公开(公告)号：US20060091490A1

公开(公告)日：2006-05-04

申请号：US11077478

申请日：2005-03-10

Applicant: Hung-Wei Chen ,  Wen-Chin Lee ,  Chih-Hsin Ko ,  Min-Hwa Chi ,  Chung-Hu Ke

Inventor： Hung-Wei Chen ,  Wen-Chin Lee ,  Chih-Hsin Ko ,  Min-Hwa Chi ,  Chung-Hu Ke

IPC: H01L31/105

CPC classification number: H01L29/7391 ,  H01L29/868

Abstract: A gated p-i-n diode and a method for forming the same. The gated p-i-n diode comprises: a semiconductor substrate; a gate dielectric over the semiconductor substrate; a gate electrode on the gate dielectric; a source gate spacer and a drain gate spacer along respective edges of the gate dielectric and the gate electrode; a source doped with a first type of dopant substantially under the source gate spacer wherein the source has a horizontal distance from a first edge of the gate electrode; a drain doped with the opposite type of the source substantially under the drain spacer and substantially aligned horizontally with a second edge of the gate electrode; a source silicide adjacent the source; and a drain silicide adjacent the drain.

Abstract translation: 门式p-i-n二极管及其形成方法。 门控p-i-n二极管包括：半导体衬底; 半导体衬底上的栅极电介质; 栅电极上的栅电极; 源栅极间隔物和漏极栅极间隔物，沿着栅极电介质和栅电极的相应边缘; 源极掺杂有基本上在源栅极间隔物下方的第一类型掺杂剂的源，其中源极与栅电极的第一边缘具有水平距离; 基本上在所述漏极间隔物的下方掺杂有相反类型的源极的漏极，并且与所述栅极电极的第二边缘基本对准; 邻近源极的源硅化物; 和漏极附近的漏极硅化物。

公开(公告)号：US20060054968A1

公开(公告)日：2006-03-16

申请号：US10939923

申请日：2004-09-13

Applicant: Wen-Chin Lee

Inventor： Wen-Chin Lee

IPC: H01L21/8238 ,  H01L29/76 ,  H01L29/94 ,  H01L31/062 ,  H01L31/113 ,  H01L31/119

CPC classification number: H01L29/7842 ,  H01L21/84 ,  H01L27/1203 ,  H01L29/66636 ,  H01L29/66772 ,  H01L29/78639

Abstract: Methods of manufacturing microelectronic device including, in one embodiment, forming a gate electrode over a substrate having an insulating layer interposing a bulk semiconductor portion and a thin semiconductor layer, and removing at least a portion of the thin semiconductor and insulating layers, thereby defining a pedestal comprising a portion of the thin semiconductor and insulating layers. Source/drain stressors are then formed contacting the source/drain extensions on opposing sides of the pedestal and substantially spanning a height no less than the pedestal.

Abstract translation: 制造微电子器件的方法包括在一个实施方案中，在具有插入体半导体部分和薄半导体层的绝缘层的衬底上形成栅电极，以及去除薄半导体和绝缘层的至少一部分，由此限定 基座包括薄半导体和绝缘层的一部分。 然后在基座的相对侧上形成与源极/漏极延伸部接触的源极/漏极应力，并且基本跨越不小于基座的高度。

公开(公告)号：US20050263828A1

公开(公告)日：2005-12-01

申请号：US11194084

申请日：2005-07-29

Applicant: Chung-Hu Ke ,  Wen-Chin Lee ,  Yee-Chia Yeo ,  Chih-Hsin Ko ,  Chenming Hu

Inventor： Chung-Hu Ke ,  Wen-Chin Lee ,  Yee-Chia Yeo ,  Chih-Hsin Ko ,  Chenming Hu

IPC: H01L21/336 ,  H01L21/76 ,  H01L21/762 ,  H01L21/8238 ,  H01L27/092 ,  H01L29/10 ,  H01L29/76 ,  H01L29/78 ,  H01L29/80

CPC classification number: H01L29/7846 ,  H01L21/823807 ,  H01L21/823878 ,  H01L29/1033 ,  H01L29/78 ,  H01L29/7842

Abstract: A high performance semiconductor device and the method for making same is disclosed with an improved drive current. The semiconductor device has source and drain regions built on an active region, a length of the device being different than a width thereof. One or more isolation regions are fabricated surrounding the active region, the isolation regions are then filled with an predetermined isolation material whose volume shrinkage exceeds 0.5% after an anneal process. A gate electrode is formed over the active region, and one or more dielectric spacers are made next to the gate electrode. Then, a contact etch stopper layer is put over the device, wherein the isolation regions, spacers and contact etch layer contribute to modulating a net strain imposed on the active region so as to improve the drive current.

公开(公告)号：US20050158923A1

公开(公告)日：2005-07-21

申请号：US11081104

申请日：2005-03-15

Applicant: Chun-Chieh Lin ,  Wen-Chin Lee ,  Yee-Chia Yeo

Inventor： Chun-Chieh Lin ,  Wen-Chin Lee ,  Yee-Chia Yeo

IPC: H01L21/336 ,  H01L21/84 ,  H01L27/01 ,  H01L29/45 ,  H01L29/68 ,  H01L29/786

CPC classification number: H01L29/66772 ,  H01L29/458 ,  H01L29/66636 ,  H01L29/78618 ,  H01L29/78654

Abstract: A semiconductor device (100), including a dielectric pedestal (220) located above and integral to a substrate (110) and having first sidewalls (230), a channel region (210) located above the dielectric pedestal (220) and having second sidewalls (240), and source and drain regions (410) opposing the channel region (210) and each substantially spanning one of the second sidewalls (240). An integrated circuit (800) incorporating the semiconductor device (100) is also disclosed, as well as a method of manufacturing the semiconductor device (100).

Abstract translation: 一种半导体器件（100），包括位于衬底（110）上方并与衬底（110）成一体并具有第一侧壁（230）的电介质基座（220），位于电介质基座（220）上方的通道区域（210） （240），以及与沟道区（210）相对并且每个基本跨越第二侧壁（240）中的一个的源极和漏极区（410）。 还公开了结合半导体器件（100）的集成电路（800），以及制造半导体器件（100）的方法。

公开(公告)号：US20050156274A1

公开(公告)日：2005-07-21

申请号：US11081919

申请日：2005-03-16

Applicant: Yee-Chia Yeo ,  Chih-Hsin Ko ,  Wen-Chin Lee ,  Chenming Hu

Inventor： Yee-Chia Yeo ,  Chih-Hsin Ko ,  Wen-Chin Lee ,  Chenming Hu

IPC: H01L21/762 ,  H01L21/8238 ,  H01L27/12 ,  H01L29/00

CPC classification number: H01L29/7842 ,  H01L21/76229 ,  H01L21/76237 ,  H01L21/76283 ,  H01L21/823807 ,  H01L21/823878 ,  H01L27/1203

Abstract: A semiconductor device includes a region of semiconductor material with first and second isolation trenches formed therein. The first isolation trench is lined with a first material having a low oxygen diffusion rate and is filled with an insulating material. The second isolation trench is not lined with the first material but is filled with an insulating material. A first transistor is formed adjacent the first isolation region and a second transistor formed adjacent the second isolation region.

Abstract translation: 半导体器件包括其中形成有第一和第二隔离沟槽的半导体材料区域。 第一隔离槽衬有具有低氧扩散速率的第一材料并填充绝缘材料。 第二隔离槽不是衬有第一材料，而是用绝缘材料填充。 形成在第一隔离区域附近的第一晶体管和邻近第二隔离区域形成的第二晶体管。

公开(公告)号：US20050127400A1

公开(公告)日：2005-06-16

申请号：US10745831

申请日：2003-12-24

Applicant: Yee-Chia Yeo ,  Wen-Chin Lee ,  Chih-Hsin Ko ,  Chung-Hu Ke ,  Chun-Chieh Lin ,  Chenming Hu

Inventor： Yee-Chia Yeo ,  Wen-Chin Lee ,  Chih-Hsin Ko ,  Chung-Hu Ke ,  Chun-Chieh Lin ,  Chenming Hu

IPC: H01L27/06 ,  H01L29/02 ,  H01L29/165 ,  H01L29/8605 ,  H01L31/109

CPC classification number: H01L27/0629 ,  H01L29/165 ,  H01L29/8605

Abstract: A heterostructure resistor comprises a doped region formed in a portion of a semiconductor substrate, the substrate comprising a first semiconductor material having a first natural lattice constant. The doped region comprises a semiconductor layer overlying the semiconductor substrate. The semiconductor layer comprises a second semiconductor material with a second natural lattice constant.

Abstract translation: 异质结构电阻器包括形成在半导体衬底的一部分中的掺杂区域，该衬底包括具有第一自然晶格常数的第一半导体材料。 掺杂区域包括覆盖半导体衬底的半导体层。 半导体层包括具有第二自然晶格常数的第二半导体材料。

公开(公告)号：US06867433B2

公开(公告)日：2005-03-15

申请号：US10426566

申请日：2003-04-30

Applicant: Yee-Chia Yeo ,  How-Yu Chen ,  Chien-Chao Huang ,  Wen-Chin Lee ,  Fu-Liang Yang ,  Chenming Hu

Inventor： Yee-Chia Yeo ,  How-Yu Chen ,  Chien-Chao Huang ,  Wen-Chin Lee ,  Fu-Liang Yang ,  Chenming Hu

IPC: H01L21/336 ,  H01L21/84 ,  H01L27/12 ,  H01L29/786

CPC classification number: H01L29/785 ,  H01L21/84 ,  H01L27/1203 ,  H01L29/66795 ,  H01L29/7842 ,  H01L29/7843 ,  H01L29/7854

Abstract: In accordance with a preferred embodiment of the present invention, a silicon-on-insulator (SOI) chip includes a silicon layer of a predetermined thickness overlying an insulator layer. A multiple-gate fully-depleted SOI MOSFET including a strained channel region is formed on a first portion of the silicon layer. A planar SOI MOSFET including a strained channel region formed on another portion of the silicon layer. For example, the planar SOI MOSFET can be a planar fully-depleted SOI (FD-SOI) MOSFET or the planar SOI MOSFET can be a planar partially-depleted SOI (PD-SOI) MOSFET.

Abstract translation: 根据本发明的优选实施例，绝缘体上硅（SOI）芯片包括覆盖在绝缘体层上的预定厚度的硅层。 在硅层的第一部分上形成包括应变沟道区的多栅极全耗尽SOI MOSFET。 包括形成在硅层的另一部分上的应变沟道区的平面SOI MOSFET。 例如，平面SOI MOSFET可以是平面全耗尽SOI（FD-SOI）MOSFET，或者平面SOI MOSFET可以是平面部分耗尽的SOI（PD-SOI）MOSFET。

公开(公告)号：US20050045969A1

公开(公告)日：2005-03-03

申请号：US10880992

申请日：2004-06-30

Applicant: Wen-Chin Lee ,  Chung-Hu Ge ,  Chenming Hu

Inventor： Wen-Chin Lee ,  Chung-Hu Ge ,  Chenming Hu

IPC: H01L21/336 ,  H01L23/31 ,  H01L23/485 ,  H01L23/62 ,  H01L27/088 ,  H01L27/105 ,  H01L29/161 ,  H01L29/165 ,  H01L29/47 ,  H01L29/78

CPC classification number: H01L23/3192 ,  H01L23/485 ,  H01L29/161 ,  H01L29/165 ,  H01L29/47 ,  H01L29/665 ,  H01L29/66628 ,  H01L29/7834 ,  H01L2924/0002 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/00

Abstract: A preferred embodiment of the present invention comprises a dielectric/metal/2nd energy bandgap (Eg) semiconductor/1st Eg substrate structure. In order to reduce the contact resistance, a semiconductor with a lower energy bandgap (2nd Eg) is put in contact with metal. The energy bandgap of the 2nd Eg semiconductor is lower than the energy bandgap of the 1st Eg semiconductor and preferably lower than 1.1 eV. In addition, a layer of dielectric may be deposited on the metal. The dielectric layer has built-in stress to compensate for the stress in the metal, 2nd Eg semiconductor and 1st Eg substrate. A process of making the structure is also disclosed.

Abstract translation: 本发明的优选实施例包括介电/金属/第二能带隙（Eg）半导体/第一基板结构。 为了降低接触电阻，将具有较低能带隙（2Egg）的半导体与金属接触。 第二半导体元件的能量带隙低于第一半导体器件的能带隙，优选低于1.1eV。 此外，可以在金属上沉积介电层。 电介质层具有内置的应力，以补偿金属，第二半导体和第一基板中的应力。 还公开了制造该结构的过程。

公开(公告)号：US20050045965A1

公开(公告)日：2005-03-03

申请号：US10831021

申请日：2004-04-23

Applicant: Chun-Chieh Lin ,  Wen-Chin Lee ,  Yee-Chia Yeo ,  Chuan-Yi Lin ,  Chenming Hu

Inventor： Chun-Chieh Lin ,  Wen-Chin Lee ,  Yee-Chia Yeo ,  Chuan-Yi Lin ,  Chenming Hu

IPC: H01L21/28 ,  H01L21/3205 ,  H01L21/336 ,  H01L21/768 ,  H01L21/8238 ,  H01L27/092 ,  H01L29/43 ,  H01L29/45 ,  H01L29/49 ,  H01L29/78 ,  H01L29/786

CPC classification number: H01L21/28052 ,  H01L21/823835 ,  H01L21/823842 ,  H01L29/458 ,  H01L29/4908 ,  H01L29/665 ,  H01L29/66795 ,  H01L29/785 ,  H01L29/78648

Abstract: Provided is a semiconductor device and a method for its fabrication. The device includes a semiconductor substrate, a first silicide in a first region of the substrate, and a second silicide in a second region of the substrate. The first silicide may differ from the second silicide. The first silicide and the second silicide may be an alloy silicide.

Abstract translation: 提供一种半导体器件及其制造方法。 该器件包括半导体衬底，衬底的第一区域中的第一硅化物和衬底的第二区域中的第二硅化物。 第一硅化物可能与第二硅化物不同。 第一硅化物和第二硅化物可以是合金硅化物。

公开(公告)号：US20050035345A1

公开(公告)日：2005-02-17

申请号：US10832020

申请日：2004-04-26

Applicant: Chun-Chieh Lin ,  Wen-Chin Lee ,  Chenming Hu ,  Shang-Chih Chen ,  Chih-Hao Wang ,  Fu-Liang Yang ,  Yee-Chia Yeo

Inventor： Chun-Chieh Lin ,  Wen-Chin Lee ,  Chenming Hu ,  Shang-Chih Chen ,  Chih-Hao Wang ,  Fu-Liang Yang ,  Yee-Chia Yeo

IPC: H01L21/28 ,  H01L21/8234 ,  H01L29/51 ,  H01L29/06

CPC classification number: H01L21/28185 ,  H01L21/28194 ,  H01L21/28202 ,  H01L21/823462 ,  H01L29/513 ,  H01L29/517 ,  H01L29/518

Abstract: An integrated circuit includes a substrate, a first transistor, and a second transistor. The first transistor has a first gate dielectric portion located between a first gate electrode and the substrate. The first gate dielectric portion includes a first high-permittivity dielectric material and/or a second high-permittivity dielectric material. The first gate dielectric portion has a first equivalent silicon oxide thickness. The second transistor has a second gate dielectric portion located between a second gate electrode and the substrate. The second gate dielectric portion includes the first high-permittivity dielectric material and/or the second high-permittivity dielectric material. The second gate dielectric portion has a second equivalent silicon oxide thickness. The second equivalent silicon oxide thickness may be different than the first equivalent silicon oxide thickness.

Abstract translation: 集成电路包括衬底，第一晶体管和第二晶体管。 第一晶体管具有位于第一栅电极和衬底之间的第一栅电介质部分。 第一栅介质部分包括第一高介电常数电介质材料和/或第二高介电常数介电材料。 第一栅介质部分具有第一等效氧化硅厚度。 第二晶体管具有位于第二栅电极和衬底之间的第二栅介质部分。 第二栅介质部分包括第一高介电常数电介质材料和/或第二高介电常数介电材料。 第二栅介质部分具有第二等效氧化硅厚度。 第二等效氧化硅厚度可以不同于第一等效氧化硅厚度。