公开(公告)号：US20070158805A1

公开(公告)日：2007-07-12

申请号：US11062507

申请日：2005-02-22

申请人： Gann Keith ,  William Boyd

发明人： Gann Keith ,  William Boyd

IPC分类号： H01L23/02

CPC分类号： H01L21/6835 ,  H01L24/97 ,  H01L25/105 ,  H01L2221/68354 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/97 ,  H01L2225/1029 ,  H01L2225/1064 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

摘要： A three dimensional electronic module is disclosed. Conventional TSOP packages are modified to expose internal lead frame interconnects, thinned and stacked on a reroute substrate. The reroute substrate comprises conductive circuitry for the input and output of electrical signals from one or more TSOPs in the stack to a ball grid array pattern. The exposed internal lead frames are interconnected and routed on one or more side buses on the module to the reroute substrate for connection to external electronic circuitry. Alternatively, internal wire bonds or ball bonds may be exposed in the TSOP packages and routed to the side bus for interconnection to create a BGA scale module. One or more neolayers may also be bonded to a reroute substrate to create a BGA scale module.

摘要翻译： 公开了一种三维电子模块。 修改常规TSOP封装以暴露内部引线框架互连，变薄并堆叠在重新路由基板上。 重路由衬底包括用于输入和输出从堆叠中的一个或多个TSOP到球栅阵列图案的电信号的导电电路。 暴露的内部引线框架在模块上的一个或多个侧总线上互连并布线到重新路由基板上以连接到外部电子电路。 或者，内部引线键合或球形接合可以暴露在TSOP封装中并被路由到侧面总线用于互连以创建BGA刻度模块。 一个或多个新涂层也可以结合到重新路由基底以产生BGA标度模块。

公开(公告)号：US20060265522A1

公开(公告)日：2006-11-23

申请号：US11135540

申请日：2005-05-23

申请人： William Boyd ,  John Hufferd ,  Agustin Mena ,  Renato Recio ,  Madeline Vega

发明人： William Boyd ,  John Hufferd ,  Agustin Mena ,  Renato Recio ,  Madeline Vega

IPC分类号： G06F3/00

CPC分类号： G06F3/0637 ,  G06F3/0605 ,  G06F3/0613 ,  G06F3/067 ,  G06F21/85

摘要： The present invention provides a system, method, and computer program product that enables application instances to pass block mode storage requests directly to a physical I/O adapter without run-time involvement from the local operating system or hypervisor. In one aspect of the present invention, a mechanism is provided for handling user space query and modification operations for querying and modifying attributes of allocations of linear block addresses of a physical storage device. For modification, it is determined if there are sufficient available resources for the modification of the allocation. In addition, it is determined if there are any I/O transactions active on the allocation before performing the modification. Modification of the attributes of the allocation may be performed only if there are sufficient available resources and only if there are no active I/O transactions on the allocation being modified.

摘要翻译： 本发明提供了一种系统，方法和计算机程序产品，其使得应用程序实例能够将块模式存储请求直接传递到物理I / O适配器，而无需本地操作系统或管理程序的运行时间。 在本发明的一个方面，提供了一种用于处理用户空间查询和修改操作以用于查询和修改物理存储设备的线性块地址的分配的属性的机制。 为了修改，确定是否有足够的可用资源来修改分配。 此外，在执行修改之前，确定在分配上是否有任何I / O事务处于活动状态。 仅当有足够的可用资源且只有在修改分配上没有活动的I / O事务时，才能执行分配属性的修改。

公开(公告)号：US20060265521A1

公开(公告)日：2006-11-23

申请号：US11135539

申请日：2005-05-23

申请人： William Boyd ,  John Hufferd ,  Agustin Mena ,  Renato Recio ,  Madeline Vega

发明人： William Boyd ,  John Hufferd ,  Agustin Mena ,  Renato Recio ,  Madeline Vega

IPC分类号： G06F3/00

CPC分类号： G06F3/0644 ,  G06F3/0605 ,  G06F3/0631 ,  G06F3/067 ,  G06F12/0866 ,  G06F12/145 ,  Y10S707/99953 ,  Y10S707/99955

摘要： The present invention provides a system, method, and computer program product that enables application instances to pass block mode storage requests directly to a physical I/O adapter without run-time involvement from the local operating system or hypervisor. In one aspect of the present invention, a mechanism is provided for handling user space creation and deletion operations for creating and deleting allocations of linear block addresses of a physical storage device to application instances. For creation, it is determined if there are sufficient available resources for creation of the allocation. For deletion, it is determined if there are any I/O transactions active on the allocation before performing the deletion. Allocation may be performed only if there are sufficient available resources and deletion may be performed only if there are no active I/O transactions on the allocation being deleted.

摘要翻译： 本发明提供一种系统，方法和计算机程序产品，其使得应用程序实例能够将块模式存储请求直接传递到物理I / O适配器，而无需本地操作系统或管理程序的运行时间。 在本发明的一个方面，提供了一种用于处理用户空间创建和删除操作的机制，用于创建和删除对应用实例的物理存储设备的线性块地址的分配。 为了创建，确定是否有足够的可用资源来创建分配。 对于删除，在执行删除之前确定在分配上是否有任何活动的I / O事务。 只有在有足够的可用资源时才能执行分配，并且只有在删除分配中没有活动的I / O事务时才可以执行删除。

公开(公告)号：US20060259644A1

公开(公告)日：2006-11-16

申请号：US11487265

申请日：2006-07-14

申请人： William Boyd ,  Jean Calvignac ,  Chih-Jen Chang ,  Douglas Joseph ,  Renato Recio

发明人： William Boyd ,  Jean Calvignac ,  Chih-Jen Chang ,  Douglas Joseph ,  Renato Recio

IPC分类号： G06F15/16

CPC分类号： H04L69/16 ,  H04L69/12 ,  H04L69/161

摘要： A mechanism for offloading the management of receive queues in a split (e.g. split socket, split iSCSI, split DAFS) stack environment, including efficient queue flow control and TCP/IP retransmission support. An Upper Layer Protocol (ULP) creates receive work queues and completion queues that are utilized by an Internet Protocol Suite Offload Engine (IPSOE) and the ULP to transfer information and carry out send operations. As consumers initiate receive operations, receive work queue entries (RWQEs) are created by the ULP and written to the receive work queue (RWQ). The ISPOE is notified of a new entry to the RWQ and it subsequently reads this entry that contains pointers to the data that is to be received. After the data is received, the IPSOE creates a completion queue entry (CQE) that is written into the completion queue (CQ). After the CQE is written, the ULP subsequently processes the entry and removes it from the CQE, freeing up a space in both the RWQ and CQ. The number of entries available in the RWQ are monitored by the ULP so that it does not overwrite any valid entries. Likewise, the IPSOE monitors the number of entries available in the CQ, so as not overwrite the CQ.

摘要翻译： 一种用于卸载分裂（例如，分裂式插座，拆分式iSCSI，拆分式DAFS）堆栈环境中接收队列管理的机制，包括有效的队列流控制和TCP / IP重传支持。 上层协议（ULP）创建互联网协议套件卸载引擎（IPSOE）和ULP利用的接收工作队列和完成队列，以传输信息并执行发送操作。 当消费者开始接收操作时，接收工作队列条目（RWQE）由ULP创建并写入接收工作队列（RWQ）。 通知ISPOE对RWQ的新条目，并随后读取包含要接收的数据的指针的该条目。 接收到数据后，IPSOE创建写入完成队列（CQ）的完成队列条目（CQE）。 在编写CQE之后，ULP随后处理该条目并将其从CQE中移除，释放了RWQ和CQ两者中的空间。 RWQ中可用的条目数由ULP监视，以便它不会覆盖任何有效的条目。 同样，IPSOE监视CQ中可用条目的数量，以免覆盖CQ。

公开(公告)号：US20060226521A1

公开(公告)日：2006-10-12

申请号：US11426166

申请日：2006-06-23

申请人： Anthony Coyle ,  William Boyd ,  Chris Haga ,  Leland Swanson

发明人： Anthony Coyle ,  William Boyd ,  Chris Haga ,  Leland Swanson

IPC分类号： H01L23/495

CPC分类号： H01L23/4334 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device comprising a metallic leadframe (103) with a first surface (103a) and a second surface (103b). The leadframe includes a chip pad (104) and a plurality of segments (107); the chip pad is held by a plurality of straps (105), wherein each strap has a groove (106). A chip (101) is mounted on the chip pad and electrically connected to the segments. A heat spreader (110) is disposed on the first surface of the leadframe; the heat spreader has its central portion (110a) spaced above the chip connections (108), and also has positioning members (110b) extending outwardly from the edges of the central portion so that they rest in the grooves of the straps. Encapsulation material surrounds the chip, the electrical connections, and the spreader positioning members, and fills the space between the spreader and the chip, while leaving the second leadframe surface and the central spreader portion exposed.

摘要翻译： 一种半导体器件，包括具有第一表面（103a）和第二表面（103b）的金属引线框架（103）。 引线框架包括芯片焊盘（104）和多个段（107）; 芯片垫由多个带（105）保持，其中每个带具有凹槽（106）。 芯片（101）安装在芯片焊盘上并电连接到段上。 散热器（110）设置在引线框架的第一表面上; 散热器具有在芯片连接件（108）上方间隔开的中心部分（110a），并且还具有从中心部分的边缘向外延伸的定位构件（110b），使得它们搁置在带的凹槽中。 封装材料围绕芯片，电连接和扩展器定位构件，并且填充扩展器和芯片之间的空间，同时使第二引线框表面和中心扩展器部分露出。

公开(公告)号：US20060192273A1

公开(公告)日：2006-08-31

申请号：US11066875

申请日：2005-02-25

申请人： Bernhard Lange ,  William Boyd

发明人： Bernhard Lange ,  William Boyd

IPC分类号： H01L23/48

CPC分类号： H05K3/308 ,  H01L23/49555 ,  H01L24/49 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/14 ,  H05K2201/10689 ,  H05K2201/10787 ,  H05K2201/10871 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit (IC) package 100 comprises an IC 102 and leads 104 coupled to the IC. Each lead has a first end 106 configured to be coupled to the integrated circuit and a second end 108 configured to pass through one of a plurality of mounting holes 110 extending through a mounting board 112. The leads comprise at least one positioning lead 114 comprising a stop 118 being a continuous part of the positioning lead and having a lateral dimension 120 greater than a diameter 122 of a first hole 124 of the plurality of mounting holes. The leads further comprise at least one non-positioning lead 116 having a continuous uniformly shaped body 130 with a lateral dimension 132 less than a diameter 134 of a second hole 136 of the plurality of mounting holes. The stop limits an extension of the non-positioning lead through the second hole.

摘要翻译： 集成电路（IC）封装100包括耦合到IC的IC 102和引线104。 每个引线具有被配置为耦合到集成电路的第一端106和被配置为穿过延伸穿过安装板112的多个安装孔110中的一个的第二端108。 引线包括至少一个定位引线114，定位引线114包括止动件118，该止动件118是定位引线的连续部分，并且具有大于多个安装孔中的第一孔124的直径122的横向尺寸120。 引线还包括至少一个非定位引线116，其具有连续均匀成形的主体130，其横向尺寸132小于多个安装孔中的第二孔136的直径134。 停止限制非定位导线通过第二个孔的延伸。

公开(公告)号：US20060051457A1

公开(公告)日：2006-03-09

申请号：US10936436

申请日：2004-09-07

申请人： James Bougoulas ,  William Boyd ,  Stanley Kopecky ,  Barbara Admans ,  Marco Garcia ,  Shai Altman ,  Nikolas Harte

发明人： James Bougoulas ,  William Boyd ,  Stanley Kopecky ,  Barbara Admans ,  Marco Garcia ,  Shai Altman ,  Nikolas Harte

IPC分类号： A23G4/18

CPC分类号： B65D83/0894 ,  B65D83/0472 ,  B65D85/60 ,  B65D2209/00 ,  Y10S206/80

摘要： The present invention provides a chewing gum package made from an outer package containing one or more pieces of chewing gum. The package includes at least one disposal sheet to wrap chewing gum cuds for proper disposal. The presence of the disposal sheet serves as a reminder to the consumer to dispose of chewing gum cuds appropriately.

公开(公告)号：US20050230842A1

公开(公告)日：2005-10-20

申请号：US10827836

申请日：2004-04-20

申请人： Leland Swanson ,  William Boyd

发明人： Leland Swanson ,  William Boyd

IPC分类号： H01L23/48 ,  H01L23/495 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16

CPC分类号： H01L25/0655 ,  H01L23/49575 ,  H01L23/49861 ,  H01L25/162 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/15153 ,  H01L2924/15192

摘要： A method comprising coupling a substrate interconnect to a substrate pad, attaching at least two flip chips to said substrate interconnect to electrically connect together said chips, and coupling at least one lead to each of the chips.

摘要翻译： 一种方法，包括将衬底互连件耦合到衬底焊盘，将至少两个倒装芯片附接到所述衬底互连以将所述芯片电连接在一起，以及将至少一个引线耦合到每个芯片。

公开(公告)号：US20050151268A1

公开(公告)日：2005-07-14

申请号：US10826713

申请日：2004-04-16

申请人： William Boyd ,  Chris Haga ,  Anthony Coyle ,  Leland Swanson ,  Quang Mai

发明人： William Boyd ,  Chris Haga ,  Anthony Coyle ,  Leland Swanson ,  Quang Mai

IPC分类号： H01L23/31 ,  H01L23/495 ,  H01L21/48 ,  H01L29/40

CPC分类号： H01L23/3114 ,  H01L23/4951 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/94 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05681 ,  H01L2224/05684 ,  H01L2224/13019 ,  H01L2224/13082 ,  H01L2224/13099 ,  H01L2224/16245 ,  H01L2224/73253 ,  H01L2224/81193 ,  H01L2224/94 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00014

摘要： A method for assembling a whole semiconductor wafer (101) with a plurality of device units (120) having metal contact pads. Each contact pad has a patterned barrier metal layer and a metal stud (103, preferably copper or nickel) with an outer surface suitable to form metallurgical bonds without melting. A leadframe suitable for the whole wafer is provided, which has a plurality of segments groups (102), each group suitable for one device unit; each segment has first (102a) and second ends (102b) covered by solderable metal. A predetermined amount of solder paste (104) is placed on each of the first segment ends. The leadframe is then aligned with the wafer so that each of the paste-covered segment ends is aligned with the corresponding metal stud of the respective device unit. The leadframe is connected to the wafer and the whole wafer is encapsulated (105) so that the device units and the first segment ends are covered, while the second segment ends remain exposed. The encapsulated wafer is separated (110) into individual device units (120).

摘要翻译： 一种用于将整个半导体晶片（101）与具有金属接触焊盘的多个器件单元（120）组装的方法。 每个接触垫具有图案化的阻挡金属层和金属螺柱（103，优选铜或镍），其外表面适于形成冶金结合而不熔化。 提供了适用于整个晶片的引线框架，其具有多个段组（102），每个组适合于一个设备单元; 每个段具有由可焊接金属覆盖的第一（102a）和第二端（102b）。 将预定量的焊膏（104）放置在每个第一段末端上。 然后将引线框架与晶片对准，使得每个糊状覆盖的段端部与相应的器件单元的相应的金属钉对准。 引线框架连接到晶片，并且整个晶片被封装（105），使得器件单元和第一段端部被覆盖，而第二段端部保持暴露。 将封装的晶片分离成单独的器件单元（120）。

公开(公告)号：US20050079037A1

公开(公告)日：2005-04-14

申请号：US10963320

申请日：2004-10-12

申请人： William Boyd

发明人： William Boyd

IPC分类号： B60P1/44 ,  B60P9/00

CPC分类号： B60P1/4485 ,  B60P1/4421

摘要： A lifting and carrying apparatus for vehicles such as all-terrain vehicles, which apparatus includes a typically wheeled lift frame hingedly attached to the bottom ends of a pair of parallel, downwardly-extending frame legs connected at the opposite ends by a spacer bar. A fixed frame mount slidably receives the frame legs for up and down lift frame travel and the frame mount is mounted on a receiver bracket fitted with a winch and a roller positioned forwardly of the winch. The receiver bracket is fixed to the frame of an all-terrain vehicle to facilitate raising and lowering the lift frame and the frame legs in the frame mount using a lift line or strap attached to the lift frame and extending over the roller to the winch, and operating the winch. The lift frame can also be folded adjacent to the frame legs by either repositioning the lift strap to the extremity of the lift frame and operating the winch to close the lift frame on the frame legs or pivoting the lift frame by hand into the folded configuration against the frame legs. The roller and the winch can be interchanged in the receiver bracket to facilitate low profile storage of the folded lifting and carrying apparatus when it is not in use.

摘要翻译： 一种用于诸如全地形车辆的车辆的提升和携带装置，该装置包括通常由轮式提升框架铰接地连接到一对平行的向下延伸的框架腿部的底端，所述框架腿的相对端通过间隔杆连接。 固定框架安装件可滑动地容纳框架腿用于上下升降机架行程，并且框架安装件安装在装有绞盘和位于绞盘前方的滚筒的接收器支架上。 接收器支架固定在全地形车辆的框架上，以便利用附接到升降机框架上的升降线或吊带将升降机架和框架支脚升高和降低，并将其延伸到绞盘上， 并操作绞车。 升降机架也可以通过将提升带重新定位到提升架的末端并操作绞盘来关闭框架腿上的提升框架或将手提架架转动成折叠构型来抵抗 框架腿。 滚筒和绞盘可以在接收器支架中互换，以便在折叠的提升和传送装置不使用时便于低调存放。