公开(公告)号：US10106895B2

公开(公告)日：2018-10-23

申请号：US15474760

申请日：2017-03-30

Applicant: KING SAUD UNIVERSITY

Inventor： Ali A. Alshatwi ,  Jegan Athinarayanan ,  Vaiyapuri Subbarayan Periasamy

IPC: H01B1/02 ,  C23C18/44 ,  C01B31/02 ,  C23C18/16 ,  B82Y40/00 ,  B82Y5/00 ,  B82Y15/00 ,  B82Y30/00

Abstract: The method for producing noble metal nanocomposites involves reducing noble metal ions (Ag, Au and Pt) on graphene oxide (GO) or carbon nanotubes (CNT) by using Artocarpus integer leaves extract as a reducing agent. As synthesized MNPs/GO and MNPs/CNT composites have been characterized using X-ray diffraction (XRD), transmission electron microscope (TEM) imaging, and energy dispersive X-ray spectroscopy (EDX). The TEM images of prepared materials showed that the nanocomposites were 1-30 nm in size with spherical nanoparticles embedded on the surface of GO and CNT. This synthetic route is easy and rapid for preparing a variety of nanocomposites. The method avoids use of toxic chemicals, and the prepared nanocomposites can be used for biosensor, fuel cell, and biomedical applications.

公开(公告)号：US09991522B2

公开(公告)日：2018-06-05

申请号：US14769988

申请日：2014-01-22

Applicant: NISSAN MOTOR CO., LTD.

Inventor： Kazuki Arihara ,  Hiroyuki Tanaka

IPC: H01M4/92 ,  H01M4/88 ,  C23C18/16 ,  C23C18/44 ,  H01M4/86 ,  H01M4/90

CPC classification number: H01M4/92 ,  C23C18/1637 ,  C23C18/44 ,  H01M4/8657 ,  H01M4/8842 ,  H01M4/9041 ,  H01M4/9058 ,  H01M4/9075 ,  H01M4/926

Abstract: A catalyst particle (1) for a fuel cell according to the present invention includes: a metal particle (2) composed of either one of metal other than noble metal and an alloy of the metal other than the noble metal and the noble metal; and a noble metal layer (3) that is provided on a surface of the metal particle and has a thickness of 1 nm to 3.2 nm. By the fact that the catalyst particle for a fuel cell has such a configuration, the catalyst particle can enhance catalytic activity while reducing an amount of the noble metal. The catalyst particle (1) for a fuel cell according to the present invention can enhance the catalytic activity while reducing the amount of the noble metal.

公开(公告)号：US09949374B2

公开(公告)日：2018-04-17

申请号：US14760758

申请日：2014-02-04

Applicant: Mitsubishi Electric Corporation

Inventor： Yohei Takemoto ,  Shiro Sekino ,  Yuta Kaihatsu ,  Hiromi Yamanaka

IPC: B05D3/10 ,  H05K3/18 ,  C23C18/18 ,  C23C18/16 ,  C23C18/54 ,  C23C18/44 ,  C23C18/36 ,  H05K1/03 ,  H05K1/09

CPC classification number: H05K3/185 ,  C23C18/1639 ,  C23C18/1651 ,  C23C18/1844 ,  C23C18/1886 ,  C23C18/36 ,  C23C18/44 ,  C23C18/54 ,  H05K1/0306 ,  H05K1/092

Abstract: Provided is an electroless plating method for a low temperature co-fired glass ceramic substrate, the method including: a degreasing and activation treatment step of degreasing and activating a surface of a wiring pattern formed of a silver sintered body; a catalyzing step of providing a catalyst onto the surface of the wiring pattern formed of a silver sintered body; and an electroless multi-layered coating plating treatment step. The electroless plating method further includes, between the degreasing and activation treatment step and the catalyzing step, a silver precipitation treatment step of precipitating silver on a glass component present on the surface of the wiring pattern formed of a silver sintered body after the degreasing and activation treatment step, and the catalyzing step includes providing the catalyst also to the silver precipitated in the silver precipitation treatment step.

公开(公告)号：US09828678B2

公开(公告)日：2017-11-28

申请号：US13497115

申请日：2010-09-20

Applicant: Frederic Fouda-Onana ,  Nicolas Guillet

Inventor： Frederic Fouda-Onana ,  Nicolas Guillet

IPC: C23C18/44 ,  C25D5/02 ,  C25D5/54 ,  C23C18/16 ,  C25D3/50 ,  H01M4/88

CPC classification number: C23C18/44 ,  C23C18/1644 ,  C23C18/165 ,  C25D3/50 ,  C25D5/02 ,  C25D5/54 ,  H01M4/8807 ,  H01M4/8842 ,  H01M4/8853

Abstract: The invention relates to a method for depositing a metal M1 onto a carbon layer, as well as to a method for manufacturing an electrode for fuel cells and to a method for manufacturing a fuel cell. The method for depositing a metal M1 onto a porous carbon layer according to the invention includes a step of depositing said metal M1 by means of the electrochemical reduction of an electrolytic solution of a salt of the metal M1, and, prior to said step of depositing the metal M1 by means of electrochemical reduction, a step of depositing a metal M2 by means of chemical reduction using a reducing gas of a salt of the metal M2, the thermodynamic equilibrium potential between the ionic form of the salt of M2 and M2, Eeqionic form of the salt of M2/M2 being greater than the thermodynamic equilibrium potential between the ionic form of the salt of M1 and M1, Eeqionic form of the salt of M1/M1. The invention can be used, in particular, in the field of fuel cells.

公开(公告)号：US20170321327A1

公开(公告)日：2017-11-09

申请号：US15522321

申请日：2015-12-17

Applicant: Atotech Deutschland GmbH

Inventor： Thomas BECK ,  Gerhard STEINBERGER ,  Andreas WALTER

IPC: C23C18/44 ,  C23C18/16

CPC classification number: C23C18/44 ,  C23C18/1646

Abstract: The present invention relates to an aqueous plating bath composition and a method for depositing a palladium layer by electroless plating onto a substrate. The aqueous plating bath composition according to the present invention comprises a source for palladium ions, a reducing agent for palladium ions and an aldehyde compound. The aqueous plating bath composition has an increased deposition rate for palladium while maintaining bath stability. The aqueous plating bath composition has also a prolonged life time. The aldehyde compounds of the present invention allow for adjusting the deposition rate to a constant range over the bath life time and for electrolessly depositing palladium layers at lower temperatures. The aldehyde compounds of the present invention activate electroless palladium plating baths having a low deposition rate and reactivate aged electroless palladium plating baths.

公开(公告)号：US09719183B2

公开(公告)日：2017-08-01

申请号：US14414570

申请日：2013-05-14

Applicant: Kanto Gakuin School Corporation ,  JCU CORPORATION

Inventor： Christopher Cordonier ,  Hideo Honma

IPC: C25D3/48 ,  C25D3/02 ,  C23C18/44 ,  C23C18/31

CPC classification number: C25D3/48 ,  C23C18/31 ,  C23C18/44

Abstract: A non-cyanide gold plating bath 1 contains gold ions and a compound represented by the following chemical formula (chem 1):

公开(公告)号：US20170127515A1

公开(公告)日：2017-05-04

申请号：US15400218

申请日：2017-01-06

Applicant: RAMOT AT TEL-AVIV UNIVERSITY LTD

Inventor： Gil MARKOVICH ,  Daniel AZULAI ,  Olga KRICHEVSKI

IPC: H05K1/09 ,  C23C18/40 ,  C23C18/44 ,  H01L29/786 ,  C23C18/16 ,  H01B1/02 ,  H05K1/02 ,  C23C18/34 ,  C23C18/48

CPC classification number: H05K1/09 ,  C23C18/14 ,  C23C18/166 ,  C23C18/1667 ,  C23C18/1676 ,  C23C18/34 ,  C23C18/40 ,  C23C18/44 ,  C23C18/48 ,  H01B1/02 ,  H01L29/786 ,  H05K1/0274 ,  H05K3/105 ,  H05K3/182 ,  H05K2201/0108 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/10121 ,  H05K2201/10128 ,  H05K2201/10166 ,  H05K2203/013 ,  H05K2203/1157 ,  H05K2203/125 ,  Y10T428/24917

Abstract: A conductive nanowire film having a high aspect-ratio metal is described. The nanowire film is produced by inducing metal reduction in a concentrated surfactant solution containing metal precursor ions, a surfactant and a reducing agent. The metal nanostructures demonstrate utility in a great variety of applications.

公开(公告)号：US09603258B2

公开(公告)日：2017-03-21

申请号：US14819150

申请日：2015-08-05

Applicant: UYEMURA INTERNATIONAL CORPORATION

Inventor： Jon E. Bengston

IPC: C23C18/16 ,  C23C18/44 ,  H05K3/18

CPC classification number: C23C18/44 ,  C23C18/1637 ,  C23C18/1651 ,  C23C18/54 ,  H05K1/09 ,  H05K1/118 ,  H05K3/187 ,  H05K3/244 ,  H05K2201/0338

Abstract: A solution comprising a palladium compound and a polyaminocarboxylic compound has been found to be suitable as a bath for electroless plating of palladium onto copper. Use of such a solution produces a plated component comprising a copper surface and a palladium plated coating having a thickness of between 0.01 micrometers (μm) and 5 μm. A method for electroless plating of palladium onto a copper surface of a component includes preparing a bath having a palladium compound and a polyaminocarboxylic compound. The copper component is submerged in the bath to plate a palladium layer on the copper surface of the component. The component resulting from the plating method has a palladium layer plated on the copper surface.

公开(公告)号：US09572252B2

公开(公告)日：2017-02-14

申请号：US14444135

申请日：2014-07-28

Applicant: TOPPAN PRINTING CO., LTD. ,  NATIONAL UNIVERSITY CORPORATION GUNMA UNIVERSITY

Inventor： Tetsuyuki Tsuchida ,  Toshikazu Okubo ,  Ikuo Shohji ,  Takahiro Kano

IPC: B05D5/12 ,  B28B19/00 ,  C23C18/00 ,  H01C17/06 ,  H05K3/00 ,  H05K1/09 ,  C23C18/36 ,  C23C18/44 ,  C23C18/16 ,  H05K3/24 ,  C23C18/50

CPC classification number: H05K1/09 ,  C23C18/1651 ,  C23C18/36 ,  C23C18/44 ,  C23C18/50 ,  H05K3/243 ,  H05K3/244 ,  H05K2201/032 ,  H05K2201/0776 ,  H05K2203/072

Abstract: A wiring substrate includes an electrode including Cu or a Cu alloy, and a plated film including an electroless nickel-plated layer formed on the electrode and an electroless gold-plated layer formed on the electroless nickel-plated layer. The electroless nickel-plated layer is formed by co-precipitation of Ni, P, Bi, and S, the electroless nickel-plated layer includes a content of P of 5% by mass or more and less than 10% by mass, a content of Bi of 1 ppm by mass to 1,000 ppm by mass, and a content of S of 1 ppm by mass to 2,000 ppm by mass, and a mass ratio of the content of S to the content of Bi (S/Bi) is more than 1.0.

Abstract translation: 布线基板包括包含Cu或Cu合金的电极和形成在电极上的化学镀镍层和形成在化学镀镍层上的化学镀金层的镀膜。 化学镀镍层通过Ni，P，Bi和S的共沉淀形成，无电镀镍层的P含量为5质量％以上且小于10质量％，含量 的Bi为1质量ppm〜1000质量ppm，S为1质量ppm〜2000质量ppm，S含量与Bi（S / Bi）含量的质量比为更多 比1.0。

公开(公告)号：US09499913B2

公开(公告)日：2016-11-22

申请号：US14243793

申请日：2014-04-02

Applicant: Lam Research Corporation

Inventor： Eugenijus Norkus ,  Ina Stankeviciene ,  Aldona Jagminiene ,  Loreta Tamasauskaite-Tamasiunaite ,  Aniruddha Joi ,  Yezdi Dordi

IPC: C23C18/44 ,  C23C18/16 ,  H01L21/288 ,  H01L21/768

CPC classification number: C23C18/44 ,  C23C18/166 ,  C23C18/168 ,  C23C18/1683 ,  H01L21/288 ,  H01L21/76849

Abstract: A solution for electroless deposition of platinum is provided. The solution comprises Co2+ ions, Pt4+ ions, and amine ligands. A ratio of Co2+ to Pt4+ ion is between 100:1 and 2:1. The solution allows for electroless deposition of platinum without requiring high temperatures and high pH. The solution allows for the deposition of a pure platinum layer.

Abstract translation: 提供了一种铂化学沉积的方法。 溶液包含Co2 +离子，Pt4 +离子和胺配体。 Co2 +与Pt4 +离子的比例在100：1和2：1之间。 该溶液允许铂的无电沉积，而不需要高温和高pH。 该溶液允许沉积纯铂层。