Abstract:
A circuit is disclosed for determining which of a multiplicity of LED strings in an illumination system has a fault. A group of circuits determines the maximum, minimum, midpoint between maximum and minimum, and average voltage of the group of LED string voltages in use, and examines the statistical properties of the LED string voltages. Comparators are used to find the strings which have the highest and lowest operating voltages, and to compare the midpoint and average voltages to determine whether the highest or lowest voltage string is responsible for causing a fault in the illumination system operation. Memory means are used to keep the said determined string turned off to prevent faulty operation.
Abstract:
A high voltage ESD-protection structure is used to protect delicate transistor circuits connected to an input or output of an integrated circuit bond pad from destructive high voltage ESD events by conducting at a controlled breakdown voltage that is less than a voltage that may cause destructive breakdown of the input and/or output circuits. The ESD-protection structure is able to absorb high current from these ESD events without snapback that would compromise operation of the higher voltage inputs and/or outputs of the integrated circuit. The ESD-protection structure will conduct when an ESD event occurs at a voltage above a controlled breakdown voltage of an electronic device, e.g., diode, in the ESD protection structure. Conduction of current from an ESD event having a voltage above the electronic device controlled breakdown voltage may be through another electronic device, e.g., transistor, having high current conduction capabilities, in the ESD-protection structure that may be controlled (triggered) by the device (e.g., diode) determining the controlled breakdown voltage (at which the ESD voltage is clamped to a desired value). The high voltage ESD-protection structure may be located substantially under the bond pad and may also include a low capacitance forward diode structure between the bond pad and the ESD clamp circuit.
Abstract:
A plurality of power supply modules having their outputs coupled in parallel are controlled for load balancing purposes through a direct current bus having filtered pulse width modulation (PWM) signals representative of the power outputs of each of the plurality of power supply modules. A local PWM signal for each of the plurality of power supply modules is filtered to a DC voltage and used to compare with an average power required from each of the plurality of power supply modules.
Abstract:
An integrated circuit device comprising an integrated circuit die mounted on a leadframe having a plurality of inner leads. The integrated circuit die has a plurality of bond pads that are electrically connected to the inner leads of the leadframe, wherein at least two bond pads are connected to a one of the plurality of inner leads and/or at least two inner leads are connected to one or more bond pads with a single bond wire. A single bond wire is connected to a first bond pad or inner lead and subsequently wedge or stitch bonded to a second bond pad or inner lead, then it is connected to a third bond pad or inner lead. The single bond wire requires only one connection area at each of the bond pad(s) and inner lead(s). The bond pad(s) of the die and inner lead(s) of the leadframe are thereby electrically connected together by the single bond wire.
Abstract:
A spectrum analyzer that may be implemented by a simple microcontroller that does not have a hardware multiply function is disclosed. The spectrum analyzer of the present invention utilizes at least five frequency bins. The input signal is sampled at four times the bin frequency. The input signal is sampled at twice the Nyquist rate, which results in symmetries in the sin(wn) and cos(wn) functions. These symmetries allow the in-phase and quadrature components of the input signal to be calculated by add, ignore or subtract operations instead of the more complex multiplication and integration operations. Accordingly, the energy for each bin may be calculated with a minimum number of multiply operations. Because the number of multiply operations have been significantly reduced, these multiply operations may be performed by software instead of hardware. As a result, the spectrum analyzer may be implemented with a simple processor that does not have a hardware multiply. Another frequency bin is added by oversampling the highest frequency. A low pass filter is used to eliminate the effect of aliasing on the other frequency bins. A simple processor can still handle a bin that has been processed in this manner. As a result, at least five frequency bins may be processed by a spectrum analyzer implemented on a simple processor.
Abstract:
An integrated circuit having a microcontroller, mask programmed read only memory, functions such as clock oscillator, analog-to-digital converter, timers, etc., where each may be adjusted with a digital input to a desired calibration value. The digital input resulting in the desired calibration value being stored in a programmable fuse array.
Abstract:
A microcontroller fabricated on a semiconductor chip has an on-chip EPROM program memory. The microcontroller is selectively configurable to operate in any one of a plurality of predetermined operating modes, including at least one secure microcontroller mode. A plurality of EPROM configuration fuses used for configuring the microcontroller and protecting its program memory from read, verify or write through any instruction initiated from other than a predetermined secure area of the chip, are mapped into the on-chip EPROM program memory as bits in respective address locations thereof. The value of a bit representing any one of said fuses is effective to determine the condition of the respective fuse. That condition is observed by reading the value of the respective bit for that fuse stored in the EPROM program memory. The chip security is enabled by configuring the microcontroller in a code protected mode by programming the bits representing the desired fuses in the EPROM program memory to effectively blow or erase each fuse according to the desired configuration.
Abstract:
A semiconductor integrated circuit device has an on-chip processor and at least one on-chip digital register for storing plural bits therein. The bit contents of the register are written, selectively transformed, and read out of the register during processing of data by the processor and related circuitry. Peripheral instructions such as those from an interrupt source may contend with instructions from the processor for setting and clearing one or more bits in the register. To permit setting and clearing a unique bit in the register without affecting other bits in the register or the capability of the contending source to perform its instructions on one or more of these other bits, three separate addresses are provided for bit set, bit clear, and direct write of the register.
Abstract:
A method and apparatus in which a data stream is received that includes constant bit rate (CBR) carrier streams, at least one of which comprises frames, a cumulative phase offset report (CPOR) and a client rate report (CRR). A counter accumulating a PHY-scaled stream clock (IPSCk) is sampled at a nominal sampling period (Tps) to obtain a cumulative PHY-scaled count (CPSC). A PHY-scaled stream phase offset (PSPO) is calculated that indicates phase difference between PHY-scaled stream nominal bit count (LPSD) and an incoming PHY-scaled count delta (IPSD). The data stream is demultiplexed to obtain CBR carrier streams. Respective CBR carrier streams include a previous network node CPOR (CPOR-P) and a previous network node CPO (CPO-P). A CPO is calculated that is a function of CPO-P and PSPO. CPO-P is replaced with the calculated CPO. The CBR carrier streams are multiplexed into intermediate-network-node data streams that are transmitted from the intermediate-network-node.
Abstract:
A ReRAM memory array includes ReRAM memory cells having two series-connected select transistors connected in series with a ReRAM device. When ReRAM memory cell(s) are selected for erasing, the bit line coupled to the ReRAM memory cell(s) to be erased is biased at a first voltage potential. The source line coupled to the ReRAM memory cell(s) to be erased is biased at a second voltage potential greater than the first voltage potential, the difference between the first voltage potential and the second voltage potential being sufficient to erase the ReRAM device. The gates of the series-connected select transistors of the ReRAM memory cell(s) to be erased are supplied with positive voltage pulses. The gates of the series-connected select transistors of the ReRAM memory cell(s) unselected for erasing are supplied with a voltage potential insufficient to turn them on.