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    WAFER CARRIER HANDLING METHODS, SYSTEMS AND APPARATUS FOR SEMICONDUCTOR WAFER FABRICATION
    23.
    发明申请
    WAFER CARRIER HANDLING METHODS, SYSTEMS AND APPARATUS FOR SEMICONDUCTOR WAFER FABRICATION 审中-公开
    用于半导体波导制造的波载波处理方法，系统和装置

    公开(公告)号：US20100042253A1

    公开(公告)日：2010-02-18

    申请号：US12603217

    申请日：2009-10-21

    申请人： Robert Z. Bachrach

    发明人： Robert Z. Bachrach

    IPC分类号： H01L21/677 ,  G06F7/00

    CPC分类号： H01L21/67727 ,  H01L21/6773 ,  H01L21/67733 ,  H01L21/67736 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775 ,  H01L21/67781 ,  Y10S414/139 ,  Y10S414/14

    摘要： A system and method is provided for transporting wafers in wafer carriers to a fabrication tool. The system provides an incoming carrier location adapted to receive a wafer lot carrier containing a wafer lot, a divider mechanism adapted to divide and place the wafers into a plurality of sublot carriers wherein each sublot carrier includes a fewer number of wafers than the wafer lot carrier, and a transfer mechanism adapted to transfer the plurality of sublot carriers. Inventive wafer handling methods, which divide a wafer lot into wafer sublots and distributes the sublots among tools configured to perform processes on the wafers is provided. Apparatus adapted to divide the wafer lot into sublots are also provided, as are other aspects.

    摘要翻译： 提供了一种用于将晶片载体中的晶片传送到制造工具的系统和方法。 该系统提供适于接收包含晶片块的晶片批号载体的输入载波位置，适于将晶片划分和放置到多个子载波中的分频器机构，其中每个子载波包括比晶片批号载体少的晶片数 以及适于传送多个子载体的传送机构。 提供了本发明的晶片处理方法，其将晶片批划分成晶片子区并在配置成在晶片上执行处理的工具之间分配子区。 与其他方面一样，还提供了适于将晶片批划成子区的装置。

    BATCH EQUIPMENT ROBOTS AND METHODS WITHIN EQUIPMENT WORK-PIECE TRANSFER FOR PHOTOVOLTAIC FACTORY
    24.
    发明申请
    BATCH EQUIPMENT ROBOTS AND METHODS WITHIN EQUIPMENT WORK-PIECE TRANSFER FOR PHOTOVOLTAIC FACTORY 审中-公开
    装配设备的工艺和方法在设备工作中转让光伏工厂

    公开(公告)号：US20080279658A1

    公开(公告)日：2008-11-13

    申请号：US11747372

    申请日：2007-05-11

    申请人： Robert Z. Bachrach ,  Avi Tepman ,  Alexander S. Polyak

    发明人： Robert Z. Bachrach ,  Avi Tepman ,  Alexander S. Polyak

    IPC分类号： B65H1/00

    CPC分类号： B25J15/0052 ,  B25J15/0226 ,  H01L21/67236 ,  H01L21/67276 ,  H01L21/67715 ,  H01L21/67721 ,  H01L21/67733 ,  H01L21/67736 ,  H01L21/67742 ,  H01L21/67748

    摘要： The present invention generally comprises equipment for an automated high volume batch work-piece manufacturing factory comprising work-piece handling and work-piece processing in a high productivity factory architecture capable of producing 1,000 or more work-piece an hour. The work-pieces may be presented to the equipment from a stacked supply to a parallel array. Additionally, the work-pieces may be transferred between manufacturing architectures by an array to array batch transfer. The work-pieces may be transferred within the manufacturing architecture in a parallel to parallel batch transfer operation. The robotic operations may be between robotic devices, between robotic devices and processing equipment, and within processing equipment.

    摘要翻译： 本发明通常包括用于自动化大批量批量工件制造工厂的设备，其包括能够每小时生产1,000个或更多个工件的高生产率工厂结构中的工件处理和工件加工。 工件可以从堆叠的供应提供给设备到并行阵列。 另外，工件可以通过阵列在制造架构之间转移到阵列批量传输。 工件可以在并行批量传输操作的同时在制造架构内转移。 机器人操作可以在机器人设备之间，机器人设备和处理设备之间以及处理设备内。