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公开(公告)号:US20230228622A1
公开(公告)日:2023-07-20
申请号:US17576059
申请日:2022-01-14
Applicant: Ophir Optronics Solutions Ltd.
Inventor: Oleg Zinoviev , Karol Sanilevici , Alexandr Superfin
CPC classification number: G01J1/4257 , G01J1/0271 , G01J1/0407 , G01J1/0403
Abstract: The present application discloses an apparatus configured to measure characteristics of high power beams of laser energy used in material processing. In one embodiment, the apparatus includes a housing having a first compartment and a second compartment separated from each other to reduce the transfer of thermal energy between them. Optical modules having optical sensors configured to measure characteristics of the high power beam are mounted in the first compartment. An optical window operative to allow a significant portion of the beam to propagate therethrough is mounted in an intermediate housing member separating the first and second compartments. A removable and replaceable beam dump configured to absorb most of the high power beam is positioned in the second compartment. The removability/replaceability of the beam dump enables operation of the apparatus without active cooling of the beam dump assembly, simplifying the apparatus and protecting the optical sensors in the first compartment.
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公开(公告)号:US20190250032A1
公开(公告)日:2019-08-15
申请号:US16396491
申请日:2019-04-26
Inventor: Heinrich GRUEGER , Jens KNOBBE , Tino PUEGNER
CPC classification number: G01J3/0202 , B23K26/38 , G01J1/0252 , G01J1/0271 , G01J1/0403 , G01J1/0477 , G01J1/16 , G01J3/0256 , G01J3/0291
Abstract: Described are an apparatus and a method for manufacturing a three-dimensional body comprising mutually oriented devices. In accordance with the invention, a substrate having a first and a second substrate region is provided. A first device is provided in the first substrate region. A second device is provided in the first or in the second substrate region. The substrate is bent along at least one bending edge in order to obtain a three-dimensional body. In accordance with the invention, the first device and the second device are oriented to each other by the bending in order to provide a communications path between the same.
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公开(公告)号:US20190250029A1
公开(公告)日:2019-08-15
申请号:US16335222
申请日:2017-10-06
Applicant: View, Inc.
Inventor: Jason David Zedlitz , Yuyang Ying , Jue Wang , Stephen Clark Brown
CPC classification number: G01J1/4228 , E06B3/6715 , E06B9/68 , G01J1/0271 , G01J1/0407 , G01J5/10 , G01W1/06 , G01W1/12
Abstract: The present disclosure generally relates to infrared cloud detector systems and methods for detecting cloud cover conditions. The infrared cloud detector system comprises an infrared sensor, an ambient temperature sensor, and logic. The infrared sensor is configured to measure sky temperature based on infrared radiation received within its field-of-view. The ambient temperature sensor is configured to measure an ambient temperature. And the logic is configured to determine a cloud condition based on a difference between the measured sky temperature and the measured ambient temperature.
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公开(公告)号:US20190186988A1
公开(公告)日:2019-06-20
申请号:US16175266
申请日:2018-10-30
Applicant: EKO INSTRUMENTS CO., LTD.
Inventor: Toshikazu HASEGAWA , Akihito AKIYAMA , Ayako YANO
CPC classification number: G01J1/42 , G01J1/0271 , G01J1/0422 , G01J1/0437 , G01J1/0474 , G01J2001/4285
Abstract: A pyranometer comprises: a light sensor; a first lens arranged to face a light-receiving surface of the light sensor; and a light-shielding ring arranged between the light sensor and the first lens, the light-shielding ring having a light-transmissive region allowing transmission of light at some angles of incidence in the light passing through the first lens.
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公开(公告)号:US20180227051A1
公开(公告)日:2018-08-09
申请号:US15749082
申请日:2015-08-12
Applicant: LG ELECTRONICS INC.
Inventor: Hongjo SHIM , Gukchan LIM , Seonghyok KIM
IPC: H04B10/116 , H04N5/232 , G01J1/44
CPC classification number: H04B10/116 , G01J1/0219 , G01J1/0233 , G01J1/0271 , G01J1/4204 , G01J1/44 , G01J2001/446 , H04B1/38 , H04M1/22 , H04M1/7253 , H04M1/737 , H04M2250/12 , H04N5/232
Abstract: A structure of a mobile terminal for visible light communication is disclosed. The mobile terminal, according to one embodiment of the present invention, comprises: a light reception unit for receiving visible light; and a control unit for extracting, from the received visible light, data corresponding to the turning on/off of an external lighting, wherein the light reception unit comprises at least one among an illuminance sensor, a first image sensor disposed on the front of the mobile terminal, and a second image sensor disposed on the back of the mobile terminal, and comprises a guide member for guiding the traveling direction of visible light outputted from the lighting.
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公开(公告)号:US20180226530A1
公开(公告)日:2018-08-09
申请号:US15939636
申请日:2018-03-29
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor: Hartmut Rudmann , Markus Rossi
IPC: H01L31/16 , H01L31/167 , G01J1/02 , G01J1/04 , G01J1/06 , H01L31/0232 , H01L27/146 , H01L25/16 , G02B13/00 , G02B3/00 , G01J5/20 , G01J5/08 , G01J5/04 , G01J5/02 , G01J5/00 , G01J1/42 , B29D11/00
CPC classification number: H01L31/16 , B29D11/00298 , B29D11/00307 , G01J1/0209 , G01J1/0233 , G01J1/0271 , G01J1/0411 , G01J1/06 , G01J1/42 , G01J5/00 , G01J5/022 , G01J5/0235 , G01J5/024 , G01J5/0265 , G01J5/045 , G01J5/0806 , G01J5/20 , G01J2001/061 , G02B3/0031 , G02B3/0056 , G02B13/0085 , H01L25/167 , H01L27/14618 , H01L27/14625 , H01L27/14627 , H01L27/14687 , H01L31/02325 , H01L31/167 , H01L2924/0002 , Y10T29/49002 , H01L2924/00
Abstract: Manufacturing opto-electronic modules (1) includes providing a substrate wafer (PW) on which detecting members (D) are arranged; providing a spacer wafer (SW); providing an optics wafer (OW), the optics wafer comprising transparent portions (t) transparent for light generally detectable by the detecting members and at least one blocking portion (b) for substantially attenuating or blocking incident light generally detectable by the detecting members; and preparing a wafer stack (2) in which the spacer wafer (SW) is arranged between the substrate wafer (PW) and the optics wafer (OW) such that the detecting members (D) are arranged between the substrate wafer and the optics wafer. Emission members (E) for emitting light generally detectable by the detecting members (D) can be arranged on the substrate wafer (PW). Single modules (1) can be obtained by separating the wafer stack (2) into separate modules.
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公开(公告)号:US20180167716A1
公开(公告)日:2018-06-14
申请号:US15879977
申请日:2018-01-25
Inventor: KEISUKE FUJIMOTO , YUSHI OGINO
CPC classification number: H04R1/1041 , A61B5/0084 , A61B5/1123 , A61B5/1128 , A61B5/6817 , A61B5/7475 , G01J1/0271 , G01J1/44 , H04R1/1016 , H04R1/2811 , H04R1/2857 , H04R3/00 , H04R2420/07 , H04R2460/03 , H04R2460/15
Abstract: An earphone includes an audio transmitter, a housing, a sound passage pipe, a radiator, and a light receiver. The audio transmitter transmits sound. The housing has an internal space for containing the audio transmitter. The sound passage pipe guides sound produced at the audio transmitter into an external auditory canal. The radiator radiates light into the external auditory canal. The light receiver is disposed in the internal space of the housing. The light receiver converts the light into a signal, the light having been reflected off the external auditory canal and passed through an internal space of the sound passage pipe. The housing, the sound passage pipe, and the radiator are disposed in this order.
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公开(公告)号:US09976894B2
公开(公告)日:2018-05-22
申请号:US15353397
申请日:2016-11-16
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor: Qichuan Yu , Hartmut Rudmann , Ji Wang , Kian Siang Ng , Simon Gubser , Sonja Hanselmann
IPC: H01L31/02 , G01J1/02 , H01L31/173
CPC classification number: G01J1/0295 , G01J1/0209 , G01J1/0214 , G01J1/0271 , H01L31/173
Abstract: Disclosed are optical devices and methods of manufacturing optical devices. An optical device can include a substrate; an optical emitter chip affixed to the front surface of the substrate; and an optical sensor chip affixed to the front surface of the substrate. The optical sensor chip can include a main sensor and a reference sensor. The optical device can include an opaque dam separating the main optical sensor and the reference sensor. The optical device can include a first transparent encapsulation block encapsulating the optical emitter chip and the reference optical sensor and a second transparent encapsulation block encapsulating the main optical sensor. The optical device can include an opaque encapsulation material encapsulating the first transparent encapsulation block and the second transparent encapsulation block with a first opening above the main optical sensor and a second opening above the optical emitter chip.
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公开(公告)号:US09970922B2
公开(公告)日:2018-05-15
申请号:US14924234
申请日:2015-10-27
Applicant: OLYMPUS CORPORATION
Inventor: Atsuhiro Tsuchiya , Hiroyuki Okahira , Koichiro Izumi
IPC: G01N33/483 , G01J1/02 , G01J1/04
CPC classification number: G01N33/4833 , G01J1/0271 , G01J1/044
Abstract: With the object of preventing deterioration of or damage to a photodetector caused by excessive light by more reliably preventing the excessive light from entering the photodetector, a microscope of the present invention is provided with a high-sensitivity detector, such as an HPD, a GaAsP, an EM-CCD or the like, that detects observation light coming from a specimen, a box-shaped casing that has an opening that allows contained items to be placed therein and removed therefrom and that covers the high-sensitivity detector, a door that can close off the opening of the casing, a switch that restricts light detection by the high-sensitivity detector by turning on and off a drive voltage to be applied to the high-sensitivity detector, and an opening restricting mechanism that allows the opening of the casing in the closed state imposed by the door to be opened only when the light detection by the high-sensitivity detector is restricted by the switch.
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公开(公告)号:US20180100769A1
公开(公告)日:2018-04-12
申请号:US15694910
申请日:2017-09-04
Inventor: NOBUHIKO MIYAMAE , SHINGO HAMADA , NAOYA MIYAJI
CPC classification number: G01J5/20 , G01J1/0252 , G01J1/0271 , G01J5/0205 , G01J5/04 , G01J5/06 , G01J5/061
Abstract: There is provided an infrared detection device including an infrared detector and a fixing tool. The infrared detector includes an infrared detection element and a metal case. The fixing tool includes a first plate, a second plate, a third plate, and an amplification substrate. The infrared detector is held by the first plate and the second plate. The second plate is electrically connected to the third plate. The third plate is electrically connected to an analog ground portion of the amplification substrate. A potential of the metal case is the same as an analog ground potential of the analog ground portion of the amplification substrate.
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