Semiconductor light-emitting device
    23.
    发明授权
    Semiconductor light-emitting device 有权
    半导体发光装置

    公开(公告)号:US08455905B2

    公开(公告)日:2013-06-04

    申请号:US13274759

    申请日:2011-10-17

    IPC分类号: H01L33/00

    摘要: Provided is a light-emitting device including: a nitride semiconductor light-emitting element (402) which radiates optically polarized light; and a light emission control layer (404) which covers the light emission surface of the nitride semiconductor light-emitting element (402) and which contains a resin and non-fluorescent particles dispersed in the resin, in which the light emission control layer (404) contains the non-fluorescent particles at a proportion of 0.01 vol % or more and 10 vol % or less, and the non-fluorescent particles have a diameter of 30 nm or more and 150 nm or less.

    摘要翻译: 本发明提供一种发光装置,其包括:辐射光学偏振光的氮化物半导体发光元件(402) 和覆盖所述氮化物半导体发光元件(402)的发光面的发光控制层(404),所述发光控制层包含分散在所述树脂中的树脂和非荧光粒子,所述发光控制层(404) )含有0.01vol%以上且10vol%以下的非荧光性粒子,非荧光粒子的直径为30nm以上且150nm以下。

    SEMICONDUCTOR LIGHT EMITTING ELEMENT
    24.
    发明申请
    SEMICONDUCTOR LIGHT EMITTING ELEMENT 有权
    半导体发光元件

    公开(公告)号:US20130126902A1

    公开(公告)日:2013-05-23

    申请号:US13813792

    申请日:2011-08-05

    IPC分类号: H01L33/32

    摘要: A semiconductor light-emitting element according to the present invention includes: an n-type nitride semiconductor layer 21; a p-type nitride semiconductor layer 23; an active layer region 22 which includes an m plane nitride semiconductor layer and which is interposed between the n-type nitride semiconductor layer and the p-type nitride semiconductor layer; an n-type electrode 30 which is electrically connected to the n-type nitride semiconductor layer; a p-type electrode 40 which is electrically connected to the p-type nitride semiconductor layer; a light-emitting face, through which polarized light that has been produced in the active layer region is extracted out of this element; and a striped structure 50 which is provided for the light-emitting face and which has a plurality of projections that run substantially parallel to the a-axis direction of the m plane nitride semiconductor layer.

    摘要翻译: 根据本发明的半导体发光元件包括:n型氮化物半导体层21; p型氮化物半导体层23; 包括m面氮化物半导体层并且介于n型氮化物半导体层和p型氮化物半导体层之间的有源层区域22; 与n型氮化物半导体层电连接的n型电极30; 与p型氮化物半导体层电连接的p型电极40; 从该元件中提取出在有源层区域中产生的偏振光的发光面; 以及条形结构50,其被设置用于发光面,并且具有大致平行于m面氮化物半导体层的a轴方向延伸的多个突起。

    Nitride-based semiconductor device having electrode on m-plane
    25.
    发明授权
    Nitride-based semiconductor device having electrode on m-plane 有权
    在m面上具有电极的氮化物半导体器件

    公开(公告)号:US08304802B2

    公开(公告)日:2012-11-06

    申请号:US13167064

    申请日:2011-06-23

    IPC分类号: H01L33/00

    摘要: A nitride-based semiconductor light-emitting device 100 includes: a GaN substrate 10 with an m-plane surface 12; a semiconductor multilayer structure 20 provided on the m-plane surface 12 of the GaN substrate 10; and an electrode 30 provided on the semiconductor multilayer structure 20. The electrode 30 includes a Zn layer 32 and an Ag layer 34 provided on the Zn layer 32. The Zn layer 32 is in contact with a surface of a p-type semiconductor region of the semiconductor multilayer structure 20.

    摘要翻译: 氮化物系半导体发光装置100具备:具有m面面12的GaN衬底10; 设置在GaN衬底10的m面表面12上的半导体多层结构20; 以及设置在半导体多层结构体20上的电极30.电极30包括Zn层32和设置在Zn层32上的Ag层34.Zn层32与p型半导体区域的表面接触 半导体多层结构20。

    GALLIUM NITRIDE-BASED COMPOUND SEMICONDUCTOR LIGHT-EMITTING DIODE
    26.
    发明申请
    GALLIUM NITRIDE-BASED COMPOUND SEMICONDUCTOR LIGHT-EMITTING DIODE 审中-公开
    基于氮化镓的化合物半导体发光二极管

    公开(公告)号:US20120085986A1

    公开(公告)日:2012-04-12

    申请号:US13321923

    申请日:2010-06-09

    IPC分类号: H01L33/04

    摘要: The light-emitting diode element of this invention includes: an n-type GaN substrate (7), of which the principal surface (7a) is an m plane; and a multilayer structure on the principal surface (7a) of the substrate (7), which includes an n-type semiconductor layer (2), an active layer (3) on a first region (2a) of the upper surface of the n-type semiconductor layer (2), a p-type semiconductor layer (4), an anode electrode layer (5), and a cathode electrode layer (6) on a second region (2b) of the upper surface of the n-type semiconductor layer (2). These layers (2, 3, 4) have all been grown epitaxially through an m-plane growth. The n-type dopant concentration in the substrate (7) and n-type semiconductor layer (2) is 1×1018 cm−3 or less. When viewed perpendicularly to the principal surface (7a), a gap of 4 μm or less is left between the anode and cathode electrode layers (5, 6) and the anode electrode layer (5) is arranged at a distance of 45 μm or less from an edge of the cathode electrode layer (6) that faces the anode electrode layer (5).

    摘要翻译: 本发明的发光二极管元件包括:主面(7a)为m面的n型GaN衬底(7); 以及在基板(7)的主表面(7a)上的多层结构,其包括n型半导体层(2),在n的上表面的第一区域(2a)上的有源层(3) 型半导体层(2),p型半导体层(4),阳极电极层(5)以及在n型上表面的第二区域(2b)上的阴极电极层 半导体层(2)。 这些层(2,3,4)全部通过m平面生长而外延生长。 基板(7)和n型半导体层(2)中的n型掺杂剂浓度为1×1018cm -3以下。 当垂直于主表面(7a)观察时,在阳极和阴极电极层(5,6)之间留下4μm或更小的间隙,并且阳极电极层(5)被布置在45μm或更小的距离处 从所述阴极电极层(6)的与所述阳极电极层(5)相对的边缘。

    METHOD FOR MANUFACTURING GALLIUM NITRIDE COMPOUND SEMICONDUCTOR, AND SEMICONDUCTOR LIGHT EMITTING ELEMENT
    28.
    发明申请
    METHOD FOR MANUFACTURING GALLIUM NITRIDE COMPOUND SEMICONDUCTOR, AND SEMICONDUCTOR LIGHT EMITTING ELEMENT 审中-公开
    制造氮化镓化合物半导体的方法和半导体发光元件

    公开(公告)号:US20110297956A1

    公开(公告)日:2011-12-08

    申请号:US13201938

    申请日:2009-10-21

    IPC分类号: H01L33/02

    摘要: The present invention is a method of manufacturing a gallium nitride-based compound semiconductor, including growing an m-plane InGaN layer whose emission peak wavelength is not less than 500 nm by metalorganic chemical vapor deposition. Firstly, step (A) of heating a substrate in a reactor is performed. Then, step (B) of supplying into the reactor a gas which contains an In source gas, a Ga source gas, and a N source gas and growing an m-plane InGaN layer of an InxGa1-xN crystal on the substrate at a growth temperature from 700° C. to 775° C. is performed. In step (B), the growth rate of the m-plane InGaN layer is set in a range from 4.5 nm/min to 10 nm/min.

    摘要翻译: 本发明是一种制造氮化镓系化合物半导体的方法,包括通过金属有机化学气相沉积生长发光峰值波长不小于500nm的m面InGaN层。 首先,进行在反应器中加热基板的工序(A)。 然后,向反应器供给包含In源气体,Ga源气体和N源气体的气体的步骤(B),并在生长中在衬底上生长In x Ga 1-x N晶体的m面InGaN层 进行从700℃到775℃的温度。 在步骤(B)中,将m面InGaN层的生长速度设定在4.5nm / min〜10nm / min的范围内。