Abstract:
A method for manufacturing a single crystal diamond in which vapor phase synthetic single crystal diamond is additionally deposited on a single crystal diamond seed substrate obtained by vapor phase synthesis, includes a step of measuring flatness of the seed substrate, a step of determining whether or not to flatten the seed substrate based on the measurement result of the flatness, and any one of the following two steps of a step of additionally depositing the vapor phase synthetic single crystal diamond after flattening the seed substrate for which the flattening is necessary based on the determination and a step of additionally depositing the vapor phase synthetic single crystal diamond without flattening the seed substrate for which the flattening is not necessary based on the determination.
Abstract:
A secure data storage apparatus capable of independently holding security information within a hardware device of the storage apparatus, and of implementing write prohibition and read prohibition of data is provided. As means for specifying security such as write prohibition/write inquiry/read prohibition/read inquiry for data of a given size or a given number of pieces of data, a storage component for holding security information is prepared in addition to a storage component for holding data. For each unit of storage of the storage component for holding data, corresponding security data is held in the storage component for holding security information. In this way, in response to occurrence of a request to access data, security information corresponding to a storage area for holding the data is referred to, and an operation is performed in accordance with the security information.
Abstract:
An n-type SiC layer is formed on a front face of an n+-type SiC substrate and plural p-type regions are selectively formed inside the n-type SiC layer. A p-type SiC layer is formed covering the surfaces of the n-type SiC layer and the p-type regions. An n-type region is formed inside the p-type SiC layer to be connected to the n-type SiC layer. An n+-type source region and a p+-type contact region are formed inside the p-type SiC layer, positioned away from the n-type region and in contact with each other. The n-type region in the p-type SiC layer is formed such that the width LJFET of the n-type region is within a range from 0.8 μm to 3.0 μm and the impurity concentration of the n-type region is greater than 1.0×1016 cm−3 and less than or equal to 5.0×1016 cm−3.
Abstract:
A silicon carbide powder for the production of a silicon carbide single crystal has an average particle diameter of 100 μm or more and 700 μm or less and a specific surface area of 0.05 m2/g or more and 0.30 m2/g or less. A method for producing a silicon carbide powder for the production of the silicon carbide single crystal including sintering a silicon carbide powder having an average particle diameter of 20 μm or less under pressure of 70 MPa or less at a temperature of 1900° C. or more and 2400° C. or less and in a non-oxidizing atmosphere, thereby obtaining a sintered body having a density of 1.29 g/cm3 or more; adjusting particle size by means of pulverization of the sintered body; and removing impurities by means of an acid treatment.
Abstract:
A light source circuit transmits light incident from a semiconductor laser source to a plurality of optical devices. At least one optical branch section is formed to branch one input-side optical waveguide at least into a first output-side optical waveguide terminal and a second output-side optical waveguide terminal. A light path length (L1) between the optical branch section and a next-stage optical branch section or the optical device is connected to the first output-side optical waveguide extending from the optical branch section and a light path length (L2) between the optical branch section and the next-stage optical branch section selected such that the absolute value of a difference between (L1) and (L2) is (¼+i/2) times (i is zero or a positive integer) the wavelength of the light transmitted through the light source circuit.
Abstract translation:光源电路将从半导体激光源入射的光透射到多个光学器件。 形成至少一个光分支部,至少将一个输入侧光波导分支到第一输出侧光波导端子和第二输出侧光波导端子。 光分支部分和下一级光分支部分或光学装置之间的光路长度(L1)连接到从光分支部分延伸的第一输出侧光波导和在光分支部分之间的光路长度(L2) 选择光分支部和下级光分支部,使得(L1)和(L2)之间的差的绝对值为(¼+ i / 2)倍(i为零或正整数) 光通过光源电路传输。
Abstract:
A metal complex exhibits blue light emission of high color purity and has a color purity of small temperature dependence, particularly in the blue region. Specifically, the metal complex is represented by Formula (1a): wherein M is a metal atom; R0 is a divalent linking group; each j independently represents 0 or 1; RP1, RP2, RP3, RP4 and RP6 each independently represents a hydrogen atom or the like; RP5 represents a halogen atom or the like; m is an integer of from 1 to 3, n is an integer of from 0 to 2, and m+n is 2 or 3; and the portion represented by Formula (2): represents a bidentate ligand; wherein Rx and Ry are an atom bonding to the metal atom M, and each independently represents a carbon atom, an oxygen atom or a nitrogen atom.
Abstract:
A magnetoresistance effect device including a multilayer structure having a pair of ferromagnetic layers and a barrier layer positioned between them, wherein at least one ferromagnetic layer has at least the part contacting the barrier layer made amorphous and the barrier layer is an MgO layer having a highly oriented texture structure.
Abstract:
To provide an I-V characteristic measuring apparatus that can, even though a solar simulator of a flash light type is used, accurately measure a true I-V characteristic of a solar cell that exhibits a different I-V characteristic depending on a sweep direction when a sweep time of applied voltage is short, an internal division ratio calculation part that, at each voltage value, calculates an internal division ratio at which a current value of a dark state stationary I-V characteristic internally divides a gap between a current value of a dark state forward I-V characteristic and a current value of a dark state reverse I-V characteristic; and a light state stationary I-V characteristic estimation and calculation part that, on the basis of the internal division ratio, a light state forward I-V characteristic, and a light state reverse I-V characteristic, estimates and calculates a light state stationary I-V characteristic are provided.
Abstract:
When injection of electrons into a sample supporting member causes a potential gradient between an insulative thin film and a conductive thin film at a site of electron beam injection, the potential barrier of the surface of the insulative thin film becomes thin, and an electron emission phenomenon is caused by tunnel effects. Secondary electrons caused in the insulative thin film tunnel to the conductive thin film along the potential gradient. The secondary electrons, having tunneled, reach a sample while diffusing in the conductive thin film. In the case where the sample is a sample with a high electron transmittance, such as a biological sample, the secondary electrons also tunnel through the interior of the sample. The secondary electrons are detected to acquire an SEM image in which the inner structure of the sample is reflected.
Abstract:
A lithium silicate-based compound according to the present invention is expressed by a general formula, Li(2−a+b)AaMn(1−x−y)CoxMySiO(4+α)Clβ (In the formula: “A” is at least one element selected from the group consisting of Na, K, Rb and Cs; “M” is at least one member selected from the group consisting of Mg, Ca, Al, Ni, Fe, Nb, Ti, Cr, Cu, Zn, Zr, V, Mo and W; and the respective subscripts appear to be as follows: 0≦“a”