公开(公告)号：US06632374B1

公开(公告)日：2003-10-14

申请号：US09675812

申请日：2000-09-28

Applicant: Michel A. Rosa ,  Eric Peeters

Inventor： Michel A. Rosa ,  Eric Peeters

IPC: B29D1100

CPC classification number: G02B6/3518 ,  B81B2201/045 ,  B81B2203/04 ,  B81C1/00666 ,  G02B6/3556 ,  G02B6/358 ,  G02B6/3584 ,  G02B26/0841

Abstract: Optical cross-connect systems involve the general concept of a two dimensional array of MEMS tilt mirrors being used to direct light coming from a first optical fiber to a second optical fiber. Each MEMS tilt mirror in the two dimensional array can tilt about two non-colinear axes and is suspended by a plurality of suspension arms attached to a silicon on insulator substrate.

Abstract translation: 光学交叉连接系统涉及用于将来自第一光纤的光引导到第二光纤的MEMS倾斜镜的二维阵列的一般概念。 二维阵列中的每个MEMS倾斜镜可以围绕两个非共线轴线倾斜，并且由连接到绝缘体上硅衬底上的多个悬架臂悬挂。

公开(公告)号：US20030173648A1

公开(公告)日：2003-09-18

申请号：US10099139

申请日：2002-03-16

Inventor： Jeffry Joseph Sniegowski ,  Murray Steven Rodgers

IPC: H01L029/06

CPC classification number: H01L23/544 ,  B81B2201/045 ,  B81C1/00873

Abstract: The present invention generally relates to a die perimeter region of a die having a microelectromechanical assembly fabricated thereon. This die perimeter region may be configured to facilitate electrically interconnecting adjacent die on a wafer. Moreover, this die perimeter region may be configured to facilitate separating the die from a wafer.

Abstract translation: 本发明一般涉及一种具有在其上制造的微机电组件的管芯的管芯周边区域。 该芯周边区域可以被配置为便于在晶片上电相互连接相邻的管芯。 此外，该模周边区域可以被配置为便于将模具与晶片分离。

公开(公告)号：US20030137389A1

公开(公告)日：2003-07-24

申请号：US10313621

申请日：2002-12-09

Applicant: 3M Innovative Properties Company

Inventor： Billy L. Weaver ,  Douglas P. Goetz ,  Kathy L. Hagen ,  Mike E. Hamerly ,  Robert G. Smith ,  Silva K. Theiss

IPC: H01H061/00

CPC classification number: B81B3/0024 ,  B81B3/0037 ,  B81B2201/031 ,  B81B2201/045 ,  B81B2203/0109 ,  B81B2203/0118 ,  B81B2203/058 ,  B82Y15/00 ,  H01H2061/006 ,  H01H2061/008

Abstract: A micrometer sized, single-stage, vertical thermal actuator with controlled bending capable of repeatable and rapid movement of a micrometer-sized optical device off the surface of a substrate. The vertical thermal actuator is constructed on a surface of a substrate. At least one hot arm has a first end anchored to the surface and a free end located above the surface. A cold arm has a first end anchored to the surface and a free end. The cold arm is located above the hot arm relative to the surface. The cold arm is adapted to provide controlled bending near the first end thereof. A member mechanically and electrically couples the free ends of the hot and cold arms such that the actuator bends generally at the flexure so that the member moves away from the substrate when current is applied to at least the hot arm.

Abstract translation: 具有受控弯曲的微米尺寸的单级垂直热致动器，其能够将微米尺寸的光学器件重复并快速移动离开衬底的表面。 垂直热致动器构造在基板的表面上。 至少一个热臂具有锚固在表面上的第一端和位于表面上方的自由端。 冷臂具有锚固在表面上的第一端和自由端。 冷臂相对于表面位于热臂上方。 冷臂适于在其第一端附近提供受控的弯曲。 机构和电气耦合热臂和冷臂的自由端，使得致动器大体上弯曲弯曲，使得当电流施加到至少热臂时，构件移动离开衬底。

公开(公告)号：US06583031B2

公开(公告)日：2003-06-24

申请号：US09915217

申请日：2001-07-25

Applicant: Chuang-Chia Lin

Inventor： Chuang-Chia Lin

IPC: H01L2130

CPC classification number: G02B6/3518 ,  B81B3/004 ,  B81B2201/045 ,  B81B2203/058 ,  B81C2201/053 ,  G02B6/3514 ,  G02B6/3546 ,  G02B6/3566 ,  G02B6/357 ,  G02B6/3572 ,  G02B6/358

Abstract: A microelectromechanical systems (MEMS) element, MEMS optical switch and MEMS fabrication method are described. The MEMS element comprises a crystalline and moveable element is moveably attached to the substrate. The moveable element includes a perpendicular portion oriented substantially perpendicular to a plane of the substrate. The crystal structure of the perpendicular portion and substrate are substantially similar. The moveable element moveable is moveably attached to the substrate for motion substantially constrained to a plane oriented substantially perpendicular to a plane of the substrate. In at least one position, a part of a perpendicular portion of the moveable element projects beyond a surface of the substrate. The moveable element may be retained in place by a latch. The perpendicular portion may be formed substantially perpendicular portion to the substrate. An array of such structures can be implemented to work as an optical switch. The optical switch may comprise a crystalline substrate and one or more moveable elements moveably attached to the substrate. The MEMS elements may be fabricated by providing a substrate; forming one or more trenches in the substrate to define a perpendicular portion of a element; and moveably attaching the moveable element to a first surface of the substrate; removing a portion of the substrate such that at least a part of the perpendicular portion projects beyond a second surface of the substrate. The various embodiments provide for a robust and reliable MEMS elements that may be simply fabricated and densely packed.

Abstract translation: 描述了微机电系统（MEMS）元件，MEMS光开关和MEMS制造方法。 MEMS元件包括可移动地附接到基底的结晶和可移动元件。 可移动元件包括垂直于基本垂直于基底平面的垂直部分。 垂直部分和基底的晶体结构基本相似。 可移动的可移动元件可移动地附接到基板，用于基本上约束到基本上垂直于基板的平面定向的平面的运动。 在至少一个位置中，可移动元件的垂直部分的一部分突出超过衬底的表面。 可移动元件可以通过闩锁保持在适当的位置。 垂直部分可以形成为基本上垂直于基底的部分。 可以实现这种结构的阵列以用作光学开关。 光学开关可以包括结晶衬底和可移动地附接到衬底的一个或多个可移动元件。 可以通过提供衬底来制造MEMS元件; 在所述衬底中形成一个或多个沟槽以限定元件的垂直部分; 以及将所述可移动元件可移动地附接到所述基板的第一表面; 去除所述基底的一部分，使得所述垂直部分的至少一部分突出超过所述基底的第二表面。 各种实施例提供了可以简单地制造和密集包装的鲁棒且可靠的MEMS元件。

公开(公告)号：US06552839B1

公开(公告)日：2003-04-22

申请号：US10104692

申请日：2002-03-21

Applicant: Yoon Shik Hong ,  Joon Seok Kang ,  Sang Kee Yoon ,  Sung Cheon Jung ,  Jung Hyun Lee ,  Hyun Kee Lee

Inventor： Yoon Shik Hong ,  Joon Seok Kang ,  Sang Kee Yoon ,  Sung Cheon Jung ,  Jung Hyun Lee ,  Hyun Kee Lee

IPC: G02B2600

CPC classification number: G02B6/358 ,  B81B3/0054 ,  B81B2201/045 ,  B81B2203/053 ,  G02B6/3514 ,  G02B6/3546 ,  G02B6/357 ,  G02B6/3584 ,  G02B26/0841 ,  H02N1/006

Abstract: Disclosed herein is an optical switch. The optical switch includes an electrostatic actuator and a substrate. The electrostatic actuator includes an electrostatic actuator, the electrostatic actuator comprising, a reciprocating mass located in the center of the electrostatic actuator, first rotating axes located symmetrically at the left and right sides of the reciprocating mass, first rotating masses rotatably connected to the first rotating axes, first rotating springs for supporting the first rotating masses, linear springs connected to the first rotating masses, second rotating masses connected to the linear springs, second rotating springs for supporting the second rotating masses, second rotating axes connected to the second rotating masses, structural anchors at the side ends of the actuator, drive electrodes, and a micro mirror movable by the same displacement as the reciprocating mass.

Abstract translation: 这里公开了一种光开关。 光开关包括静电致动器和基板。 所述静电致动器包括静电致动器，所述静电致动器包括位于所述静电致动器的中心的往复运动物质，位于所述往复运动质量块的左右两侧的第一旋转轴，所述第一旋转体可旋转地连接到所述第一旋转 轴，用于支撑第一旋转块的第一旋转弹簧，连接到第一旋转块的线性弹簧，连接到线性弹簧的第二旋转块，用于支撑第二旋转块的第二旋转弹簧，连接到第二旋转块的第二旋转轴， 在致动器的侧端处的结构锚固件，驱动电极和可与往复运动块相同位移的微反射镜。

公开(公告)号：US20030047533A1

公开(公告)日：2003-03-13

申请号：US10167272

申请日：2002-06-10

Applicant: REFLECTIVITY, INC., a California corporation

Inventor： Jason S. Reid ,  Nungavaram S. Viswanathan

IPC: C23F001/00 ,  C23C016/00

CPC classification number: B81C1/00476 ,  B81B2201/045 ,  B81C2201/0108 ,  B81C2201/112 ,  B81C2201/117 ,  B82Y30/00

Abstract: A method comprises depositing an organic material on a substrate; depositing additional material different from the organic material after depositing the organic material; and removing the organic material with a compressed fluid. Also disclosed is a method comprising: providing an organic layer on a substrate; after providing the organic layer, providing one or more layers of a material different than the organic material of the organic layer; removing the organic layer with a compressed fluid; and providing an anti-stiction agent with a compressed fluid to material remaining after removal of the organic layer.

Abstract translation: 一种方法包括在衬底上沉积有机材料; 在沉积有机材料之后沉积与有机材料不同的附加材料; 并用压缩流体除去有机材料。 还公开了一种方法，包括：在衬底上提供有机层; 在提供有机层之后，提供与有机层的有机材料不同的一层或多层材料; 用压缩流体去除有机层; 并且在去除有机层之后向剩余的材料提供具有压缩流体的抗静电剂。

公开(公告)号：US20030036215A1

公开(公告)日：2003-02-20

申请号：US10198389

申请日：2002-07-17

Applicant: REFLECTIVITY, INC., a Delaware Corporation

Inventor： Jason S. Reid

IPC: H01L021/00 ,  C23F001/00

CPC classification number: B81B3/0078 ,  B81B2201/045 ,  B81B2203/0118

Abstract: Micromechanical devices are provided that are capable of movement due to a flexible portion. The micromechanical device can have a flexible portion formed of an oxide of preferably an element from groups 3A to 6A of the periodic table (preferably from the first two rows of these groups) and a late transition metal (preferably from groups 8B or 1B of the periodic table). The micromechanical devices can be any device, particularly MEMS sensors or actuators preferably having a flexible portion such as an accelerometer, DC relay or RF switch, optical cross connect or optical switch, or a micromirror part of an array for direct view and projection displays. The flexible portion is preferably formed by sputtering a target having a group 8B or 1B element and a selected group 3A to 6A element, namely B, Al, In, Si, Ge, Sn, or Pb. The target can have other major constituents or impurities (e.g. additional group 3A to 6A element(s)). The target is reactively sputtered in a oxygen ambient so as to result in a sputtered hinge. It is possible to form both stiff and/or flexible portions of the micromechanical device in this way.

Abstract translation: 提供能够由于柔性部分而移动的微机械装置。 微机械装置可以具有柔性部分，该柔性部分由优选来自元素周期表3A〜6A族元素的氧化物（优选地来自这些基团的前两行）和后过渡金属（优选来自该组的第8B或1B族） 周期表）。 微机械装置可以是任何装置，特别是优选地具有诸如加速度计，DC继电器或RF开关，光交叉连接或光开关的柔性部分的MEMS传感器或致动器，或用于直视和投影显示器的阵列的微镜部分。 柔性部分优选通过溅射具有组8B或1B元素的靶和选定的3A至6A元素，即B，Al，In，Si，Ge，Sn或Pb来形成。 靶可以具有其它主要成分或杂质（例如另外的3A至6A族元素）。 目标物在氧气氛中反应溅射，以产生溅射铰链。 以这种方式可以形成微机械装置的刚性和/或柔性部分。

公开(公告)号：US20030021004A1

公开(公告)日：2003-01-30

申请号：US10025182

申请日：2001-12-19

Inventor： Shawn Jay Cunningham ,  Svetlana Tatic-Lucic ,  Dana R. DeReus

IPC: G02B026/00

CPC classification number: G02B26/0866 ,  B81B3/0051 ,  B81B7/0067 ,  B81B2201/038 ,  B81B2201/045 ,  B81B2201/047 ,  B81B2203/051 ,  B81C1/00182 ,  B81C2201/019 ,  B81C2203/0109 ,  G02B6/3512 ,  G02B6/353 ,  G02B6/3548 ,  G02B6/356 ,  G02B6/3566 ,  G02B6/357 ,  G02B6/3572 ,  G02B6/3576 ,  G02B6/3578 ,  G02B6/3582 ,  G02B6/3584 ,  G02B26/0841 ,  G02B26/085 ,  G02B26/0858 ,  H01H2001/0052 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: An optical MEMS device is fabricated in either a surface or bulk micromachining process wherein an integral process step entails providing an antireflective coating on one or more surfaces of a substrate through which optical information is to be transmitted. In one method, a surface micromachining process is carried out in which a sacrificial layer is formed and patterned on an optically transmissive substrate. A structural layer is formed on the sacrificial layer and fills in regions of the sacrificial layer that have been removed. An amount of the sacrificial layer is removed sufficient to define and release a microstructure and thereby render the microstructure movable for interaction with an optical signal directed toward the optically transmissive substrate. In another method, a bulk micromachining process is carried out in which a first substrate is provided that is composed of an optically transmissive material. An antireflective coating is deposited on a major surface of the first substrate to enable an optical signal to be transmitted along a path directed through the antireflective coating and the first substrate. A movable, actuatable microstructure is formed a second substrate. The first and second substrates are aligned and bonded together in a manner enabling the microstructure to interact with the optical signal upon actuation of the microstructure.

Abstract translation: 光学MEMS器件以表面或体积微加工工艺制造，其中整体工艺步骤需要在要传输光学信息的衬底的一个或多个表面上提供抗反射涂层。 在一种方法中，进行表面微加工工艺，其中在光学透射基底上形成牺牲层并图案化。 在牺牲层上形成结构层，并填充已被去除的牺牲层的区域。 牺牲层的量被去除足以限定和释放微结构，从而使微结构可移动以与指向光学透射基底的光信号相互作用。 在另一种方法中，进行体微加工工艺，其中提供由光学透射材料组成的第一衬底。 抗反射涂层沉积在第一基底的主表面上，以使得光信号沿着穿过抗反射涂层和第一基底的路径传输。 可移动的可致动微结构形成第二基板。 将第一和第二基板对准并结合在一起，使得微结构在致动微结构时能与光信号相互作用。

公开(公告)号：US20020197002A1

公开(公告)日：2002-12-26

申请号：US09891760

申请日：2001-06-25

Inventor： Chuang-Chia Lin

IPC: G02B006/35 ,  G02B026/00

CPC classification number: B81B3/0008 ,  B81B2201/045 ,  B81B2203/058 ,  G02B26/0841

Abstract: A method and apparatus are described for reducing stiction in a MEMS device having a movable element and a substrate. The method generally comprises providing the substrate with an anti-stiction member and interposing the anti-stiction member between the moveable element and the substrate. The apparatus generally comprises an anti-stiction member that is interposable between the moveable element and the substrate. Another embodiment of the invention of the invention is directed to a MEMS device, comprising: a substrate, a moveable element moveably coupled to the substrate, and an anti-stiction member that is interposable between the moveable element and the substrate. A further embodiment of the invention is directed to an optical switch having one or more moveable elements moveably coupled to a substrate, and an anti-stiction member that is interposable between at least one of the moveable elements and the substrate. The anti-stiction member may be in the form of a flexible cantilevered structure that overhangs the moveable element. Actuating the moveable element causes the anti-stiction member to flex and snap into place between the moveable element and the substrate. An additional embodiment of the invention is directed to a method of fabricating a MEMS device. The method proceeds by providing a silicon-on-insulator (SOI) substrate; defining a moveable element from a device layer of the SOI substrate; and depositing a flexible material over the device layer and the moveable element. One or more portions of the flexible material overhang the moveable element, whereby the flexible material forms one or more anti-stiction members.

Abstract translation: 描述了一种用于减小具有可移动元件和基板的MEMS器件中的静摩擦的方法和装置。 该方法通常包括向基板提供抗静电部件并将抗静电部件插入在可移动元件和基板之间。 该装置通常包括可移动元件和基板之间的抗静电构件。 本发明的另一个实施例涉及一种MEMS装置，其包括：基板，可移动地联接到基板的可移动元件以及可移动元件和基板之间的抗静电元件。 本发明的另一实施例涉及一种光开关，其具有可移动地耦合到基板的一个或多个可移动元件，以及可移动到至少一个可移动元件和基板之间的抗静电元件。 防静电构件可以是悬垂于可移动元件的柔性悬臂结构的形式。 激活可移动元件使得抗静电元件弯曲并卡入到​​可移动元件和基板之间的位置。 本发明的另一实施例涉及制造MEMS器件的方法。 该方法通过提供绝缘体上硅（SOI）衬底; 从SOI衬底的器件层限定可移动元件; 以及将柔性材料沉积在所述器件层和所述可移动元件上。 柔性材料的一个或多个部分伸出可移动元件，由此柔性材料形成一个或多个防静电构件。

公开(公告)号：US20020195423A1

公开(公告)日：2002-12-26

申请号：US10104109

申请日：2002-03-22

Applicant: REFLECTIVITY, INC.

Inventor： Satyadev R. Patel ,  Gregory P. Schaadt ,  Douglas B. MacDonald ,  Hongqin Shi ,  Andrew G. Huibers ,  Peter Heureux

IPC: C23F001/00 ,  B44C001/22 ,  C03C015/00 ,  C03C025/68

CPC classification number: B81C1/00 ,  B81B2201/045 ,  B81C1/00476 ,  B81C1/00531 ,  B81C1/00595 ,  B81C99/0025 ,  B81C2201/0138 ,  B82Y30/00 ,  H01L21/3065 ,  H01L21/3081 ,  H01L21/32135

Abstract: The etching of a material in a vapor phase etchant is disclosed where a vapor phase etchant is provided to an etching chamber at a total gas pressure of 10 Torr or more, preferably 20 Torr or even 200 Torr or more. The vapor phase etchant can be gaseous acid etchant, a noble gas halide or an interhalogen. The sample/workpiece that is etched can be, for example, a semiconductor device or MEMS device, etc. The material that is etched/removed by the vapor phase etchant is preferably silicon and the vapor phase etchant is preferably provided along with one or more diluents. Another feature of the etching system includes the ability to accurately determine the end point of the etch step, such as by creating an impedance at the exit of the etching chamber (or downstream thereof) so that when the vapor phase etchant passes from the etching chamber, a gaseous product of the etching reaction is monitored, and the end point of the removal process can be determined. The vapor phase etching process can be flow through, a combination of flow through and pulse, or recirculated back to the etching chamber. A first plasma or wet chemical etch (or both) can be performed prior to the vapor phase etch.

Abstract translation: 公开了在气相蚀刻剂中的材料的蚀刻，其中气蚀刻蚀刻剂以10托或更大，优选20托或甚至200托或更大的总气体压力提供给蚀刻室。 气相蚀刻剂可以是气态酸蚀刻剂，惰性气体卤化物或中间卤素。 被蚀刻的样品/工件可以是例如半导体器件或MEMS器件等。通过气相蚀刻剂蚀刻/去除的材料优选为硅，并且气相蚀刻剂优选与一个或多个 稀释剂。 蚀刻系统的另一特征包括能够精确地确定蚀刻步骤的终点，例如通过在蚀刻室的出口处（或其下游）处产生阻抗，使得当气相蚀刻剂从蚀刻室 ，监测蚀刻反应的气体产物，并且可以确定除去过程的终点。 气相蚀刻工艺可以流过，流过和脉冲的组合，或再循环回蚀刻室。 可以在气相蚀刻之前执行第一等离子体或湿化学蚀刻（或两者）。