公开(公告)号：US5361491A

公开(公告)日：1994-11-08

申请号：US67231

申请日：1993-05-26

申请人： Chikafumi Oomachi ,  Yasuyuki Tanaka

发明人： Chikafumi Oomachi ,  Yasuyuki Tanaka

IPC分类号： H05K3/40 ,  H01L21/48 ,  H01L21/60 ,  H01L21/607 ,  H01L23/495 ,  H01L23/498 ,  H05K1/00 ,  H05K1/11 ,  H05K1/18 ,  H05K3/42 ,  H01K3/10

CPC分类号： H01L24/16 ,  H01L21/486 ,  H01L23/49572 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/86 ,  H05K1/113 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/0393 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/10674 ,  H05K3/423 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165

摘要： An IC-mounting flexible circuit board and the process of producing the same in which the process comprises the steps of forming bump protrusions passing through a flexible circuit board to be electrically conductive with a circuit wiring pattern in such a way that the bump protrusions are allowed to protrude from the back surface of the flexible circuit board, and arranging to have the surface of each bump protrusion coated with junction metal in accordance with the structure of the protrusion, so that a bare IC chip is simply bonded to the bump protrusions of the flexible circuit board by means of heat fusion or ultrasonic bonding.An excimer laser means is preferably used for boring small holes in an insulating base to form bump protrusions, i.e., IC pad junction protrusions on the flexible circuit board. Such an IC pad junction protrusion is formed by a plating means such as soldering or the filling of a conductive member. Moreover, a reflow process is employed to form the preferably semicircular protruding portion of the IC pad junction protrusion.

摘要翻译： 一种IC安装的柔性电路板及其制造方法，其中该方法包括以下步骤：通过柔性电路板形成凸起突起，以使电路布线图形导电，使凸起突起允许 从柔性电路板的背面突出，并且根据突起的结构，将每个凸块突起的表面布置有接合金属，使得裸IC芯片简单地结合到凸起突起 柔性电路板通过热熔或超声波接合。 准分子激光装置优选用于对绝缘基底中的小孔进行钻孔以形成凸起突起，即柔性电路板上的IC焊盘接合突起。 这种IC焊盘接合突起由诸如焊接或导电部件的填充的电镀装置形成。 此外，采用回流工艺来形成IC焊盘接合突起的优选半圆形突出部分。

公开(公告)号：US5260518A

公开(公告)日：1993-11-09

申请号：US778178

申请日：1991-12-13

申请人： Yasuyuki Tanaka ,  Chikafumi Oomachi

发明人： Yasuyuki Tanaka ,  Chikafumi Oomachi

IPC分类号： H01L21/48 ,  H01L21/60 ,  H01L23/498 ,  H01L23/538 ,  H05K1/00 ,  H05K1/11 ,  H05K3/34 ,  H05K3/40

CPC分类号： H01L24/81 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/5384 ,  H01L24/16 ,  H05K1/113 ,  H05K3/3457 ,  H05K3/4007 ,  H01L2224/0401 ,  H01L2224/05558 ,  H01L2224/05572 ,  H01L2224/0603 ,  H01L2224/10175 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/16225 ,  H01L2224/81801 ,  H01L23/3192 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/0393 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/09436 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09845 ,  H05K2201/10734 ,  H05K2203/043 ,  H05K3/4038 ,  H05K3/4069 ,  Y10T29/49126 ,  Y10T29/49165

摘要： A multilayer printed circuit board on which integrated circuit chips may be directly mounted has holes at predetermined locations, electrical connections between a chip and conductive layers of the circuit board being accomplished via the holes. The electrical connections are in the form of bump members which protrude outwardly from the circuit board. The bump members cooperate with an electrically conductive plating layer or filler that is in intimate contact with a conductive layer(s) exposed in the formation of each hole.

摘要翻译： PCT No.PCT / JP91 / 00523 Sec。 371日期1991年12月13日 102（e）日期1991年12月13日PCT 1991年4月19日PCT PCT。 公开号WO91 / 16726 日期为1991年10月31日。其上可以直接安装集成电路芯片的多层印刷电路板在预定位置具有孔，电路板的芯片和导电层之间的电连接通过孔完成。 电连接是从电路板向外突出的凸起构件的形式。 凸起构件与导电镀层或填料配合，该导电镀层或填料与在每个孔的形成中暴露的导电层紧密接触。

公开(公告)号：US5157355A

公开(公告)日：1992-10-20

申请号：US815907

申请日：1991-12-31

申请人： Akihiro Shikakura ,  Shinichi Yamashita ,  Makoto Gohda ,  Yasuyuki Tanaka

发明人： Akihiro Shikakura ,  Shinichi Yamashita ,  Makoto Gohda ,  Yasuyuki Tanaka

IPC分类号： H03L7/087 ,  H03L7/14

CPC分类号： H03L7/087 ,  H03L7/14

摘要： A phase-locked loop device for producing an output clock synchronized in phase with an input clock, wherein in addition to a loop responsive to the phase difference between an output clock of a controlled oscillator and the input clock for controlling the controlled oscillator, there is provided another loop for controlling the controlled oscillator in accordance with the frequency difference between the output clock of the controlled oscillator and a reference clock.

摘要翻译： 一种用于产生与输入时钟相位同步的输出时钟的锁相环装置，其中除了响应于受控振荡器的输出时钟和用于控制受控振荡器的输入时钟之间的相位差的一个环路之外，还存在 提供了另一个环路，用于根据受控振荡器的输出时钟和参考时钟之间的频率差来控制受控振荡器。

公开(公告)号：US4964616A

公开(公告)日：1990-10-23

申请号：US381357

申请日：1989-07-18

申请人： Yasuyuki Tanaka ,  Kiyofumi Takeuchi ,  Yuji Tamura

发明人： Yasuyuki Tanaka ,  Kiyofumi Takeuchi ,  Yuji Tamura

IPC分类号： C07C41/00 ,  C07C43/188 ,  C07C67/00 ,  C09K19/30 ,  C09K19/46

CPC分类号： C09K19/3098 ,  C07C43/188 ,  C07C2101/16

摘要： A tricyclic cyclohexenyl cyclohexane derivative is disclosed. This compound is capable of lowering the .DELTA.n value of mixed liquid crystals, which have been obtained by adding said compound to nematic liquid crystals widely used as matrix liquid crystals, and elevating the N-I point thereof. Thus it is highly useful in the production of liquid crystal display cells.

公开(公告)号：US4726910A

公开(公告)日：1988-02-23

申请号：US42524

申请日：1987-04-27

申请人： Haruyoshi Takatsu ,  Makoto Sasaki ,  Yasuyuki Tanaka ,  Hisato Sato

发明人： Haruyoshi Takatsu ,  Makoto Sasaki ,  Yasuyuki Tanaka ,  Hisato Sato

IPC分类号： C07C13/28 ,  C07C15/54 ,  C07C25/24 ,  C07C43/166 ,  C07C43/168 ,  C07C45/46 ,  C07D319/06 ,  C09K19/18 ,  C09K19/30 ,  C09K19/34 ,  C09K19/54 ,  C09K19/06

CPC分类号： C07C255/00 ,  C07C13/28 ,  C07C15/54 ,  C07C25/24 ,  C07C43/166 ,  C07C43/168 ,  C07C45/46 ,  C07D319/06 ,  C09K19/18 ,  C09K19/3059 ,  C09K19/3402 ,  C09K2019/3422

摘要： A liquid crystalline compound of the general formula ##STR1## wherein ##STR2## represents ##STR3## R and R', independently from each other, represent a linear alkyl group having 1 to 10 carbon atoms, an alkoxymethylene group whose alkoxy moiety has 1 to 10 carbon atoms, a cyano group or a halogen atom, and n and m, independently from each other, represent 0 or 1.

摘要翻译： 通式（I）的液晶化合物，其中“IMAGE”表示“R”和R“彼此独立地表示具有1至10个碳原子的直链烷基，烷氧基亚甲基的烷氧基部分 具有1至10个碳原子，氰基或卤素原子，n和m彼此独立地表示0或1。

公开(公告)号：US4705870A

公开(公告)日：1987-11-10

申请号：US14257

申请日：1987-02-11

申请人： Haruyoshi Takatsu ,  Makoto Sasaki ,  Yasuyuki Tanaka ,  Hisato Sato

发明人： Haruyoshi Takatsu ,  Makoto Sasaki ,  Yasuyuki Tanaka ,  Hisato Sato

IPC分类号： C07C13/28 ,  C07C15/54 ,  C07C25/24 ,  C07C43/166 ,  C07C43/168 ,  C07C45/46 ,  C07D319/06 ,  C09K19/18 ,  C09K19/30 ,  C09K19/34 ,  C09K19/06 ,  C09K19/54

CPC分类号： C07C255/00 ,  C07C13/28 ,  C07C15/54 ,  C07C25/24 ,  C07C43/166 ,  C07C43/168 ,  C07C45/46 ,  C07D319/06 ,  C09K19/18 ,  C09K19/3059 ,  C09K19/3402 ,  C09K2019/3422

摘要： A liquid crystalline compound of the general formula ##STR1## wherein ##STR2## R and R', independently from each other, represent a linear alkyl group having 1 to 10 carbon atoms, an alkoxymethylene group whose alkoxy moiety has 1 to 10 carbon atoms, a cyano group or a halogen atom, and n and m, independently from each other, represent 0 or 1.

摘要翻译： 通式（I）的液晶化合物，其中R 1和R 2彼此独立地表示具有1至10个碳原子的直链烷基，烷氧基亚甲基的烷氧基亚甲基 部分具有1〜10个碳原子，氰基或卤素原子，n和m彼此独立地表示0或1。

公开(公告)号：US4303032A

公开(公告)日：1981-12-01

申请号：US136489

申请日：1980-04-03

申请人： Yuzo Takahashi ,  Yoshinari Maeda ,  Yasuyuki Tanaka ,  Kastumi Nagai ,  Shiro Oyama

发明人： Yuzo Takahashi ,  Yoshinari Maeda ,  Yasuyuki Tanaka ,  Kastumi Nagai ,  Shiro Oyama

IPC分类号： B29C65/00 ,  B21D51/26 ,  B29C53/00 ,  B29C65/20 ,  B29C65/48 ,  B29C65/78

CPC分类号： B21D51/2676 ,  B29C65/2061 ,  B29C66/4322 ,  B29C66/49 ,  B29C66/8322 ,  Y10T156/1013 ,  Y10T156/1038

摘要： In a can body forming process and equipment therefor, the cooling action to be added to the joining portions at the opposite ends of a can body blank is effected only at the lower part of the can forming cylinder so that said joining portions can be joined substantially without undergoing internal strain and with a higher forming accuracy.

摘要翻译： 在罐体成型工艺及其设备中，仅在罐体成型筒体的下部仅对罐主体坯料的相对端部的接合部添加冷却作用，使得所述接合部分能够基本上接合 没有经历内部应变和更高的成形精度。

公开(公告)号：US4117188A

公开(公告)日：1978-09-26

申请号：US781520

申请日：1977-03-25

申请人： Yuzo Takahashi ,  Yoshimi Wazima ,  Akira Nakada ,  Yasuyuki Tanaka ,  Katsumi Nagai ,  Nobuo Takahashi ,  Hiroshi Matsuda ,  Eizi Aizawa ,  Shiro Oyama

发明人： Yuzo Takahashi ,  Yoshimi Wazima ,  Akira Nakada ,  Yasuyuki Tanaka ,  Katsumi Nagai ,  Nobuo Takahashi ,  Hiroshi Matsuda ,  Eizi Aizawa ,  Shiro Oyama

IPC分类号： B21D51/26 ,  B21D51/28 ,  B21D51/32 ,  B65D7/36 ,  B65D7/44

CPC分类号： B65D7/34 ,  B21D51/2676 ,  B21D51/28 ,  Y10T428/1355 ,  Y10T428/1359 ,  Y10T428/24256 ,  Y10T428/24264 ,  Y10T428/24744

摘要： A lapped seam can having a high safety characteristic used as containers of soft drinks or beer wherein the cut-burrs at the end of the inner end portion of the can blank are completely removed so that micro-leak passages apt to occur in the lapped seam can are shut off, thereby permitting a long term storage of the can content without deterioration by preventing metal from being dissolved out from said inner end portion.

公开(公告)号：US09537152B2

公开(公告)日：2017-01-03

申请号：US14233980

申请日：2012-07-18

申请人： Yasuyuki Tanaka ,  Masami Yanagida ,  Kohei Ogawa ,  Satoshi Oku ,  Masahiro Kojima ,  Takashi Kikuchi ,  Takashi Ito

发明人： Yasuyuki Tanaka ,  Masami Yanagida ,  Kohei Ogawa ,  Satoshi Oku ,  Masahiro Kojima ,  Takashi Kikuchi ,  Takashi Ito

IPC分类号： H01M4/66 ,  H01M10/0525

CPC分类号： H01M4/667 ,  H01M4/666 ,  H01M4/668 ,  H01M10/0525 ,  Y02E60/122 ,  Y02T10/7011

摘要： A collector for bipolar lithium ion secondary batteries comprises a first conductive layer that is obtained by adding a conductive filler to a base that contains an imide group-containing resin, and a second conductive layer that has a function of blocking lithium ions. The second conductive layer comprises a blocking resin layer that is obtained by adding a conductive filler to a base that contains a resin which contains no imide group, and a metal layer. This collector for bipolar lithium ion secondary batteries is used in such a manner that the first conductive layer is on the positive electrode active material layer side with respect to the second conductive layer.

摘要翻译： 双极性锂离子二次电池的集电体包括通过在含有含酰亚胺基的树脂的基体中添加导电性填料而获得的第一导电层和具有阻断锂离子功能的第二导电层。 第二导电层包括通过将导电填料添加到含有不含酰亚胺基的树脂的基体和金属层而获得的阻挡树脂层。 双极性锂离子二次电池用集电体的使用方式是使第一导电层相对于第二导电层位于正极活性物质层一侧。

公开(公告)号：US09065692B2

公开(公告)日：2015-06-23

申请号：US13723355

申请日：2012-12-21

申请人： Yasuyuki Tanaka ,  Mitsuru Kanda

发明人： Yasuyuki Tanaka ,  Mitsuru Kanda

IPC分类号： G06F15/16 ,  H04L29/02 ,  H04W12/06 ,  H04L29/06 ,  H04W12/04

CPC分类号： H04L29/02 ,  H04L63/062 ,  H04L63/0892 ,  H04W12/04 ,  H04W12/06

摘要： According to one embodiment, an information notification apparatus includes a table and a notifier. The table is configured to store information about root nodes and information related to the nodes. The notifier is configured to generate, when a communication node is a root node, new information for that root node. The notifier is further configured to read out, when the communication node is not a root node, the information from the table. The notifier is further configured to notify the communication node of the new information or the information read out from the table.

摘要翻译： 根据一个实施例，信息通知装置包括表格和通知器。 该表被配置为存储关于根节点和与节点相关的信息的信息。 通知器被配置为当通信节点是根节点时，生成该根节点的新信息。 通知器还被配置为当通信节点不是根节点时，从表中读出信息。 通知器还被配置为向通信节点通知新信息或从表中读出的信息。