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    COMPOSITE ELECTRONIC COMPONENT
    21.
    发明申请
    COMPOSITE ELECTRONIC COMPONENT 审中-公开
    复合电子元件

    公开(公告)号：US20140313682A1

    公开(公告)日：2014-10-23

    申请号：US14257006

    申请日：2014-04-21

    Applicant: NIHON DEMPA KOGYO CO., LTD.

    Inventor： HIROYUKI MITOME

    IPC: H05K1/02

    CPC classification number: H05K3/3452 ,  H05K1/111 ,  H05K3/303 ,  H05K3/3426 ,  H05K2201/09381 ,  H05K2201/099 ,  H05K2201/09909 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10424 ,  H05K2201/10462 ,  H05K2201/10553 ,  H05K2201/10651 ,  H05K2201/10969 ,  Y02P70/613

    Abstract: A composite electronic component includes a metal component with a wide surface terminal, a printed circuit board with a wide surface mounting pad; and a plurality of small area solder films partitioned into small sectioned regions. The small sectioned regions are sectioned by grid-shaped solder resist banks on the wide surface mounting pad. A cream solder is applied on the individual small sectioned regions to form the plurality of small area solder films. The grid-shaped solder resist bank has a width configured to: reduce a bubble that occurs in the sectioned region at one side of the grid-shaped solder resist bank from merging with a bubble that occurs in the sectioned region at another side of the grid-shaped solder resist bank; and act as an escaping route for a bubble that occur in the small area solder film.

    Abstract translation: 复合电子部件包括具有宽表面端子的金属部件，具有宽表面安装焊盘的印刷电路板; 以及划分成小截面区域的多个小面积焊料膜。 小截面区域由宽表面安装垫上的格栅状阻焊堤分段。 在各个小截面区域上施加膏状焊料以形成多个小面积的焊料膜。 栅格形阻焊堤具有一宽度，该宽度被配置为：减小在栅极阻焊堤一侧的截面区域中发生的气泡，与在栅格另一侧的截面区域中发生的气泡合并 形阻焊银行; 并作为发生在小面积焊料膜中的气泡的逸出路线。

    Electronic component, mounted structure, and inverter device therewith
    24.
    发明授权
    Electronic component, mounted structure, and inverter device therewith 有权
    电子部件，安装结构和逆变器装置

    公开(公告)号：US07839621B2

    公开(公告)日：2010-11-23

    申请号：US12039284

    申请日：2008-02-28

    Applicant: Yukihiko Shirakawa ,  Iwao Miura

    Inventor： Yukihiko Shirakawa ,  Iwao Miura

    IPC: H01G4/228 ,  H01G4/248 ,  H01G4/06

    CPC classification number: H01G2/06 ,  H01C1/14 ,  H01G4/228 ,  H01G9/008 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/10462 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/611 ,  Y02P70/613

    Abstract: A surface mount type electronic component has a dielectric element body, electrodes, lead conductors, and lead wires. The dielectric element body has principal faces and side faces. One electrode is formed on one principal face, the other electrode is formed on the other principal face, and the electrodes face each other. A first portion of one lead conductor is laid on one side face. A first portion of the other lead conductor is laid on another side face. First portions of the lead wires are connected to the corresponding first portions of the lead conductors.

    Abstract translation: 表面安装型电子部件具有电介质元件主体，电极，引线导体和引线。 电介质元件主体具有主面和侧面。 一个电极形成在一个主面上，另一个电极形成在另一个主面上，电极彼此面对。 一个引线导体的第一部分放置在一个侧面上。 另一个引线导体的第一部分被放置在另一侧面上。 引线的第一部分连接到引线导体的对应的第一部分。

    Constant-temperature type crystal oscillator
    26.
    发明申请
    Constant-temperature type crystal oscillator 有权
    恒温型晶体振荡器

    公开(公告)号：US20100052802A1

    公开(公告)日：2010-03-04

    申请号：US12584192

    申请日：2009-09-01

    Applicant: Junichi Arai

    Inventor： Junichi Arai

    IPC: H03B1/00

    CPC classification number: H03L1/04 ,  H05K1/0206 ,  H05K1/0212 ,  H05K2201/09781 ,  H05K2201/10022 ,  H05K2201/10075 ,  H05K2201/10462 ,  H05K2201/10545 ,  H05K2203/165

    Abstract: A constant-temperature type crystal oscillator includes: a crystal unit that is installed on one principal surface of a circuit substrate, and chip resistors, which function as heating elements, and which are installed on the other principal surface of the circuit substrate so as to face a principal surface of the crystal unit, the chip resistors heating up the crystal unit to keep an operational temperature of the crystal unit constant. A heating metal film facing the principal surface of the crystal unit is provided on the one principal surface of the circuit substrate. A heat conducting material is interposed between the principal surface of the crystal unit and the heating metal film to perform thermal coupling therebetween. The heating metal film is thermally coupled to electrode terminals of the chip resistors via a plurality of electrode through holes.

    Abstract translation: 恒温型晶体振荡器包括：安装在电路基板的一个主表面上的晶体单元和用作加热元件的片式电阻器，并且安装在电路基板的另一个主表面上，以便 面对晶体单元的主表面，芯片电阻加热晶体单元以保持晶体单元的工作温度恒定。 在电路基板的一个主表面上设置面对晶体单元的主表面的加热金属膜。 导热材料插入在晶体单元的主表面和加热金属膜之间，以在它们之间进行热耦合。 加热金属膜通过多个电极通孔热耦合到芯片电阻器的电极端子。

    ELECTRONIC APPARATUS WITH A PIN MOUNT
    27.
    发明申请
    ELECTRONIC APPARATUS WITH A PIN MOUNT 有权
    带安装的电子装置

    公开(公告)号：US20090156025A1

    公开(公告)日：2009-06-18

    申请号：US12254329

    申请日：2008-10-20

    Applicant: Po-Sheng LEE

    Inventor： Po-Sheng LEE

    IPC: H01R12/00

    CPC classification number: H05K3/301 ,  H05K2201/10015 ,  H05K2201/10424 ,  H05K2201/10462 ,  H05K2201/10583 ,  H05K2201/10606

    Abstract: An electronic apparatus has an electronic component and a pin mount. The electronic component has a working surface and two pins protruding from the working surface and each pin being bent to form an L-shape with a proximal part and a distal part. The pin mount has a flat bottom, a rear, two through holes and two communicating recesses. The through holes are defined through the pin mount in parallel, are formed from the front to the rear and receiving the proximal parts of the pins. The communicating recesses are formed in parallel in the front from the through holes toward the bottom of the pin mount, communicate respectively with the through holes and receiving the distal parts of the pins. The pin mount immobilizes the electronic component to prevent the pins from being detached from the electronic component or the PCB to retain the lifetime of the pins.

    Abstract translation: 电子设备具有电子部件和销安装件。 电子部件具有工作面和从工作面突出的两个销，每个销弯曲形成具有近端部分和远端部分的L形。 销安装座有一个平底，一个后部，两个通孔和两个连通的凹槽。 通孔平行地通过销安装件形成，从前到后形成并容纳销的近端部分。 连通凹部从前面的通孔朝向销安装座的底部平行地形成，分别与通孔连通并且接收销的远端部分。 引脚安装件固定电子部件，以防止引脚与电子部件或PCB分离，以保持引脚的寿命。

    Printed circuit board with quartz crystal oscillator
    28.
    发明授权
    Printed circuit board with quartz crystal oscillator 失效
    带石英晶体振荡器的印刷电路板

    公开(公告)号：US07525192B2

    公开(公告)日：2009-04-28

    申请号：US11309215

    申请日：2006-07-13

    Applicant: Ling-Ling Shen

    Inventor： Ling-Ling Shen

    IPC: H01L23/34 ,  H01L23/053

    CPC classification number: H05K1/0243 ,  H01L2924/0002 ,  H05K3/3447 ,  H05K3/3452 ,  H05K2201/10075 ,  H05K2201/10287 ,  H05K2201/10462 ,  H05K2201/10583 ,  H05K2201/10969 ,  H01L2924/00

    Abstract: A printed circuit board with a quartz crystal oscillator includes a mounting area for receiving the quartz crystal oscillator, two first vias, and two second vias. A copper foil is arranged on the mounting area. Pins of the quartz crystal oscillator are inserted into the first vias. The second vias are connected to a ground layer of the PCB and communicate with the copper foil, for transmitting noise of the quartz crystal oscillator to the ground layer of the PCB.

    Abstract translation: 具有石英晶体振荡器的印刷电路板包括用于接收石英晶体振荡器的安装区域，两个第一通孔和两个第二通孔。 铜箔布置在安装区域上。 将石英晶体振荡器的引脚插入第一通孔中。 第二通孔连接到PCB的接地层，并与铜箔连通，将石英晶体振荡器的噪声传递到PCB的接地层。

    Coil unit, method of manufacturing the same, and electronic instrument
    29.
    发明申请
    Coil unit, method of manufacturing the same, and electronic instrument 有权
    线圈单元，制造方法和电子仪器

    公开(公告)号：US20080197960A1

    公开(公告)日：2008-08-21

    申请号：US12071256

    申请日：2008-02-19

    Applicant: Minoru Hasegawa ,  Masao Kuroda

    Inventor： Minoru Hasegawa ,  Masao Kuroda

    IPC: H01F27/30 ,  H05K3/32

    CPC classification number: H05K1/182 ,  H01F27/22 ,  H01F27/2871 ,  H01F27/292 ,  H01F27/306 ,  H01F38/14 ,  H01F41/04 ,  H05K2201/086 ,  H05K2201/1003 ,  H05K2201/10462 ,  H05K2203/1311 ,  Y10T29/49078

    Abstract: A coil unit includes a planar coil, a printed circuit board that includes a planar coil placement section that receives the planar coil, a protective sheet that is provided on a transmission side of the planar coil and protects the planar coil, and a magnetic sheet that is provided on a non-transmission side of the planar coil. The planar coil is placed in the planar coil placement section and is electrically connected to the printed circuit board. The planar coil placement section has a shape that corresponds to an external shape of the planar coil.

    Abstract translation: 线圈单元包括平面线圈，印刷电路板，其包括容纳平面线圈的平面线圈放置部，设置在平面线圈的发送侧并保护平面线圈的保护片，以及​​保护片， 设置在平面线圈的非发送侧。 平面线圈被放置在平面线圈放置部分中并且电连接到印刷电路板。 平面线圈放置部具有与平面线圈的外形对应的形状。

    Thermally Conductive Low Profile Bonding Surfaces
    30.
    发明申请
    Thermally Conductive Low Profile Bonding Surfaces 审中-公开
    导热薄型结合面

    公开(公告)号：US20080107867A1

    公开(公告)日：2008-05-08

    申请号：US11935352

    申请日：2007-11-05

    Applicant: Fred Miekka

    Inventor： Fred Miekka

    IPC: B32B3/00

    CPC classification number: H05K1/0203 ,  H05K1/111 ,  H05K3/0061 ,  H05K3/321 ,  H05K3/341 ,  H05K3/386 ,  H05K2201/0215 ,  H05K2201/0373 ,  H05K2201/062 ,  H05K2201/083 ,  H05K2201/10166 ,  H05K2201/10462 ,  H05K2201/10969 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T428/24355

    Abstract: Low profile circuit boards having heat dissipative properties are disclosed having numerous discrete heat dissipating bonding zones. These electric circuit boards help dissipate heat from individual components such as transistors. Thermally conductive protrusions that may have an ultra low profile may be employed to promote bonding and remove heat. The resulting circuit boards are compact and have good heat dissipating properties. The ultra low profile protrusions disclosed in the present invention may also be used in other applications as well.

    Abstract translation: 公开了具有散热特性的薄型电路板，其具有许多分散的散热接合区域。 这些电路板有助于从单个组件（如晶体管）散发热量。 可以使用可能具有超低轮廓的导热突起来促进结合并除去热。 所得到的电路板是紧凑的并且具有良好的散热性能。 本发明中公开的超低轮廓突起也可以用于其他应用中。

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