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    Electronic component
    21.
    发明授权
    Electronic component 失效
    电子元器件

    公开(公告)号：US5166570A

    公开(公告)日：1992-11-24

    申请号：US711781

    申请日：1991-06-07

    Applicant: Hiroyuki Takahashi

    Inventor： Hiroyuki Takahashi

    IPC: H01G2/06 ,  H03H9/10 ,  H05K1/02 ,  H05K3/30 ,  H05K3/34

    CPC classification number: H01G2/06 ,  H03H9/0528 ,  H03H9/1042 ,  H05K3/308 ,  H05K1/0271 ,  H05K2201/10651 ,  H05K2201/10696 ,  H05K2201/10871 ,  H05K3/3447

    Abstract: A radial lead type electronic component includes a couple of plate-type lead terminals projecting from a protective resin member in the same direction. These lead terminals are provided with inclined edges, which make the body portions gradually narrowed toward leg portions, in leg-side edges of body portions. Among inclined edges, inclinations .theta..sub.1 of the outer ones with respect to the leg-projecting direction are greater than inclinations .theta..sub.2 of the inner ones with respect to the same direction. Thus, the electronic component is relieved from stresses which are applied thereto upon insertion in a printed circuit board or a cut-and-clinch operation.

    Abstract translation: 径向引线型电子部件包括从相同方向从保护性树脂部件突出的一对板状引线端子。 这些引线端子设置有倾斜的边缘，这使得主体部分在主体部分的腿侧边缘中朝向腿部逐渐变窄。 在倾斜边缘中，外侧相对于腿部伸出方向的倾斜度θ1大于相对于相同方向的内侧倾斜度θ2。 因此，电子元件在插入印刷电路板或切割和钳制操作中时被施加到其上的应力消除。

    Surface mounted single in-line electronic component package with mounting projections and chamfered viewing edge
    22.
    发明授权
    Surface mounted single in-line electronic component package with mounting projections and chamfered viewing edge 失效
    表面安装的单列直插电子元件封装，带安装突起和倒角观察边

    公开(公告)号：US5032953A

    公开(公告)日：1991-07-16

    申请号：US567601

    申请日：1990-08-15

    Applicant: Robert L. Carl ,  Ka K. Wai ,  Jose L. V. Ortega

    Inventor： Robert L. Carl ,  Ka K. Wai ,  Jose L. V. Ortega

    IPC: H05K3/30 ,  H05K5/00

    CPC classification number: H05K3/303 ,  H05K5/0091 ,  H05K2201/10454 ,  H05K2201/10568 ,  H05K2201/10696 ,  H05K2201/2036 ,  Y02P70/613

    Abstract: A single in-line package adapted for surface mounting to a printed circuit board comprises an electronic component, a plurality of leads and a specially configured housing that encloses and protects the electronic component. The outer ends of the leads extend adjacent a tapered lower edge of the housing. The housing further has projections for engaging the upper surface of a printed circuit board to maintain the housing in a stable upright orientation with the outer ends of the leads in physical contact with corresponding solder pads on the printed circuit board during solder re-flow. The tapered edge of the housing is configured to permit subsequent inspection of a plurality of resulting solder joints for acceptable whetting.

    Abstract translation: 适用于表面安装到印刷电路板的单个在线封装包括封装和保护电子部件的电子部件，多个引线和特别配置的壳体。 引线的外端在壳体的锥形下边缘附近延伸。 壳体还具有用于接合印刷电路板的上表面的突起，以在焊料重新流动期间使引线的外端与印刷电路板上的相应焊盘物理接触，从而将壳体保持在稳定的垂直取向。 壳体的锥形边缘构造成允许随后检查多个所得到的焊点以获得可接受的磨擦。

    Semiconductor device
    23.
    发明授权
    Semiconductor device 失效
    半导体器件

    公开(公告)号：US4951124A

    公开(公告)日：1990-08-21

    申请号：US346353

    申请日：1989-04-28

    Applicant: Hiromichi Sawaya

    Inventor： Hiromichi Sawaya

    IPC: H01L23/50 ,  H01L23/34 ,  H01L23/433 ,  H01L23/495 ,  H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H05K7/20

    CPC classification number: H01L23/49548 ,  H01L23/4334 ,  H05K3/308 ,  H01L2924/0002 ,  H05K1/0201 ,  H05K2201/066 ,  H05K2201/09709 ,  H05K2201/0979 ,  H05K2201/10696 ,  H05K2201/10787 ,  H05K2201/10856 ,  H05K2201/10871 ,  H05K3/3447

    Abstract: A single in line type semiconductor device is disclosed which has a plurality of lead-in wires extending from a package. In this semiconductor device, a heat sink is embedded in one surface of the package and an appropriate number of lead-in wires are bent on the other surface side of the package, to provide an offset array of the lead-in wires arranged in two rows. A projection is formed on the above appropriate number of lead-in wires on one surface side of the package, such that it extends in a direction perpendicular to that in which the lead-in wires extend. In this semi-conductor device, when the external lead-in wires are inserted into, and joined by means of soldering to a printed circuit board, the package is prevented from being inclined toward the heat sink side by the projection of the external lead-in wire, so that it may be set upright relative to the printed circuit board.

    Abstract translation: 公开了一种在线型半导体器件，其具有从封装延伸的多个引入线。 在该半导体器件中，散热器嵌入在封装的一个表面中，并且适当数量的引入线在封装的另一个表面侧弯曲，以提供布置在两个中的引入线的偏移阵列 行。 在包装的一个表面侧的上述合适数量的引入线上形成突起，使得其沿与引入线延伸的方向垂直的方向延伸。 在这种半导体器件中，当外部引入线插入印刷电路板并通过焊接连接到印刷电路板时，通过外部引线装置的突出部防止封装向散热器侧倾斜， 在线中，使得其可以相对于印刷电路板竖立。

    Single-in-line type semiconductor device
    24.
    发明授权
    Single-in-line type semiconductor device 失效
    单列式半导体器件

    公开(公告)号：US4807087A

    公开(公告)日：1989-02-21

    申请号：US121955

    申请日：1987-11-18

    Applicant: Hiromichi Sawaya

    Inventor： Hiromichi Sawaya

    IPC: H01L23/00 ,  H01L23/495 ,  H01L23/50 ,  H05K1/02 ,  H05K3/30 ,  H05K1/16

    CPC classification number: H01L23/49548 ,  H01L23/49541 ,  H05K3/308 ,  H01L2924/0002 ,  H05K1/0201 ,  H05K2201/066 ,  H05K2201/09709 ,  H05K2201/10696 ,  H05K2201/10871

    Abstract: Disclosed herewith is a single in-line type semiconductor device having external leads drawn out from a package in staggered fashion. According to the single in-line type semiconductor device of this invention, a narrow portion to be fitted in an opening formed in a printed circuit board is provided at each of first and second external leads, with the remaining portion of each external lead constituting a wide portion. The first and second external leads are each provided with a positioning portion defined by the narrow and wide portions. The linear distance between one edge portion of the package and the positioning portion of each first external lead is equal to the linear distance between the edge portion of the package and the positioning portion of each second external lead.

    Abstract translation: 这里公开了一种具有从封装以交错方式引出的外部引线的单列直插型半导体器件。 根据本发明的单列直线型半导体器件，在第一外部引线和第二外部引线中的每一个上设置要装配在印刷电路板中形成的开口中的窄部分，每个外部引线的剩余部分构成 宽的部分。 第一和第二外部引线各自设置有由狭窄部分限定的定位部分。 封装的一个边缘部分和每个第一外部引线的定位部分之间的线性距离等于封装的边缘部分和每个第二外部引线的定位部分之间的直线距离。

    Fastener for holding SIPs on PC boards during soldering
    26.
    发明授权
    Fastener for holding SIPs on PC boards during soldering 失效
    用于在焊接时在PC板上固定SIP的紧固件

    公开(公告)号：US4588177A

    公开(公告)日：1986-05-13

    申请号：US714725

    申请日：1985-03-22

    Applicant: Paul K. White

    Inventor： Paul K. White

    IPC: H05K3/30 ,  H05K3/34 ,  H05K7/12 ,  B25B1/20

    CPC classification number: H05K3/301 ,  H05K7/12 ,  H05K2201/10393 ,  H05K2201/10696 ,  H05K3/3447 ,  Y10S269/903

    Abstract: A fastener for temporarily holding a SIP in place as it is soldered into a printed circuit board comprises a planar piece of unsolderable material having a body with a slot which is adapted to slip over and hold the SIP; the planar piece of material also has a leg which extends from the body; and the leg has an end section which is parallel to the slot and is adapted to press fit into an unplated anchor hole that goes perpendicular through the board to orient the slot and SIP perpendicular to the board.

    Abstract translation: 用于在将其焊接到印刷电路板中时将SIP临时保持在适当位置的紧固件包括具有适于滑过并保持SIP的槽的具有主体的不可焊材料的平面片; 平面材料片还具有从主体延伸的腿部; 并且所述腿部具有平行于所述狭槽的端部，并且适于压配合到垂直于所述板的未平坦的锚定孔中，以使所述槽和SIP垂直于所述板定向。

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