Abstract:
A system for line scan processing video signals from a linear array of photoelectric cells so that the signals for individual cells and individual scan sweep are selectively utilized according to sweep number and cell numbers. A signal window is defined for each sweep individually at a predetermined cell for a beginning of the effective video signal and is terminated at another predetermined cell for the end of the effective video signal so that the video signal is processed for only that portion of each sweep covering the area of interest. In optical inspection of an article the significance of changes in the ratio of light intensity at particular cells from the background light intensity is adjusted by sweep and cell number so that such changes which are predictable in certain locations on the article must exceed threshold levels which are different than for other locations. This enables compensation in the inspection of a number of similar articles for regularly occurring marks on the areas of inspection for those articles.
Abstract:
A polarized image acquisition apparatus includes a division type half-wave plate, located opposite to the mask substrate with respect to an objective lens and near an objective lens pupil position, to arrange P and S polarized waves of the transmitted light having passed through the objective lens to be mutually orthogonal, a Rochon prism to separate trajectories of P and S polarized waves, an imaging lens to form images of P and S polarized waves having passed through the Rochon prism at image formation positions different from each other, a mirror, in a case where one of P and S polarized waves is focused/formed at one of the different image formation positions, to reflect the other wave at the other position, a first sensor to capture an image of one of P and S polarized waves, and a second sensor to capture an image of the other wave.
Abstract:
A wafer scanning system includes imaging collection optics to reduce the effective spot size. Smaller spot size decreases the number of photons scattered by the surface proportionally to the area of the spot. Air scatter is also reduced. TDI is used to produce a wafer image based on a plurality of image signals integrated over the direction of linear motion of the wafer. An illumination system floods the wafer with light, and the task of creating the spot is allocated to the imaging collection optics.
Abstract:
A wafer scanning system includes imaging collection optics to reduce the effective spot size. Smaller spot size decreases the number of photons scattered by the surface proportionally to the area of the spot. Air scatter is also reduced. TDI is used to produce a wafer image based on a plurality of image signals integrated over the direction of linear motion of the wafer. An illumination system floods the wafer with light, and the task of creating the spot is allocated to the imaging collection optics.
Abstract:
To provide a technique for improving a detection precision of the inspection device. The inspection device 100 includes an irradiation unit 101 that irradiates a beam by pulse oscillation onto a surface of the sample from a laser light source, a detection unit 102 on which light from the surface of the sample by the irradiation is made incident to generate and output a detection signal, and a detection control unit 104 that generates a gate signal (G) for controlling an input/output of the detection unit 102 in synchronization with a timing of the pulse oscillation of the irradiation unit 101, and applies the gate signal (G) to the detection unit 102. The detection unit 102 allows the light to be made incident thereon at a timing in accordance with the gate signal (G), and generates and outputs a detection signal.
Abstract:
A surface inspection system, as well as related components and methods, are provided. The surface inspection system includes a beam source subsystem, a beam scanning subsystem, a workpiece movement subsystem, an optical collection and detection subsystem, and a processing subsystem. The optical collection and detection system features, in the front quartersphere, a light channel assembly for collecting light reflected from the surface of the workpiece, and a front collector and wing collectors for collecting light scattered from the surface, to greatly improve the measurement capabilities of the system. The light channel assembly has a switchable edge exclusion mask and a reflected light detection system for improved detection of the reflected light.
Abstract:
In an environment in which signal-to-noise is poor, a method and a system configuration for power-saving, low-cost, and general minute signal detection are provided. The system includes a circuit that converts and amplifies an input signal, a nonlinear analog front-end circuit that determines the existence of a minute signal from the input signal and that outputs information on the existence of the same as an event signal, an analog-to-digital-conversion circuit that drives operation-mode control based on the event signal and performs analog-to-digital conversion on the converted-and-amplified input signal, a data-transfer circuit that drives the operation-mode control by the event signal and transfers the analog-to-digital converted signal, a digital-signal-processing circuit that drives the operation-mode control by the event signal and performs digital-signal processing on the signal transmitted from the data-transfer circuit and detects the signal, and a parameter-control circuit that controls a characteristic parameter of the nonlinear analog front-end circuit.
Abstract:
To process a signal from a plurality of detectors without being affected by a variation in the height of a substrate, and to detect more minute defects on the substrate, a defect inspection device is provided with a photoelectric converter having a plurality of rows of optical sensor arrays in each of first and second light-collecting/detecting unit and a processing unit for processing a detection signal from the first and the second light-collecting/detecting unit to determine the extent to which the positions of the focal points of the first and the second light-collecting/detecting unit are misaligned with respect to the surface of a test specimen, and processing the detection signal to correct a misalignment between the first and the second light-collecting/detecting unit, and the corrected detection signal outputted from the first and the second light-collecting/detecting unit are combined together to detect the defects on the test specimen.
Abstract:
The original image composed of pixels representing a sample of the alloy, the hydrides being represented by groupings of pixels (21), the method comprises steps of processing the image (1, 2, 3, 4, 5) to obtain the skeleton of the groupings of pixels (21′) contained in the image, the skeletonization step (5) being followed by a step (6, 10) of analysis pertaining to the groupings thus skeletonised. The analysis step allows the determination of the hydrogen content as well as the morphological study of the hydrides so as to determine their danger.
Abstract:
An inspection device for inspecting defects of an inspection object including a light source for irradiating a luminous flux to the inspection object; an optical system for guiding reflected light from the inspection object; a photoelectric image sensor having a plurality of photoelectric cells arranged, for converting the light guided to detection signals; a detection signal transfer unit having channels each constituted by a signal correction unit, a converter and an image formation unit, and corresponding to each of a plurality of regions formed by dividing the photoelectric image sensor, respectively; and an image synthesis unit for forming an image of the surface of the object by synthesizing partial images outputted; the inspection device inspecting defects of the object by processing the synthesized image; whereby it becomes possible to correct a detection signal from said photoelectric cell close to a predetermined reference target value.