzo ,  Kalpit Jha ,  Elton Marchena ,  Amit Mizrahi

IPC: H04B10/556 ,  H04B10/079 ,  H04J14/02 ,  H04B10/564

CPC classification number: H04B10/5561 ,  H04B10/07955 ,  H04B10/5053 ,  H04B10/564 ,  H04J14/0227 ,  H04L27/2096

Abstract: A method of operating a BPSK modulator includes receiving an RF signal at the BPSK modulator and splitting the RF signal into a first portion and a second portion that is inverted with respect to the first portion. The method also includes receiving the first portion at a first arm of the BPSK modulator, receiving the second portion at a second arm of the BPSK modulator, applying a first tone to the first arm of the BPSK modulator, and applying a second tone to the second arm of the BPSK modulator. The method further includes measuring a power associated with an output of the BPSK modulator and adjusting a phase applied to at least one of the first arm of the BPSK modulator or the second arm of the BPSK modulator in response to the measured power.

Abstract translation: 一种操作BPSK调制器的方法包括在BPSK调制器处接收RF信号，并将RF信号分成第一部分和相对于第一部分反相的第二部分。 该方法还包括在BPSK调制器的第一臂处接收第一部分，在BPSK调制器的第二臂处接收第二部分，向BPSK调制器的第一臂应用第一音调，并向第 BPSK调制器的第二臂。 该方法还包括测量与BPSK调制器的输出相关联的功率，并且响应于测量的功率调整施加到BPSK调制器的第一臂或BPSK调制器的第二臂中的至少一个的相位。

公开(公告)号：US20160111407A1

公开(公告)日：2016-04-21

申请号：US14862435

申请日：2015-09-23

Applicant: Skorpios Technologies, Inc.

Inventor： Stephen B. Krasulick

IPC: H01L25/00 ,  H01L21/84 ,  H01L21/74 ,  H01L21/78 ,  H01L21/48

CPC classification number: H01L25/50 ,  G02B6/00 ,  G02B6/13 ,  H01L21/4857 ,  H01L21/746 ,  H01L21/76251 ,  H01L21/76254 ,  H01L21/8258 ,  H01L21/84 ,  H01L25/167 ,  H01L31/18 ,  H01L33/0079 ,  H01L2224/04105 ,  H01L2224/16225 ,  H01L2224/18 ,  H01L2224/24 ,  H01L2224/73259 ,  H01L2224/73267 ,  H01L2224/82 ,  H01L2224/92224 ,  H01L2224/92244 ,  H01L2924/0002 ,  H01S5/021 ,  H01S5/0215 ,  H01S5/0224 ,  H01L2924/00

Abstract: A multilayer semiconductor has stacks of composite semiconductor materials. Multiple composite devices are bonded on a silicon-on-insulator wafer forming an integrated device.

Abstract translation: 多层半导体具有堆叠的复合半导体材料。 多个复合器件结合在形成集成器件的绝缘体上硅晶片上。

公开(公告)号：US09316785B2

公开(公告)日：2016-04-19

申请号：US14509914

申请日：2014-10-08

Applicant: Skorpios Technologies, Inc.

Inventor： Stephen B. Krasulick ,  John Dallesasse ,  Amit Mizrahi ,  Timothy Creazzo ,  Elton Marchena ,  John Y. Spann

IPC: G02B6/12 ,  G02B6/122 ,  H01S5/022 ,  H01S5/00

CPC classification number: G02B6/1225 ,  G02B6/12004 ,  G02B2006/12176 ,  H01L2224/32225 ,  H01S5/005 ,  H01S5/02252

Abstract: A composite device for splitting photonic functionality across two or more materials comprises a platform, a chip, and a bond securing the chip to the platform. The platform comprises a base layer and a device layer. The device layer comprises silicon and has an opening exposing a portion of the base layer. The chip, a III-V material, comprises an active region (e.g., gain medium for a laser). The chip is bonded to the portion of the base layer exposed by the opening such that the active region of the chip is aligned with the device layer of the platform. A coating hermitically seals the chip in the platform.

Abstract translation: 用于在两种或多种材料上分离光子功能的复合器件包括平台，芯片和将芯片固定到平台的接合。 平台包括基层和器件层。 器件层包括硅并且具有露出基底层的一部分的开口。 芯片III-V材料包括有源区（例如，用于激光的增益介质）。 芯片被接合到由开口暴露的基层的部分，使得芯片的有源区域与平台的器件层对准。 涂层在平台上密封芯片。