公开(公告)号：US20060145335A1

公开(公告)日：2006-07-06

申请号：US11365674

申请日：2006-03-02

申请人： Takanori Teshima ,  Shusaku Nakazawa

发明人： Takanori Teshima ,  Shusaku Nakazawa

IPC分类号： H01L23/34 ,  H01L21/48

CPC分类号： H01L24/33 ,  H01L23/4334 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L25/072 ,  H01L2224/32245 ,  H01L2224/33 ,  H01L2224/33181 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01043 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device includes a heater element; a first heat sink disposed on one side of the heater element; a second heat sink disposed on the other side of the heater element; and a resin mold for molding the heater element and the first and second heat sinks. The first heat sink includes a first heat radiation surface, which is disposed opposite to the heater element and exposed from the resin mold. The second heat sink includes a second heat radiation surface, which is disposed opposite to the heater element and exposed from the resin mold. The first and second heat radiation surfaces have a degree of parallelism therebetween equal to or smaller than 0.2 mm.

摘要翻译： 半导体器件包括加热元件; 设置在所述加热器元件一侧的第一散热器; 设置在所述加热器元件的另一侧的第二散热器; 以及用于模制加热器元件和第一和第二散热器的树脂模具。 第一散热器包括第一散热表面，第一散热表面与加热器元件相对设置并且从树脂模具露出。 第二散热器包括第二散热表面，第二散热表面与加热器元件相对设置并且从树脂模具露出。 第一和第二散热表面之间的平行度等于或小于0.2mm。

公开(公告)号：US07019395B2

公开(公告)日：2006-03-28

申请号：US10802720

申请日：2004-03-18

申请人： Naohiko Hirano ,  Takanori Teshima

发明人： Naohiko Hirano ,  Takanori Teshima

IPC分类号： H01L23/34

CPC分类号： H01L23/4338 ,  H01L23/473 ,  H01L2224/32245 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00

摘要： A semiconductor module includes a fixed type and transformable type coolers and a flat semiconductor package sandwiched between the coolers. A relative positional relationship of the semiconductor package is fixed with the fixed type cooler, but variable with the transformable type cooler. The transformable type cooler includes a transformable member of a metal thin plate covering a coolant chamber. The semiconductor module includes a sandwiching mechanism causing the fixed type cooler to be pressed toward the transformable type cooler. Fastening adjustment screws of the sandwiching mechanism causes a pressing frame to approach a cooler body of the transformable type cooler. Therefore, the semiconductor package is pressed via the fixed type cooler while the transformable member is slightly transformed. This enhances a degree of contact between the semiconductor package and transformable member via an insulating member.

摘要翻译： 半导体模块包括固定型和可变形型冷却器以及夹在冷却器之间的扁平半导体封装。 半导体封装的相对位置关系用固定式冷却器固定，但是可变形冷却器可变。 可变形型冷却器包括覆盖冷却剂室的金属薄板的可变形构件。 半导体模块包括使固定式冷却器朝向可变形型冷却器按压的夹持机构。 夹紧机构的紧固调节螺钉使得压框接近可变形式冷却器的较冷体。 因此，通过固定式冷却器对半导体封装进行压制，而可变形构件稍微变形。 这通过绝缘构件增强了半导体封装和可变形构件之间的接触程度。

公开(公告)号：US06963133B2

公开(公告)日：2005-11-08

申请号：US10127613

申请日：2002-04-23

申请人： Takanori Teshima

发明人： Takanori Teshima

IPC分类号： B29C45/14 ,  B29L31/34 ,  H01L21/56 ,  H01L23/28 ,  H01L23/29 ,  H01L23/31 ,  H01L23/433 ,  H01L23/48 ,  H01L23/34 ,  H05K7/20

CPC分类号： H01L24/33 ,  H01L21/565 ,  H01L23/3135 ,  H01L23/4334 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device includes a semiconductor chip generating heat, a pair of heat sinks, which face each other, to conduct heat from both surfaces of the chip, a pair of compressible insulating sheets, and a mold resin covering the chip, the heat sinks, and the sheets such that the sheets are exposed from the surface of the resin. The mold resin is prevented from covering the outer surfaces of the heat sinks, which are pressed by mold parts, and breakage of the chip is avoided during molding. The plates are insulated by the sheets, so no dedicated insulating sheets for the heat sinks are needed after the device is completed.

摘要翻译： 半导体器件包括产生热的半导体芯片，一对彼此面对的散热片，以从芯片的两个表面，一对可压缩绝缘片和覆盖芯片的模具树脂，散热片， 并且片材使得片材从树脂的表面露出。 防止模制树脂覆盖被模具部件挤压的散热器的外表面，并且在模制期间避免了芯片的断裂。 这些板被片材绝缘，因此在器件完成后，不需要用于散热器的专用绝缘片。

公开(公告)号：US06917103B2

公开(公告)日：2005-07-12

申请号：US10326555

申请日：2002-12-23

申请人： Naohiko Hirano ,  Takanori Teshima ,  Yoshimi Nakase ,  Shoji Miura

发明人： Naohiko Hirano ,  Takanori Teshima ,  Yoshimi Nakase ,  Shoji Miura

IPC分类号： H01L23/28 ,  H01L23/29 ,  H01L23/433 ,  H01L23/48 ,  H01L23/495 ,  H01L23/34

CPC分类号： H01L24/33 ,  H01L23/4334 ,  H01L23/49562 ,  H01L24/37 ,  H01L24/40 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/40245 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A semiconductor device includes a semiconductor chip, a first heat sink, a second heat sink, and a mold resin. The first heat sink is electrically and thermally connected to a surface of the semiconductor chip for functioning as an electrode for the semiconductor chip and releasing the heat generated by the semiconductor chip. The second heat sink is electrically and thermally connected to another surface of the semiconductor chip for functioning as another electrode for the semiconductor chip and releasing the heat. The semiconductor chip and the first and second heat sinks are covered with the mold resin such that the heat sinks are exposed on a substantially flat surface of the mold resin.

摘要翻译： 半导体器件包括半导体芯片，第一散热器，第二散热器和模制树脂。 第一散热器电连接和热连接到半导体芯片的表面，用作半导体芯片的电极并释放由半导体芯片产生的热量。 第二散热器电连接和热连接到半导体芯片的另一个表面，用作半导体芯片的另一个电极并释放热量。 半导体芯片和第一和第二散热器被模制树脂覆盖，使得散热器暴露在模制树脂的基本平坦的表面上。

公开(公告)号：US20050077599A1

公开(公告)日：2005-04-14

申请号：US10959963

申请日：2004-10-08

申请人： Shoji Miura ,  Akihiro Niimi ,  Yoshimi Nakase ,  Takanori Teshima

发明人： Shoji Miura ,  Akihiro Niimi ,  Yoshimi Nakase ,  Takanori Teshima

IPC分类号： H01L23/52 ,  H01L21/3205 ,  H01L21/336 ,  H01L23/00 ,  H01L23/29 ,  H01L23/433 ,  H01L23/482 ,  H01L29/739 ,  H01L29/78 ,  H01L21/48 ,  H01L29/40

CPC分类号： H01L24/33 ,  H01L23/4334 ,  H01L23/4824 ,  H01L23/564 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A package type semiconductor device comprising: a semiconductor chip having a semiconductor part; a main electrode for connecting to a first region of the semiconductor part; a control wiring layer for connecting to a second region of the semiconductor part; a blocking member electrically isolated from the control wiring layer; a first metallic layer; a protection film disposed among the main electrode, the control wiring layer and the blocking member; and a metal block for connecting to the main electrode through the first metallic layer. The chip, the main electrode, the control wiring layer, the blocking member, and the metal block are packaged. The blocking member is disposed between the main electrode and the control wiring layer.

摘要翻译： 一种封装型半导体器件，包括：具有半导体部件的半导体芯片; 用于连接到半导体部件的第一区域的主电极; 用于连接到所述半导体部件的第二区域的控制布线层; 阻挡构件，与所述控制布线层电隔离; 第一金属层; 设置在主电极，控制布线层和阻挡构件之间的保护膜; 以及用于通过第一金属层连接到主电极的金属块。 封装芯片，主电极，控制布线层，阻挡构件和金属块。 阻挡构件设置在主电极和控制布线层之间。

公开(公告)号：US06693350B2

公开(公告)日：2004-02-17

申请号：US10321365

申请日：2002-12-18

申请人： Takanori Teshima ,  Yutaka Fukuda ,  Yoshimi Nakase ,  Kuniaki Mamitsu ,  Tomoatsu Makino

发明人： Takanori Teshima ,  Yutaka Fukuda ,  Yoshimi Nakase ,  Kuniaki Mamitsu ,  Tomoatsu Makino

IPC分类号： H01L2334

CPC分类号： H01L24/33 ,  H01L23/3135 ,  H01L23/4334 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes a first conductive member, a second conductive member, a semiconductor chip, which is located between the conductive members, a bonding member, which is located between the first conductive member and the semiconductor chip, another bonding member, which is located between the second conductive member and the semiconductor chip, a molding resin, which is located between the first and second conductive members to seal the semiconductor chip, and a bonding member anti-sticking means, which is located between the molding resin and a surface of one member selected from the group consisting of the semiconductor chip and the conductive members. The bonding member anti-sticking means prevents the bonding members from sticking to the surface in the manufacturing process. As a result, the otherwise insufficient connection due to the sticking between the molding resin and the surface is improved, and the semiconductor device becomes durable in electric performance.

摘要翻译： 半导体器件包括第一导电构件，第二导电构件，位于导电构件之间的半导体芯片，位于第一导电构件和半导体芯片之间的接合构件，位于 在第二导电构件和半导体芯片之间，位于第一导电构件和第二导电构件之间以密封半导体芯片的模制树脂以及位于模制树脂和表面之间的接合构件防粘装置 选自由半导体芯片和导电构件组成的组中的一个构件。 接合构件防粘装置在制造过程中防止接合构件粘附到表面。 结果，由于模塑树脂和表面之间的粘附而导致的不充分的连接得到改善，并且半导体器件在电气性能方面变得耐用。

公开(公告)号：US08963315B2

公开(公告)日：2015-02-24

申请号：US13019390

申请日：2011-02-02

申请人： Daisuke Fukuoka ,  Takanori Teshima ,  Kuniaki Mamitsu

发明人： Daisuke Fukuoka ,  Takanori Teshima ,  Kuniaki Mamitsu

IPC分类号： H01L23/02 ,  H01L23/48 ,  H01L23/52 ,  H01L23/12 ,  H01L23/053 ,  H01L23/10 ,  H01L23/34 ,  H01L29/40 ,  H01L23/28 ,  H01L21/56 ,  H01L23/00

CPC分类号： H01L21/56 ,  H01L23/48 ,  H01L24/96 ,  H01L2224/04026 ,  H01L2224/0405 ,  H01L2224/04105 ,  H01L2224/2518 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/73219 ,  H01L2224/73267 ,  H01L2224/73269 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15159 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/00

摘要： A semiconductor device includes a plate-shaped semiconductor element and an electrically insulating resin member. The semiconductor element has a front-surface electrode on its front surface and a back-surface electrode on its back surface. The resin member encapsulates the semiconductor element. The front-surface electrode is exposed to a front side of an outer surface of the resin member. The back-surface electrode is exposed to a back side of the outer surface of the resin member. The resin member has an extension portion that covers the entire side surface of the semiconductor element and extends from the side surface of the semiconductor element in a direction parallel to the front surface of the semiconductor element.

摘要翻译： 半导体器件包括板状半导体元件和电绝缘树脂构件。 半导体元件在其前表面具有前表面电极，在其后表面具有背表面电极。 树脂部件封装半导体元件。 前表面电极暴露于树脂构件的外表面的前侧。 背面电极暴露于树脂构件的外表面的背面。 树脂构件具有覆盖半导体元件的整个侧表面的延伸部分，并且在与半导体元件的前表面平行的方向上从半导体元件的侧表面延伸。

公开(公告)号：US08125781B2

公开(公告)日：2012-02-28

申请号：US11262764

申请日：2005-11-01

申请人： Kuniaki Mamitsu ,  Takanori Teshima

发明人： Kuniaki Mamitsu ,  Takanori Teshima

IPC分类号： H05K7/20

CPC分类号： H01L25/117 ,  H01L23/40 ,  H01L23/4012 ,  H01L23/473 ,  H01L25/115 ,  H01L2224/40137 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/09701 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/30107 ,  H05K7/20927 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device comprises at least a semiconductor module including a semiconductor chip, a heat sink thermally connected to the semiconductor chip and a seal member for covering and sealing the semiconductor chip and the heat sink in such a manner as to expose the heat radiation surface of the heat sink. The radiation surface is cooled by a refrigerant. An opening is formed in a part of the seal member as a refrigerant path through which the refrigerant flows.

摘要翻译： 半导体器件至少包括半导体模块，该半导体模块包括半导体芯片，与半导体芯片热连接的散热器和用于将半导体芯片和散热片覆盖和密封的密封构件，以暴露热辐射表面 散热器。 辐射表面由制冷剂冷却。 在密封构件的一部分上形成有制冷剂流过制冷剂路径的开口。

公开(公告)号：US20110186981A1

公开(公告)日：2011-08-04

申请号：US13019390

申请日：2011-02-02

申请人： Daisuke Fukuoka ,  Takanori Teshima ,  Kuniaki Mamitsu

发明人： Daisuke Fukuoka ,  Takanori Teshima ,  Kuniaki Mamitsu

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L21/56 ,  H01L23/48 ,  H01L24/96 ,  H01L2224/04026 ,  H01L2224/0405 ,  H01L2224/04105 ,  H01L2224/2518 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/73219 ,  H01L2224/73267 ,  H01L2224/73269 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15159 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/00

摘要： A semiconductor device includes a plate-shaped semiconductor element and an electrically insulating resin member. The semiconductor element has a front-surface electrode on its front surface and a back-surface electrode on its back surface. The resin member encapsulates the semiconductor element. The front-surface electrode is exposed to a front side of an outer surface of the resin member. The back-surface electrode is exposed to a back side of the outer surface of the resin member. The resin member has an extension portion that covers the entire side surface of the semiconductor element and extends from the side surface of the semiconductor element in a direction parallel to the front surface of the semiconductor element.

摘要翻译： 半导体器件包括板状半导体元件和电绝缘树脂构件。 半导体元件在其前表面具有前表面电极，在其后表面具有背表面电极。 树脂部件封装半导体元件。 前表面电极暴露于树脂构件的外表面的前侧。 背面电极暴露于树脂构件的外表面的背面。 树脂构件具有覆盖半导体元件的整个侧表面的延伸部分，并且在与半导体元件的前表面平行的方向上从半导体元件的侧表面延伸。

公开(公告)号：US07944045B2

公开(公告)日：2011-05-17

申请号：US12397640

申请日：2009-03-04

申请人： Chikage Noritake ,  Takanori Teshima ,  Kuniaki Mamitsu

发明人： Chikage Noritake ,  Takanori Teshima ,  Kuniaki Mamitsu

IPC分类号： H01L23/34 ,  H01L23/495 ,  H01L23/10 ,  H01L23/28

CPC分类号： H01L23/473 ,  H01L23/051 ,  H01L23/4334 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor module and a method of manufacturing the same are disclosed including a semiconductor element having an electrode, a heat radiation plate placed in thermal contact with a main surface of the semiconductor element and electrically connected to the electrode thereof, an insulation body directly formed on an outside surface of the heat radiation plate, a metallic body directly formed on an outside surface of the insulation body and having a thickness lower than that of the insulation body, and a mold resin unitarily molding the heat radiation plate, the semiconductor element and the insulation body. The insulation body is covered with the metallic body and the mold resin and the metallic body has an outside surface exposed to an outside of the mold resin.

摘要翻译： 公开了一种半导体模块及其制造方法，其包括具有电极的半导体元件，与半导体元件的主表面热接触并与其电极电连接的散热板，绝缘体直接形成在 散热板的外表面，直接形成在绝缘体的外表面上并且具有比绝缘体低的厚度的金属体，以及模制树脂，将散热板，半导体元件和 绝缘体。 绝缘体被金属体和模制树脂覆盖，并且金属体具有暴露于模制树脂外部的外表面。