公开(公告)号：US4990817A

公开(公告)日：1991-02-05

申请号：US880317

申请日：1986-06-30

Applicant: Mitsuro Hamuro

Inventor： Mitsuro Hamuro

IPC: H03H9/02 ,  H01C1/02 ,  H01G2/02 ,  H01G4/28 ,  H01L41/053 ,  H03H9/10 ,  H05K3/30 ,  H05K3/34

CPC classification number: H03H9/1021 ,  H05K3/303 ,  H05K2201/10568 ,  H05K2201/10583 ,  H05K2201/2036 ,  H05K3/305 ,  H05K3/3431 ,  Y02P70/613

Abstract: A chip type electronic part which comprises a chip main body of a cylindrical external shape having a circular cross section, and cap terminals also of a circular cross section applied onto opposite ends of the chip main body. The chip main body is covered, on its side peripheral face not applied with the cap terminals, by an outer covering member having a rectangular cross section, with an interval between a side face of the outer covering member and a corresponding side face of each of the cap terminals being set within a range of +0.2 mm to -0.2 mm.

Abstract translation: 一种芯片型电子部件，包括具有圆形横截面的圆柱形外形的芯片主体和也被施加到芯片主体的相对端的圆形横截面的盖子端子。 芯片主体在其侧面未被盖端子覆盖的外侧覆盖部件具有矩形横截面，外侧部件的侧面与相应的侧面 盖端子设置在+ 0.2mm至-0.2mm的范围内。

公开(公告)号：US4968377A

公开(公告)日：1990-11-06

申请号：US263446

申请日：1988-10-27

Applicant: Georg Sillner

Inventor： Georg Sillner

IPC: B29C31/00 ,  B29C70/72 ,  H05K3/30 ,  H05K3/34 ,  H05K5/00

CPC classification number: B29C70/72 ,  B29C31/008 ,  H05K3/3442 ,  H05K5/0095 ,  H05K2201/10568 ,  H05K2201/10583 ,  H05K2201/10916 ,  H05K3/301 ,  Y02P70/613 ,  Y10T29/49098 ,  Y10T29/49146 ,  Y10T29/49172 ,  Y10T29/49176

Abstract: A process for transforming a cylindrical electrical part into a component having at least one flat surface, suitable for use as a surface mounted device.

Abstract translation: 一种用于将圆柱形电气部件转换成具有至少一个平坦表面的部件的方法，适合用作表面安装装置。

公开(公告)号：US4493137A

公开(公告)日：1985-01-15

申请号：US533399

申请日：1983-09-19

Applicant: Leonhard Bader ,  Ferdinand Hermann ,  Wilhelm Ruprich ,  Hermann Winter

Inventor： Leonhard Bader ,  Ferdinand Hermann ,  Wilhelm Ruprich ,  Hermann Winter

IPC: B06B1/06 ,  B41J2/14 ,  H05K1/18 ,  H05K3/40 ,  H04R17/00

CPC classification number: B41J2/1429 ,  B06B1/0655 ,  H05K1/184 ,  H05K2201/10083 ,  H05K2201/10583 ,  H05K3/4046 ,  Y10T29/42

Abstract: Described is a piezoelectric drive element assembly for use in ink jet printer devices. The assembly comprises a piezoelectric drive element, which is characterized by a pair of electrodes spaced apart and thereby electrically isolated from one another on an external lateral face of the drive element. The assembly further includes a printed circuit board having holes through which the drive element is fitted, with the electrodes of the drive element being soldered to opposite sides of the printed circuit board.

Abstract translation: 描述了一种用于喷墨打印机设备的压电驱动元件组件。 组件包括压电驱动元件，其特征在于一对间隔开的电极，从而在驱动元件的外侧面上彼此电隔离。 组件还包括具有孔的印刷电路板，驱动元件被安装在该孔中，驱动元件的电极被焊接到印刷电路板的相对侧。

公开(公告)号：US3529212A

公开(公告)日：1970-09-15

申请号：US3529212D

申请日：1967-12-26

Applicant: CORNING GLASS WORKS

Inventor： BALLARD ROBERT A

IPC: H05K1/18

CPC classification number: H05K1/184 ,  H05K2201/0397 ,  H05K2201/09981 ,  H05K2201/10166 ,  H05K2201/1031 ,  H05K2201/10583 ,  H05K2201/10636 ,  Y02P70/611

公开(公告)号：US2613252A

公开(公告)日：1952-10-07

申请号：US77564947

申请日：1947-09-23

Applicant: ERIE RESISTOR CORP

Inventor： HEIBEL JEROME D

IPC: H01R12/70 ,  H05K3/20 ,  H05K3/32

CPC classification number: H05K3/202 ,  H01R12/7076 ,  H05K3/326 ,  H05K2201/09418 ,  H05K2201/10583 ,  H05K2201/1059 ,  H05K2203/063 ,  Y10T156/1056

公开(公告)号：US09978725B2

公开(公告)日：2018-05-22

申请号：US14903834

申请日：2014-07-08

Applicant: PSI CO., LTD.

Inventor： Young Rag Do

IPC: H01L25/075 ,  H01L33/62 ,  H05K1/02 ,  H05K3/28 ,  H01L33/50 ,  H05K1/11 ,  H05K3/34

CPC classification number: H01L25/0753 ,  H01L33/504 ,  H01L33/507 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/0295 ,  H05K1/0296 ,  H05K1/111 ,  H05K3/28 ,  H05K3/3442 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09427 ,  H05K2201/09954 ,  H05K2201/10106 ,  H05K2201/10583 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2203/048 ,  Y02P70/611 ,  H01L2924/00

Abstract: Provided is an LED lamp using a nano-scale LED electrode assembly. The LED lamp using the nano-scale LED electrode assembly may solve limitations in which, when a nano-scale LED device according to the related art stands up and is three-dimensionally coupled to an electrode, it is difficult to allow the nano-scale LED device to stand up, and when the nano-scale LED devices are coupled to one-to-one correspond to electrodes different from each other, product quality is deteriorated. Thus, the nano-scale LED device having a nano unit may be connected to the two electrodes different from each other without causing defects, and light extraction efficiency may be improved due to the directivity of the nano-scale LED devices connected to the electrodes. Furthermore, deterioration in function of the LED lamp due to the defects of a portion of the nano-scale LEDs provided in the LED lamp may be minimized, and the LED lamp may have a flexible structure and shape by using the nano-scale LED electrode assembly of which a portion is deformable according to the used purpose or position of the LED lamp.

公开(公告)号：US09978486B2

公开(公告)日：2018-05-22

申请号：US15410409

申请日：2017-01-19

Applicant: Fluke Corporation

Inventor： Mark Steven Buckner ,  Steven Wayne Higgins ,  Donald A. Gessling ,  Bryan Charles Hoog ,  Michael A. Schoch

IPC: H05B3/00 ,  H05K3/30 ,  H05K7/12 ,  H01B17/00 ,  H05K1/14 ,  H05K1/00 ,  H05K1/18 ,  H05K7/00 ,  H01C3/10 ,  H01C7/22 ,  H01C13/02

CPC classification number: H01C13/02 ,  H01C1/01 ,  H01C1/082 ,  H05K1/181 ,  H05K3/301 ,  H05K2201/10022 ,  H05K2201/10227 ,  H05K2201/10409 ,  H05K2201/10583 ,  H05K2201/10606

Abstract: A resistor support assembly includes first, second, third, and fourth support members. Each of the first and second support members includes one or more resistor contact regions and apertures extending therethrough. Each third support member is at least partially disposed within one of the apertures of one of the first support members and one of the apertures of one of the second support members. Recesses may be formed in the resistor contact regions of the first and the second support members, and one or more load resistors may be at least partially disposed within the recesses. The resistor support assembly may be used to mount one or more load resistors to a printed circuit board, without obstructing airflow through hollow portions of the load resistors. To reduce parasitic capacitance and inductance, the first support members and the second support members are formed from non-conductive materials.

公开(公告)号：US09750139B2

公开(公告)日：2017-08-29

申请号：US15172744

申请日：2016-06-03

Applicant: CIRCOR AEROSPACE, INC.

Inventor： Brent Salamone

IPC: H05K1/18

CPC classification number: H05K1/181 ,  H05K1/0269 ,  H05K3/301 ,  H05K3/3426 ,  H05K3/3468 ,  H05K2201/10583 ,  H05K2201/10651 ,  H05K2201/10765

Abstract: A housing, for surface-mount technology (SMT), accepts any electronics package that is mounted on a circular substrate. The housing including the assembled electronics package forms an SMT housing assembly. The SMT housing assembly is placed directly onto the surface of a printed circuit board (PCB). The SMT housing assembly is soldered to the PCB using standard soldering techniques, establishing an electrical connection between the electronics package and the PCB.

公开(公告)号：US09564698B2

公开(公告)日：2017-02-07

申请号：US14714916

申请日：2015-05-18

Applicant: Autoliv ASP, Inc.

Inventor： Boris G. Karasik ,  William M. Leach

IPC: H05K7/12 ,  H01R12/70 ,  H05K1/18

CPC classification number: H01R12/7076 ,  H01R12/724 ,  H01R13/719 ,  H05K1/18 ,  H05K3/301 ,  H05K3/306 ,  H05K3/308 ,  H05K2201/10015 ,  H05K2201/10446 ,  H05K2201/10462 ,  H05K2201/105 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/10962

Abstract: An assembly provides a dual function for mounting a port connector on a circuit board and also secures a capacitor to the circuit board. The assembly includes the circuit board and a monolithic plastic frame having a flange, a snap structure, a capacitor cradle, and a socket section. The flange has a fastening structure for fastening the frame to the circuit board. The snap structure for a snap-in attachment of the port connector to the frame is arranged near an end edge of the circuit board. The capacitor cradle for holding a cylindrical capacitor is formed adjacent to the snap structure and is elevated from the circuit board by an air gap. The socket section bears socket contacts for receiving capacitor contact leads.

Abstract translation: 组件提供了用于将端口连接器安装在电路板上并且还将电容器固定到电路板的双重功能。 组件包括电路板和具有凸缘，卡扣结构，电容器支架和插座部分的整体式塑料框架。 凸缘具有用于将框架紧固到电路板的紧固结构。 用于端口连接器到框架的卡扣附接的卡扣结构布置在电路板的端部边缘附近。 用于保持圆柱形电容器的电容器支架邻近卡扣结构形成，并且通过气隙从电路板升高。 插座部分用于接收电容器接触引线的插座触点。

公开(公告)号：US20160374214A1

公开(公告)日：2016-12-22

申请号：US15172744

申请日：2016-06-03

Applicant: CIRCOR AEROSPACE, INC.

Inventor： Brent SALAMONE

IPC: H05K5/00 ,  H05K5/02 ,  H05K1/18

CPC classification number: H05K1/181 ,  H05K1/0269 ,  H05K3/301 ,  H05K3/3426 ,  H05K3/3468 ,  H05K2201/10583 ,  H05K2201/10651 ,  H05K2201/10765

Abstract: The present invention provides a housing for surface-mount technology (SMT). In particular, the housing accepts any electronics package that is mounted on a circular substrate. The housing including the assembled electronics package forms an SMT housing assembly. The SMT housing assembly is placed directly onto the surface of a printed circuit board (PCB). The SMT housing assembly is soldered to the PCB using standard soldering techniques, establishing an electrical connection between the electronics package and the PCB.

Abstract translation: 本发明提供了一种用于表面贴装技术（SMT）的外壳。 特别地，壳体接受安装在圆形基板上的任何电子封装。 包括组装的电子封装的外壳形成一个SMT外壳组件。 SMT外壳组件直接放置在印刷电路板（PCB）的表面上。 SMT外壳组件使用标准焊接技术焊接到PCB，建立电子封装和PCB之间的电气连接。