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21.发明授权公开(公告)号：US08514520B2
公开(公告)日：2013-08-20
申请号：US13088852
申请日：2011-04-18
CPC分类号： G11B5/1278 , G11B5/3146 , G11B5/3163 , G11B5/3967 , Y10T29/49032
摘要： A thin-film magnetic head is constructed such that a main magnetic pole layer, a write shield layer, a gap layer, and a thin-film coil are laminated on a substrate. The write shield layer has an opposing shield part opposing the main magnetic pole layer and a front shield part. The front shield part is connected to the opposing shield part without straddling the thin-film coil. Besides, the front shield part has a shield front end face disposed in the medium-opposing surface and a shield upper end face formed distanced from the medium-opposing surface. Further, the front shield part has a shield connecting part. The shield front end face is connected to the shield upper end face by the shield connecting part.
摘要翻译： 薄膜磁头被构造为使得主磁极层，写入屏蔽层，间隙层和薄膜线圈层叠在基板上。 写屏蔽层具有与主磁极层相对的相对的屏蔽部分和前屏蔽部分。 前屏蔽部分连接到相对的屏蔽部分而不跨越薄膜线圈。 此外，前屏蔽部分具有设置在介质相对表面中的屏蔽前端面和远离介质相对表面形成的屏蔽上端面。 此外，前屏蔽部具有屏蔽连接部。 屏蔽前端面通过屏蔽连接部与屏蔽上端面连接。
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22.发明授权Magnetic head for perpendicular magnetic recording having a main pole, a shield and a coil core part setback away from the medium facing surface a specified distance 有权用于垂直磁记录的磁头，其具有主极，屏蔽和线圈芯部分，从介质面向表面远离指定距离公开(公告)号：US08441755B2
公开(公告)日：2013-05-14
申请号：US13208980
申请日：2011-08-12
申请人： Yoshitaka Sasaki , Hiroyuki Ito , Kazuki Sato , Atsushi Iijima
发明人： Yoshitaka Sasaki , Hiroyuki Ito , Kazuki Sato , Atsushi Iijima
IPC分类号： G11B5/17
CPC分类号： G11B5/17 , G11B5/1278 , G11B5/3116 , G11B5/3123 , G11B5/3146 , G11B5/315 , Y10T29/49021
摘要： A magnetic head includes: a main pole; a coil; a first shield having an end face that is located in a medium facing surface at a position forward of an end face of the main pole along a direction of travel of a recording medium; and a first return path section disposed forward of the main pole along the direction of travel of the recording medium. The first return path section connects part of the main pole away from the medium facing surface to the first shield so that a first space is defined. The coil includes a first portion having a planar spiral shape and wound around a core part of the first return path section. The first portion includes first and second coil elements that each extend through the first space. No part of the coil other than the first and second coil elements exists in the first space.
摘要翻译： 磁头包括：主极; 线圈 第一屏蔽，其具有端面，所述端面沿着记录介质的行进方向位于所述主极端面的前端的位置处于介质相对表面; 以及第一返回路径部分，其沿着记录介质的行进方向设置在主极的前方。 第一返回路径部分将主极的远离介质面的表面连接到第一屏蔽，从而限定第一空间。 线圈包括具有平面螺旋形状并缠绕在第一返回路径部分的芯部分上的第一部分。 第一部分包括每个延伸穿过第一空间的第一和第二线圈元件。 除了第一和第二线圈元件之外，第一空间中不存在线圈的一部分。
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公开(公告)号：US08426979B2
公开(公告)日：2013-04-23
申请号：US13184971
申请日：2011-07-18
IPC分类号： H01L23/52
CPC分类号： H01L23/5389 , H01L21/6835 , H01L22/22 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/24 , H01L24/25 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/81 , H01L24/82 , H01L24/83 , H01L24/92 , H01L24/94 , H01L24/95 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2221/68327 , H01L2221/6834 , H01L2224/02311 , H01L2224/02313 , H01L2224/02321 , H01L2224/0235 , H01L2224/02371 , H01L2224/02373 , H01L2224/02379 , H01L2224/0239 , H01L2224/024 , H01L2224/0345 , H01L2224/0346 , H01L2224/0401 , H01L2224/04026 , H01L2224/05008 , H01L2224/05013 , H01L2224/05147 , H01L2224/05644 , H01L2224/1146 , H01L2224/13024 , H01L2224/13144 , H01L2224/16148 , H01L2224/24011 , H01L2224/2405 , H01L2224/24146 , H01L2224/245 , H01L2224/2512 , H01L2224/25171 , H01L2224/25175 , H01L2224/25177 , H01L2224/2746 , H01L2224/29024 , H01L2224/29144 , H01L2224/32145 , H01L2224/32148 , H01L2224/75101 , H01L2224/8112 , H01L2224/81191 , H01L2224/81203 , H01L2224/81815 , H01L2224/82101 , H01L2224/82106 , H01L2224/83005 , H01L2224/8313 , H01L2224/83191 , H01L2224/83203 , H01L2224/83815 , H01L2224/8385 , H01L2224/83986 , H01L2224/92 , H01L2224/92244 , H01L2224/94 , H01L2224/95 , H01L2225/06541 , H01L2225/06551 , H01L2225/06565 , H01L2225/1058 , H01L2225/1064 , H01L2924/07802 , H01L2924/0105 , H01L2224/82 , H01L2924/00014 , H01L2224/83 , H01L2224/11 , H01L2224/0231 , H01L2224/27 , H01L21/78 , H01L2224/81 , H01L2924/00
摘要： A composite layered chip package includes a plurality of subpackages stacked on each other. Each subpackage includes a main body and wiring. The main body includes a main part including a plurality of layer portions, and further includes first terminals and second terminals that are disposed on top and bottom surfaces of the main part, respectively. The wiring is electrically connected to the first and second terminals. The number of the plurality of layer portions included in the main part is the same for all the plurality of subpackages, and the plurality of layer portions in every subpackage include at least one first-type layer portion. In each of at least two of the subpackages, the plurality of layer portions further include at least one second-type layer portion. The first-type layer portion includes a semiconductor chip connected to the wiring, whereas the second-type layer portion includes a semiconductor chip not connected to the wiring.
摘要翻译： 复合分层芯片封装包括彼此堆叠的多个子封装。 每个子包包括主体和接线。 主体包括包括多个层部分的主要部分，并且还包括分别设置在主要部分的顶表面和底表面上的第一端子和第二端子。 布线电连接到第一和第二端子。 包括在主要部分中的多个层部分的数量对于所有多个子包是相同的，并且每个子包中的多个层部分包括至少一个第一类型层部分。 在至少两个子包中的每一个中，多个层部分还包括至少一个第二类型层部分。 第一型层部分包括连接到布线的半导体芯片，而第二型层部分包括未连接到布线的半导体芯片。
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24.发明授权Laminated semiconductor wafer, laminated chip package and method of manufacturing the same 有权层叠半导体晶片，层压芯片封装及其制造方法公开(公告)号：US08426948B2
公开(公告)日：2013-04-23
申请号：US12848595
申请日：2010-08-02
申请人： Yoshitaka Sasaki , Hiroyuki Ito , Atsushi Iijima
发明人： Yoshitaka Sasaki , Hiroyuki Ito , Atsushi Iijima
IPC分类号： H01L23/544
CPC分类号： H01L23/552 , H01L21/6835 , H01L23/481 , H01L24/05 , H01L24/32 , H01L24/83 , H01L24/92 , H01L24/96 , H01L25/0657 , H01L25/50 , H01L2221/68327 , H01L2224/04042 , H01L2224/04105 , H01L2224/05551 , H01L2224/05555 , H01L2224/0557 , H01L2224/05571 , H01L2224/05644 , H01L2224/05647 , H01L2224/32145 , H01L2224/48091 , H01L2224/48463 , H01L2224/83005 , H01L2224/8385 , H01L2224/9202 , H01L2224/96 , H01L2225/06541 , H01L2225/06565 , H01L2924/01029 , H01L2924/07802 , H01L2924/10253 , H01L2924/14 , H01L2924/1434 , H01L2924/3025 , H01L2224/03 , H01L2924/00014 , H01L2924/00
摘要： In a laminated semiconductor substrate, a plurality of semiconductor substrates are laminated. Each of the semiconductor substrate has a plurality of scribe-groove parts formed along scribe lines. Further, each of the semiconductor substrate has a plurality of device regions insulated from each other and has a semiconductor device formed therein. Further, an uppermost substrate and a lowermost substrate have electromagnetic shielding layer formed in regions other than the scribe-groove parts using a ferromagnetic body. Further, in the laminated semiconductor substrate, a through hole which penetrates the plurality of semiconductor substrates laminated in a laminated direction is formed in the scribe-groove part, and the laminated semiconductor substrate has a through electrode penetrating the plurality of semiconductor substrates through the through hole.
摘要翻译： 在层叠半导体衬底中层叠多个半导体衬底。 每个半导体衬底具有沿着划线形成的多个划线槽部分。 此外，每个半导体衬底具有彼此绝缘的多个器件区域，并且其中形成有半导体器件。 此外，最上面的基板和最下面的基板在使用铁磁体的划线槽部以外的区域中形成有电磁屏蔽层。 此外，在层叠半导体基板中，在划线槽部形成有贯穿层叠方向的多个半导体基板的贯通孔，并且层叠半导体基板具有穿过多个半导体基板的通孔， 孔。
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25.发明授权Magnetic head for perpendicular magnetic recording having a return path section 有权具有返回路径部分的垂直磁记录用磁头公开(公告)号：US08416528B1
公开(公告)日：2013-04-09
申请号：US13463298
申请日：2012-05-03
申请人： Yoshitaka Sasaki , Hiroyuki Ito , Shigeki Tanemura , Kazuki Sato , Yukinori Ikegawa , Atsushi Iijima , Tatsuya Shimizu
发明人： Yoshitaka Sasaki , Hiroyuki Ito , Shigeki Tanemura , Kazuki Sato , Yukinori Ikegawa , Atsushi Iijima , Tatsuya Shimizu
IPC分类号： G11B5/127
CPC分类号： G11B5/1278 , G11B5/3116 , G11B5/3146 , G11B5/315 , G11B5/3163 , Y10T29/49048
摘要： A magnetic head includes a main pole and a return path section located above a top surface of a substrate. The main pole has an end face located in a medium facing surface. The return path section is located on the front side in the direction of travel of a recording medium relative to the main pole and is farther from the top surface of the substrate than is the main pole. The return path section has: a front end face located on the front side of the main pole in the medium facing surface; and an inclined surface located on the front side and connected to the front end face. The inclined surface is not exposed in the medium facing surface. An angle greater than 90° is formed between the front end face and the inclined surface.
摘要翻译： 磁头包括位于基板的顶表面上方的主极和返回路径部分。 主极具有位于面向介质的表面中的端面。 返回路径部分位于记录介质相对于主极的行进方向的前侧，并且比主极更远离基板的顶表面。 返回路径部分具有：位于介质面对表面中的主极的前侧上的前端面; 以及位于前侧并且连接到前端面的倾斜表面。 倾斜表面不会暴露在面向介质的表面上。 在前端面和倾斜面之间形成大于90°的角度。
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26.发明授权公开(公告)号：US08395972B2
公开(公告)日：2013-03-12
申请号：US13279935
申请日：2011-10-24
申请人： Yoshitaka Sasaki , Hiroyuki Ito , Atsushi Iijima
发明人： Yoshitaka Sasaki , Hiroyuki Ito , Atsushi Iijima
IPC分类号： G11B11/00
CPC分类号： G11B5/3163 , B82Y20/00 , G02B6/1226 , G11B5/105 , G11B5/314 , G11B5/6088 , G11B2005/0021 , Y10T29/49021 , Y10T29/49041 , Y10T29/49043 , Y10T29/49044 , Y10T29/49046 , Y10T29/49052
摘要： A thermally assisted magnetic head is formed by performing a head forming process, a mounting part forming process and a light source mounting process in that order. In the head forming process, a planned area is secured on a light source placing surface of a slider substrate, then a magnetic head part is formed on a head area other than the planned area and a spacer for securing a mounting space for the laser diode is formed on the planned area. In the mounting part forming process, a light source mounting part is formed by removing the spacer. In the light source mounting process, a laser diode is mounted on the light source mounting part formed by the mounting part forming step.
摘要翻译： 通过以该顺序执行头部成形工艺，安装部件形成工艺和光源安装工艺来形成热辅助磁头。 在头部成形处理中，将规划区域固定在滑块基板的光源放置面上，然后将磁头部形成在除了规划区域以外的头部区域上，并且用于固定激光二极管的安装空间的间隔件 在规划区域形成。 在安装部形成工序中，通过移除间隔件形成光源安装部。 在光源安装过程中，激光二极管安装在由安装部分形成步骤形成的光源安装部分上。
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27.发明授权Magnetic head for perpendicular magnetic recording having a main pole and a shield and specifically structured and located coil elements and magnetic coupling layers 有权用于垂直磁记录的磁头，具有主极和屏蔽，并且具有特定结构和定位的线圈元件和磁耦合层公开(公告)号：US08345382B1
公开(公告)日：2013-01-01
申请号：US13156784
申请日：2011-06-09
申请人： Yoshitaka Sasaki , Hiroyuki Ito , Kazuki Sato , Atsushi Iijima
发明人： Yoshitaka Sasaki , Hiroyuki Ito , Kazuki Sato , Atsushi Iijima
CPC分类号： G11B5/3123 , G11B5/1278 , G11B5/315
摘要： A magnetic head includes a coil, a main pole, a gap part, a write shield, and a return path section. The return path section includes a yoke part with a first coupling layer connected to the write shield and a second coupling layer magnetically coupling the first coupling layer to the yoke part. The second coupling layer has an end face facing toward a medium facing surface and located away from the medium facing surface. The coil includes i) a first coil element disposed with the first coupling layer interposed between the medium facing surface and the first coil element and ii) a plurality of second coil elements aligned perpendicularly to the medium facing surface and disposed with the second coupling layer interposed between the medium facing surface and the second coil elements. The first coil element being interposed between the main pole and the second coil elements.
摘要翻译： 磁头包括线圈，主极，间隙部分，写入屏蔽和返回路径部分。 返回路径部分包括具有连接到写入屏蔽的第一耦合层的磁轭部分和将第一耦合层磁耦合到磁轭部分的第二耦合层。 第二耦合层具有面向介质面向表面并远离介质面向表面定位的端面。 线圈包括：i）第一线圈元件，其设置有介于第一线圈元件之间的第一耦合层，以及ii）垂直于介质相对表面排列的多个第二线圈元件，并且第二耦合层插入 在介质面向表面和第二线圈元件之间。 第一线圈元件插入在主极和第二线圈元件之间。
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公开(公告)号：US08344494B2
公开(公告)日：2013-01-01
申请号：US13084053
申请日：2011-04-11
CPC分类号： H01L21/561 , H01L23/3121 , H01L24/24 , H01L24/82 , H01L24/92 , H01L24/94 , H01L24/96 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L25/50 , H01L2224/04105 , H01L2224/12105 , H01L2224/19 , H01L2224/24145 , H01L2224/32145 , H01L2224/73267 , H01L2224/94 , H01L2224/97 , H01L2225/06524 , H01L2225/06527 , H01L2225/06551 , H01L2225/06565 , H01L2225/1035 , H01L2225/1058 , H01L2924/07802 , H01L2924/12042 , H01L2924/18162 , H01L2924/00 , H01L2224/03 , H01L2224/83 , H01L2224/82 , H01L2224/83005
摘要： A layered chip package includes a main body and wiring. The main body includes a main part including a plurality of stacked layer portions, and a plurality of terminals disposed on the top and bottom surfaces of the main part. The wiring includes a plurality of lines electrically connected to the plurality of terminals. The plurality of lines include a plurality of common lines and a plurality of layer-dependent lines. Each of the plurality of layer portions includes: a plurality of common electrodes electrically connected to the plurality of common lines; a plurality of non-contact electrodes that are electrically connected to the layer-dependent lines and are not in contact with the semiconductor chip in the layer portion; and a selective connection electrode selectively electrically connected to only the layer-dependent line that the layer portion uses among the plurality of layer-dependent lines. The layer-dependent lines are greater than the common lines in maximum width.
摘要翻译： 分层芯片封装包括主体和布线。 主体包括主要部分，其包括多个堆叠层部分，以及设置在主要部分的顶表面和底表面上的多个端子。 布线包括电连接到多个端子的多条线。 多条线包括多条公共线和多个依赖于层的线。 多个层部分中的每一个包括：电连接到多个公共线的多个公共电极; 多个非接触电极，其电连接到与层相关的线，并且不与层部分中的半导体芯片接触; 以及选择性连接电极，其仅选择性地电连接到所述层部分在多个层相关线中使用的与层相关的线。 层相关线大于最大宽度的公共线。
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29.发明授权公开(公告)号：US08194511B2
公开(公告)日：2012-06-05
申请号：US12727666
申请日：2010-03-19
IPC分类号： G11B11/00
CPC分类号： G11B5/314 , G11B5/3163 , G11B5/6088 , G11B2005/001 , G11B2005/0021
摘要： A near-field light generating element has an outer surface including a bottom surface that lies at an end closer to a top surface of a substrate, a waveguide facing surface that lies at an end farther from the top surface of the substrate and faces a waveguide, a front end face located in a medium facing surface, and a side surface that connects the bottom surface, the waveguide facing surface and the front end face to each other. The front end face includes a first side that lies at an end of the bottom surface, a tip that lies at an end farther from the top surface of the substrate and forms a near-field light generating part, a second side that connects an end of the first side to the tip, and a third side that connects the other end of the first side to the tip. The waveguide facing surface includes a width changing portion that has a width in a direction parallel to the bottom surface and the front end face, the width decreasing with decreasing distance to the front end face.
摘要翻译： 近场光产生元件具有外表面，该外表面包括位于更靠近基板顶表面的一端的底表面，位于远离基板顶表面的一端的波导对面的表面 ，位于介质相对表面中的前端面以及将所述底表面，所述波导对向表面和所述前端面彼此连接的侧表面。 所述前端面包括位于所述底面的端部的第一侧，位于距离所述基板的上表面更远的一端并形成近场光产生部的端部，所述第二侧将端部 并且将第一侧的另一端连接到尖端的第三侧。 面向波导的表面包括宽度改变部分，该宽度改变部分在平行于底面和前端面的方向上具有宽度，宽度随着与前端面的距离的减小而减小。
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30.发明授权公开(公告)号：US08107192B2
公开(公告)日：2012-01-31
申请号：US12588686
申请日：2009-10-23
IPC分类号： G11B5/127
CPC分类号： G11B5/314 , G11B5/1278 , G11B2005/001 , G11B2005/0021
摘要： A heat-assisted magnetic recording head includes a slider, an edge-emitting laser diode fixed to the slider, and an external mirror fixed to the laser diode. The laser diode has: an emitting end face that includes an emission part for emitting laser light; a mounting surface that lies at an end in a direction perpendicular to the plane of an active layer and faces the slider; and a rear surface opposite to the mounting surface. The external mirror includes: a first to-be-fixed part disposed along the emitting end face; a second to-be-fixed part disposed along the rear surface; and a coupling part that couples the first and second to-be-fixed parts to each other. The first to-be-fixed part has a reflecting surface that reflects the laser light emitted from the emission part toward the waveguide.
摘要翻译： 热辅助磁记录头包括滑块，固定到滑块的边缘发射激光二极管和固定到激光二极管的外反射镜。 激光二极管具有：发射端面，其包括用于发射激光的发射部分; 安装表面位于垂直于有源层的平面的方向上的端部并且面向滑块; 以及与安装表面相对的后表面。 外部反射镜包括：沿着发射端面设置的第一待固定部分; 沿着后表面设置的第二待固定部分; 以及将第一和第二固定部件彼此连接的联接部。 第一待固定部分具有将从发射部分发射的激光朝向波导反射的反射表面。
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