Abstract:
A voltage switchable dielectric material comprising a concentration of multi-component particles that are individually formed by a mechanical or mechanochemical bonding process that bonds a semiconductive or conductive-type host particle with multiple insulative, conductive, or semi-conductive guest particles.
Abstract:
A electrostatic discharge suppression device including an electrostatic discharge reactance layer having a first side and a second side, a first electrode coupled to the first side and comprising a first extension projecting towards a first distal end of the device, and a second electrode coupled to the second side and including a second extension projecting towards a second end of the device, such that the first extension and the second extension overlap to form an electrode overlap area, wherein during an electrostatic discharge event, an electric current is passed between the first and second extensions through the electrostatic discharge layer in the electrode overlap area.
Abstract:
One or more embodiments provide for a device that utilizes voltage switchable dielectric material having semi-conductive or conductive materials that have a relatively high aspect ratio for purpose of enhancing mechanical and electrical characteristics of the VSD material on the device.
Abstract:
A electrostatic discharge suppression device including an electrostatic discharge reactance layer having a first side and a second side, a first electrode coupled to the first side and comprising a first extension projecting towards a first distal end of the device, and a second electrode coupled to the second side and including a second extension projecting towards a second end of the device, such that the first extension and the second extension overlap to form an electrode overlap area, wherein during an electrostatic discharge event, an electric current is passed between the first and second extensions through the electrostatic discharge layer in the electrode overlap area.
Abstract:
Devices capable of protecting electronic components during the occurrence of a disturbance event using printed circuit board manufacturing techniques. A three (3) layer structure is formed comprising a polymer-based formulation sandwiched between two electrode layers. The devices can be manufactured in panel form providing high quantities of devices which can be removed from the panel and applied directly to the component to be protected. Desired patterns can be formed on either one of the electrode layers by photo-etch techniques thereby providing a process that can be tailored to a large number of applications.
Abstract:
A method is provided for fabricating current-carrying formation on substrates. The method includes providing a substrate including a layer of a voltage switchable dielectric material, forming a mask over the layer of the voltage switchable dielectric material, and forming an electrically conductive layer. The mask includes gaps and the electrically conductive layer is formed in the gaps. The voltage switchable dielectric material has a characteristic voltage and the electrically conductive layer is formed by applying a voltage in excess of the characteristic voltage to the substrate and depositing the electrically conductive material through an electrochemical process such as electroplating.
Abstract:
A voltage variable material (nullVVMnull) including an insulative binder that is formulated to intrinsically adhere to conductive and non-conductive surfaces is provided. The binder and thus the VVM is self-curable and applicable in a spreadable form that dries before use. The binder eliminates the need to place the VVM in a separate device or to provide separate printed circuit board pads on which to electrically connect the VVM. The binder and thus the VVM can be directly applied to many different types of substrates, such as a rigid (FR-4) laminate, a polyimide or a polymer. The VVM can also be directly applied to different types of substrates that are placed inside a device. In one embodiment, the VVM includes doped semiconductive particles having a core, such which can be silicon, and an inert coating, which can be an oxide. The particles are mixed in the binder with conductive particles.
Abstract:
The present invention provides overvoltage circuit protection. Specifically, the present invention provides a voltage variable material (nullVVMnull) that includes an insulative binder that is formulated to intrinsically adhere to conductive and nonconductive surfaces. The binder and thus the VVM is self-curable and may be applied to an application in the form of an ink, which dries in a final form for use. The binder eliminates the need to place the VVM in a separate device or for separate printed circuit board pads on which to electrically connect the VVM. The binder and thus the VVM can be directly applied to many different types of substrates, such as a rigid (FR-4) laminate, a polyimide or a polymer. The VVM can also be directly applied to different types of substrates that are placed inside a device.
Abstract:
A variable voltage protection component in accordance with this invention comprises a reinforcing layer of insulating material having a substantially constant thickness embedded in a voltage variable material. With this configuration, the reinforcing layer defines a uniform thickness for the variable voltage protection component that is resist to compressive forces that may cause a reduction in the clamp voltage or a short in the voltage variable material. In addition, the variable voltage protection component can be attached to a compressible ground plane to form a variable voltage protection device. Methods are provided for making the variable voltage protection component and device.
Abstract:
A variable voltage protection component in accordance with this invention comprises a reinforcing layer of insulating material having a substantially constant thickness embedded in a voltage variable material. With this configuration, the reinforcing layer defines a uniform thickness for the variable voltage protection component that is resist to compressive forces that may cause a reduction in the clamp voltage or a short in the voltage variable material. In addition, the variable voltage protection component can be attached to a compressible grounding plane to form a variable voltage protection device. Methods are provided for making the variable voltage protection component and device.