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    Electronic circuit building block
    22.
    发明授权
    Electronic circuit building block 有权
    电子电路积木

    公开(公告)号：US07203074B1

    公开(公告)日：2007-04-10

    申请号：US10738405

    申请日：2003-12-16

    Applicant: Andrew Yaung ,  Neal S. Greenberg ,  Che Wai Yeung

    Inventor： Andrew Yaung ,  Neal S. Greenberg ,  Che Wai Yeung

    IPC: H05K1/14

    CPC classification number: H05K1/142 ,  H05K2201/09181 ,  H05K2201/09963 ,  H05K2201/10189 ,  H05K2201/10424 ,  H05K2201/1059 ,  Y10T29/49126

    Abstract: Electronic Circuit Building Blocks are mechanically connected to each other to form larger circuit boards using a mechanical bridge connector. The Electronic Circuit Building Blocks include female interlocking elements formed on its edges, and the mechanical bridge connector includes male interlocking elements. Half parts of the male interlocking elements of the mechanical bridge connector are inserted into the corresponding female interlocking elements of the Electronic Circuit Building Blocks from one side of the circuit board. The Electronic Circuit Building Blocks include through-holes for mounting through-hole components and/or surface-mount pads for mounting surface-mount components. The Electronic Circuit Building Blocks also include traces interconnecting two or more of the through-hole components and the surface-mount components.

    Abstract translation: 电子电路构建块彼此机械连接，以使用机械桥连接器形成较大的电路板。 电子电路构建块包括形成在其边缘上的阴互锁元件，机械桥连接器包括阳互锁元件。 机械桥连接器的阳联锁元件的半部分从电路板的一侧插入到电子电路构件的相应的阴互锁元件中。 电子电路构建块包括用于安装通孔部件的通孔和/或用于安装表面安装部件的表面安装焊盘。 电子电路构建块还包括将两个或多个通孔部件和表面安装部件相互连接的迹线。

    Universal systems printed circuit blocks and method for interconnecting the same
    23.
    发明申请
    Universal systems printed circuit blocks and method for interconnecting the same 审中-公开
    通用系统印刷电路块及其相互连接的方法

    公开(公告)号：US20060172614A1

    公开(公告)日：2006-08-03

    申请号：US11051393

    申请日：2005-02-03

    Applicant: Sang Ta

    Inventor： Sang Ta

    IPC: H01R4/48

    CPC classification number: H05K1/142 ,  H05K1/0287 ,  H05K1/029 ,  H05K2201/09963 ,  H05K2201/10189 ,  H05K2201/10363 ,  H05K2203/173

    Abstract: In Electronics, there exists three distinctive areas namely, discrete components or devices, circuits, and systems. A circuit is built from devices and a system is built from circuits. This invention aims at reducing the implementation of electronic systems down to just three steps namely, systems design, printed-circuit-board planar assembly, and systems test when-as a plurality of Universal Systems Printed-Circuit Blocks of pre-defined sizes is used. Each of said Universal Systems Printed-Circuit Blocks being usable and reusable for prototypes and production is built from a printed circuit board having thereon a functional circuit and a variety of circuit patterns and interconnection structures such that, any of said Blocks, when joined together with other Blocks on the same plane by standard connectors or electrically conductive compounds to form a systems board, can send and receive signals and voltages to and from any other Blocks.

    Abstract translation: 在电子学中，存在三个独特的领域，即分立元件或器件，电路和系统。 电路由设备构成，系统由电路构成。 本发明旨在将电子系统的实现降低到三个步骤，即系统设计，印刷电路板平面组装和系统测试 - 当使用预定义尺寸的多个通用系统印刷电路块 。 每个所述通用系统印刷电路块可用于并且可重用于原型和生产由其上具有功能电路和各种电路图案和互连结构的印刷电路板构成，使得任何所述块当与 通过标准连接器或导电化合物形成系统板的同一平面上的其他块可以向任何其他块发送和接收信号和电压。

    Ablative process for printed circuit board technology
    24.
    发明授权
    Ablative process for printed circuit board technology 失效
    印刷电路板技术的烧蚀工艺

    公开(公告)号：US5472828A

    公开(公告)日：1995-12-05

    申请号：US193660

    申请日：1994-02-07

    Applicant: Rickey D. Akins ,  John Walvoord

    Inventor： Rickey D. Akins ,  John Walvoord

    IPC: B23K26/00 ,  B23K26/03 ,  B23K26/06 ,  G03F7/20 ,  G03F7/24 ,  H01Q1/42 ,  H01Q15/00 ,  H05K3/00 ,  H05K3/02 ,  H05K3/06

    CPC classification number: H01Q15/0013 ,  B23K26/032 ,  B23K26/066 ,  G03F7/2053 ,  G03F7/24 ,  H01Q1/425 ,  H05K3/027 ,  H05K2201/09018 ,  H05K2201/09963 ,  H05K2203/056 ,  H05K2203/107 ,  H05K3/0017 ,  H05K3/061 ,  Y10S430/146

    Abstract: In a method for fabricating a printed circuit board on a doubly contoured or hemispherical substrate such as a radome, a coherent light source is used to form a plurality of elements of a predetermined pattern on the surface of the substrate. The substrate includes a bottom layer and a metallized layer. At least a first element of the pattern is formed by ablating the element into a resist coating or ablating the element into the metallized layer with the coherent light source. The coherent light source preferably includes an excimer laser. The substrate is then displaced relative to the coherent light source until all the elements of the predetermined pattern are formed over the entire surface of the substrate. When the pattern is ablated into the resist material, an etching technique is used to remove portions of the metallized layer from the substrate.

    Abstract translation: 在用于在诸如天线罩的双轮廓或半球形基板上制造印刷电路板的方法中，使用相干光源在基板的表面上形成预定图案的多个元件。 衬底包括底层和金属化层。 通过将元件烧蚀成抗蚀剂涂层或用相干光源将元件烧蚀到金属化层中来形成图案的至少第一元件。 相干光源优选地包括准分子激光器。 然后将衬底相对于相干光源移位，直到预定图案的所有元件形成在衬底的整个表面上。 当图案被烧蚀到抗蚀剂材料中时，使用蚀刻技术从基底去除金属化层的部分。

    Three-dimensional substrate for providing three-dimensional structure
    26.
    发明授权
    Three-dimensional substrate for providing three-dimensional structure 有权

    公开(公告)号：US09907198B2

    公开(公告)日：2018-02-27

    申请号：US15641223

    申请日：2017-07-04

    Applicant: Misako Tawarayama

    Inventor： Misako Tawarayama

    IPC: H05K7/02 ,  H05K5/02 ,  H05K7/14

    CPC classification number: H05K7/023 ,  H05K1/0284 ,  H05K1/0286 ,  H05K1/14 ,  H05K5/0247 ,  H05K7/14 ,  H05K2201/09963

    Abstract: The present invention provides a three-dimensional substrate having a different shape than the conventional circuit substrate when a plurality of components are combined to form an electronic circuit. In addition, an electronic device is provided from the three-dimensional substrate. The three-dimensional substrate forms a component forming the three-dimensional structure by three-dimensionally forming the electronic circuit. The component includes at least one electronic component and an electric connection structure for electrically connecting the electronic component with the outside the component. When a plurality of components are combined, the electronic device having the three-dimensional shape having a different shape than the component is formed. The present invention provides the three-dimensional substrate capable of being designed by the shape of the substrate itself.

    Printed circuit boards by massive parallel assembly
    27.
    发明授权
    Printed circuit boards by massive parallel assembly 有权
    印刷电路板通过大规模并联组装

    公开(公告)号：US08283566B2

    公开(公告)日：2012-10-09

    申请号：US12404294

    申请日：2009-03-14

    Applicant: JengPing Lu ,  Eugene M. Chow

    Inventor： JengPing Lu ,  Eugene M. Chow

    IPC: H05K1/00

    CPC classification number: H05K1/142 ,  H05K1/0286 ,  H05K1/14 ,  H05K3/368 ,  H05K2201/09963 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155

    Abstract: A method of forming an interconnect substrate includes providing at least two unit cells, arranging the unit cells to form a desired circuit pattern, and joining the unit cells to form the interconnect substrate having the desired circuit pattern. A circuit substrate, has a desired circuit pattern on a substrate, the substrate made up of at least two unit cells having conductive lines electrically connected together.

    Abstract translation: 形成互连衬底的方法包括提供至少两个单元电池，布置单元电池以形成期望的电路图案，以及连接单元电池以形成具有所需电路图案的互连衬底。 电路基板在基板上具有期望的电路图案，该基板由具有电连接在一起的导电线的至少两个单电池构成。

    CIRCUIT DESIGN ASSEMBLIES
    28.
    发明申请
    CIRCUIT DESIGN ASSEMBLIES 审中-公开
    电路设计组件

    公开(公告)号：US20110008974A1

    公开(公告)日：2011-01-13

    申请号：US12501408

    申请日：2009-07-11

    Applicant: IOAN ALEXANDRU SALOMIE

    Inventor： IOAN ALEXANDRU SALOMIE

    IPC: H01R12/00 ,  G06F17/50 ,  H05K3/00

    CPC classification number: H01R9/28 ,  G06F17/5068 ,  G06F2217/40 ,  H05K1/0286 ,  H05K3/103 ,  H05K3/222 ,  H05K3/4046 ,  H05K2201/09609 ,  H05K2201/09963 ,  H05K2201/1028 ,  H05K2201/10333 ,  H05K2201/1059 ,  Y10T29/49124

    Abstract: Circuit design assemblies, referred to herein as a “SpinBoard” and “SpinConnector” assemblies, are disclosed. The assemblies may include any of a variety of advantageous structures, including for example a board with a grid defining circuit point positions, and SpinConnector structures for building circuits. The disclosed SpinConnector structures may include advantageous features such as pin and plate structures that allow building fixed or articulating connector chains, and improved contact structures for conductive contact with electronic components. Software for designing the provided assemblies is also disclosed.

    Abstract translation: 公开了电路设计组件，这里称为“SpinBoard”和“SpinConnector”组件。 组件可以包括各种有利的结构中的任何一种，包括例如具有限定电路点位置的网格的板以及用于构建电路的SpinConnector结构。 所公开的旋转连接器结构可以包括有利特征，例如能够构建固定或铰接连接器链的销和板结构，以及用于与电子部件的导电接触的改进的接触结构。 还公开了用于设计所提供的组件的软件。

    PRINTED CIRCUIT BOARDS BY MASSIVE PARALLEL ASSEMBLY
    30.
    发明申请
    PRINTED CIRCUIT BOARDS BY MASSIVE PARALLEL ASSEMBLY 有权
    印刷电路板通过大型平行线组装

    公开(公告)号：US20100230139A1

    公开(公告)日：2010-09-16

    申请号：US12404294

    申请日：2009-03-14

    Applicant: JengPing Lu ,  Eugene M. Chow

    Inventor： JengPing Lu ,  Eugene M. Chow

    IPC: H05K1/02 ,  H05K3/00

    CPC classification number: H05K1/142 ,  H05K1/0286 ,  H05K1/14 ,  H05K3/368 ,  H05K2201/09963 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155

    Abstract: A method of forming an interconnect substrate includes providing at least two unit cells, arranging the unit cells to form a desired circuit pattern, and joining the unit cells to form the interconnect substrate having the desired circuit pattern. A circuit substrate, has a desired circuit pattern on a substrate, the substrate made up of at least two unit cells having conductive lines electrically connected together.

    Abstract translation: 形成互连衬底的方法包括提供至少两个单元电池，布置单元电池以形成期望的电路图案，以及连接单元电池以形成具有所需电路图案的互连衬底。 电路基板在基板上具有期望的电路图案，该基板由具有电连接在一起的导电线的至少两个单电池构成。

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