公开(公告)号：US20110008944A1

公开(公告)日：2011-01-13

申请号：US12879777

申请日：2010-09-10

Applicant: Ru-Yi Su ,  Puo-Yu Chiang ,  Jeng Gong ,  Tsung-Yi Huang ,  Chun-Lin Tsai ,  Chien-Chih Chou

Inventor： Ru-Yi Su ,  Puo-Yu Chiang ,  Jeng Gong ,  Tsung-Yi Huang ,  Chun-Lin Tsai ,  Chien-Chih Chou

IPC: H01L21/336

CPC classification number: H01L29/4983 ,  H01L29/0653 ,  H01L29/0847 ,  H01L29/086 ,  H01L29/1045 ,  H01L29/66659 ,  H01L29/66689 ,  H01L29/7816 ,  H01L29/7835

Abstract: A semiconductor structure includes a semiconductor substrate; a first high-voltage well (HVW) region of a first conductivity type overlying the semiconductor substrate; a second well region of a second conductivity type opposite the first conductivity type overlying the semiconductor substrate and laterally adjoining the first well region; a gate dielectric extending from over the first well region to over the second well region; a drain region in the second well region; a source region on an opposite side of the gate dielectric than the drain region; and a gate electrode on the gate dielectric. The gate electrode includes a first portion directly over the second well region, and a second portion directly over the first well region. The first portion has a first impurity concentration lower than a second impurity concentration of the second portion.

Abstract translation: 半导体结构包括半导体衬底; 覆盖半导体衬底的第一导电类型的第一高电压阱（HVW）区域; 第二导电类型的第二阱区域，与覆盖半导体衬底并横向邻接第一阱区的第一导电类型相反; 栅极电介质，其从所述第一阱区域上延伸到所述第二阱区域上方; 第二阱区中的漏极区; 栅极电介质的与漏极区相反的一侧的源极区; 和栅电极上的栅电极。 栅电极包括直接在第二阱区上的第一部分和直接在第一阱区上的第二部分。 第一部分具有低于第二部分的第二杂质浓度的第一杂质浓度。

公开(公告)号：US20100006934A1

公开(公告)日：2010-01-14

申请号：US12170133

申请日：2008-07-09

Applicant: Ru-Yi Su ,  Puo-Yu Chiang ,  Jeng Gong ,  Tsung-Yi Huang ,  Chun-Lin Tsai ,  Chien-Chih Chou

Inventor： Ru-Yi Su ,  Puo-Yu Chiang ,  Jeng Gong ,  Tsung-Yi Huang ,  Chun-Lin Tsai ,  Chien-Chih Chou

IPC: H01L29/78

CPC classification number: H01L29/4983 ,  H01L29/0653 ,  H01L29/0847 ,  H01L29/086 ,  H01L29/1045 ,  H01L29/66659 ,  H01L29/66689 ,  H01L29/7816 ,  H01L29/7835

Abstract: A semiconductor structure includes a semiconductor substrate; a first high-voltage well (HVW) region of a first conductivity type overlying the semiconductor substrate; a second well region of a second conductivity type opposite the first conductivity type overlying the semiconductor substrate and laterally adjoining the first well region; a gate dielectric extending from over the first well region to over the second well region; a drain region in the second well region; a source region on an opposite side of the gate dielectric than the drain region; and a gate electrode on the gate dielectric. The gate electrode includes a first portion directly over the second well region, and a second portion directly over the first well region. The first portion has a first impurity concentration lower than a second impurity concentration of the second portion.

Abstract translation: 半导体结构包括半导体衬底; 覆盖半导体衬底的第一导电类型的第一高电压阱（HVW）区域; 第二导电类型的第二阱区域，与覆盖半导体衬底并横向邻接第一阱区的第一导电类型相反; 栅极电介质，其从所述第一阱区域上延伸到所述第二阱区域上方; 第二阱区中的漏极区; 栅极电介质的与漏极区相反的一侧的源极区; 和栅电极上的栅电极。 栅电极包括直接在第二阱区上的第一部分和直接在第一阱区上的第二部分。 第一部分具有低于第二部分的第二杂质浓度的第一杂质浓度。

公开(公告)号：US09379191B2

公开(公告)日：2016-06-28

申请号：US13338962

申请日：2011-12-28

Applicant: Chun-Wei Hsu ,  Jiun-Lei Jerry Yu ,  Fu-Wei Yao ,  Chen-Ju Yu ,  Fu-Chih Yang ,  Chun Lin Tsai

Inventor： Chun-Wei Hsu ,  Jiun-Lei Jerry Yu ,  Fu-Wei Yao ,  Chen-Ju Yu ,  Fu-Chih Yang ,  Chun Lin Tsai

IPC: H01L29/267 ,  H01L29/43 ,  H01L29/66 ,  H01L29/778 ,  H01L29/417 ,  H01L29/10 ,  H01L29/20

CPC classification number: H01L29/66462 ,  H01L21/02271 ,  H01L29/1066 ,  H01L29/2003 ,  H01L29/267 ,  H01L29/41766 ,  H01L29/432 ,  H01L29/7786 ,  H01L2924/0002

Abstract: A high electron mobility transistor (HEMT) includes a first III-V compound layer. A second III-V compound layer is disposed on the first III-V compound layer and is different from the first III-V compound layer in composition. A carrier channel is located between the first III-V compound layer and the second III-V compound layer. A source feature and a drain feature are disposed on the second III-V compound layer. A p-type layer is disposed on a portion of the second III-V compound layer between the source feature and the drain feature. A gate electrode is disposed on the p-type layer. The gate electrode includes a refractory metal. A depletion region is disposed in the carrier channel and under the gate electrode.

Abstract translation: 高电子迁移率晶体管（HEMT）包括第一III-V族化合物层。 第二III-V化合物层设置在第一III-V化合物层上，并且与组合物中的第一III-V化合物层不同。 载体通道位于第一III-V化合物层和第二III-V化合物层之间。 源特征和漏极特征设置在第二III-V复合层上。 p型层设置在源特征和漏极特征之间的第二III-V化合物层的一部分上。 栅电极设置在p型层上。 栅电极包括难熔金属。 耗尽区域设置在载流子通道中和栅电极下方。

公开(公告)号：US08895993B2

公开(公告)日：2014-11-25

申请号：US13049699

申请日：2011-03-16

Applicant: Alexander Kalnitsky ,  Chih-Wen Hsiung ,  Chun Lin Tsai

Inventor： Alexander Kalnitsky ,  Chih-Wen Hsiung ,  Chun Lin Tsai

IPC: H01L31/0312 ,  H01L29/15 ,  H01L29/778 ,  H01L29/423 ,  H01L29/10 ,  H01L29/20

CPC classification number: H01L29/66462 ,  H01L21/0254 ,  H01L21/0262 ,  H01L29/1066 ,  H01L29/2003 ,  H01L29/205 ,  H01L29/207 ,  H01L29/42316 ,  H01L29/66143 ,  H01L29/7787

Abstract: The present disclosure provides a semiconductor structure. The semiconductor structure includes a gallium nitride (GaN) layer on a substrate; an aluminum gallium nitride (AlGaN) layer disposed on the GaN layer; and a gate stack disposed on the AlGaN layer. The gate stack includes a III-V compound n-type doped layer; a III-V compound p-type doped layer adjacent the III-V compound n-type doped layer; and a metal layer formed over the III-V compound p-type doped layer and the III-V compound n-type doped layer.

Abstract translation: 本公开提供了一种半导体结构。 半导体结构在衬底上包括氮化镓（GaN）层; 设置在GaN层上的氮化镓铝（AlGaN）层; 以及设置在AlGaN层上的栅极堆叠。 栅堆叠包括III-V族化合物n型掺杂层; 与III-V化合物n型掺杂层相邻的III-V族化合物p型掺杂层; 以及在III-V族化合物p型掺杂层和III-V族化合物n型掺杂层上形成的金属层。

公开(公告)号：US08704312B2

公开(公告)日：2014-04-22

申请号：US12652294

申请日：2010-01-05

Applicant: Chih-Chang Cheng ,  Ruey-Hsin Liu ,  Chih-Wen Yao ,  Chia-Chin Shen ,  Eric Huang ,  Fu Chin Yang ,  Chun Lin Tsai ,  Hsiao-Chin Tuan

Inventor： Chih-Chang Cheng ,  Ruey-Hsin Liu ,  Chih-Wen Yao ,  Chia-Chin Shen ,  Eric Huang ,  Fu Chin Yang ,  Chun Lin Tsai ,  Hsiao-Chin Tuan

IPC: H01L27/088

CPC classification number: H01L27/088 ,  H01L24/16 ,  H01L24/48 ,  H01L29/063 ,  H01L29/0878 ,  H01L29/1095 ,  H01L29/402 ,  H01L29/42368 ,  H01L29/456 ,  H01L29/495 ,  H01L29/4966 ,  H01L29/513 ,  H01L29/517 ,  H01L29/518 ,  H01L29/7816 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/451 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/0401

Abstract: A high voltage (HV) device includes a well region of a first dopant type disposed in a substrate. A first well region of a second dopant type is disposed in the well region of the first dopant type. An isolation structure is at least partially disposed in the well region of the first dopant type. A first gate electrode is disposed over the isolation structure and the first well region of the second dopant type. A second well region of the second dopant type is disposed in the well region of the first dopant type. The second well region of the second dopant type is spaced from the first well region of the second dopant type. A second gate electrode is disposed between and over the first well region of the second dopant type and the second well region of the second dopant type.

Abstract translation: 高压（HV）器件包括设置在衬底中的第一掺杂剂类型的阱区。 第二掺杂剂类型的第一阱区域设置在第一掺杂剂类型的阱区域中。 隔离结构至少部分地设置在第一掺杂剂类型的阱区中。 第一栅电极设置在隔离结构和第二掺杂剂类型的第一阱区之上。 第二掺杂剂类型的第二阱区设置在第一掺杂剂类型的阱区中。 第二掺杂剂类型的第二阱区域与第二掺杂剂类型的第一阱区域间隔开。 第二栅电极设置在第二掺杂剂类型的第一阱区域和第二掺杂剂类型的第二阱区域之间和之上。

公开(公告)号：US08697505B2

公开(公告)日：2014-04-15

申请号：US13233356

申请日：2011-09-15

Applicant: Po-Chih Chen ,  Jiun-Lei Jerry Yu ,  Fu-Wei Yao ,  Chun-Wei Hsu ,  Fu-Chih Yang ,  Chun Lin Tsai

Inventor： Po-Chih Chen ,  Jiun-Lei Jerry Yu ,  Fu-Wei Yao ,  Chun-Wei Hsu ,  Fu-Chih Yang ,  Chun Lin Tsai

IPC: H01L21/338

CPC classification number: H01L29/7784 ,  H01L29/2003 ,  H01L29/205 ,  H01L29/66462 ,  H01L29/778 ,  H01L29/7787

Abstract: A semiconductor structure is disclosed. The semiconductor structure includes a first layer. A second layer is disposed on the first layer and different from the first layer in composition. An interface is between the first layer and the second layer. A third layer is disposed on the second layer. A gate is disposed on the third layer. A source feature and a drain feature are disposed on opposite sides of the gate. Each of the source feature and the drain feature includes a corresponding metal feature at least partially embedded in the second and the third layer. A corresponding intermetallic compound underlies each metal feature. Each intermetallic compound contacts a carrier channel located at the interface.

Abstract translation: 公开了半导体结构。 半导体结构包括第一层。 第二层设置在第一层上并且与组合物中的第一层不同。 界面在第一层和第二层之间。 第三层设置在第二层上。 门设置在第三层上。 源极特征和漏极特征设置在栅极的相对侧上。 源特征和漏极特征中的每一个包括至少部分地嵌入第二和第三层中的对应金属特征。 相应的金属间化合物是每个金属特征的基础。 每个金属间化合物接触位于界面处的载体通道。

公开(公告)号：US08664741B2

公开(公告)日：2014-03-04

申请号：US13160030

申请日：2011-06-14

Applicant: Ru-Yi Su ,  Fu-Chih Yang ,  Chun Lin Tsai ,  Chih-Chang Cheng ,  Ruey-Hsin Liu

Inventor： Ru-Yi Su ,  Fu-Chih Yang ,  Chun Lin Tsai ,  Chih-Chang Cheng ,  Ruey-Hsin Liu

IPC: H01L29/02

CPC classification number: H01L29/0649 ,  H01L21/26513 ,  H01L21/74 ,  H01L21/761 ,  H01L21/76202 ,  H01L23/528 ,  H01L27/0676 ,  H01L27/0802 ,  H01L28/20 ,  H01L29/0692 ,  H01L29/456 ,  H01L29/6609 ,  H01L29/8605 ,  H01L29/868

Abstract: Provided is a high voltage semiconductor device that includes a PIN diode structure formed in a substrate. The PIN diode includes an intrinsic region located between a first doped well and a second doped well. The first and second doped wells have opposite doping polarities and greater doping concentration levels than the intrinsic region. The semiconductor device includes an insulating structure formed over a portion of the first doped well. The semiconductor device includes an elongate resistor device formed over the insulating structure. The resistor device has first and second portions disposed at opposite ends of the resistor device, respectively. The semiconductor device includes an interconnect structure formed over the resistor device. The interconnect structure includes: a first contact that is electrically coupled to the first doped well and a second contact that is electrically coupled to a third portion of the resistor located between the first and second portions.

Abstract translation: 提供一种高压半导体器件，其包括形成在衬底中的PIN二极管结构。 PIN二极管包括位于第一掺杂阱和第二掺杂阱之间的本征区。 第一和第二掺杂阱具有与内部区域相反的掺杂极性和更大的掺杂浓度水平。 半导体器件包括形成在第一掺杂阱的一部分上的绝缘结构。 半导体器件包括形成在绝缘结构上的细长电阻器件。 电阻器件分别设置在电阻器件的相对端处的第一和第二部分。 半导体器件包括形成在电阻器件上的互连结构。 互连结构包括：电耦合到第一掺杂阱的第一接触和电耦合到位于第一和第二部分之间的电阻器的第三部分的第二接触。

公开(公告)号：US08507920B2

公开(公告)日：2013-08-13

申请号：US13180268

申请日：2011-07-11

Applicant: Po-Chih Chen ,  Jiun-Lei Jerry Yu ,  Fu-Wei Yao ,  Chun-Wei Hsu ,  Fu-Chih Yang ,  Chun Lin Tsai

Inventor： Po-Chih Chen ,  Jiun-Lei Jerry Yu ,  Fu-Wei Yao ,  Chun-Wei Hsu ,  Fu-Chih Yang ,  Chun Lin Tsai

IPC: H01L29/778

CPC classification number: H01L27/11578 ,  H01L21/28575 ,  H01L27/11565 ,  H01L29/0891 ,  H01L29/2003 ,  H01L29/42316 ,  H01L29/42376 ,  H01L29/452 ,  H01L29/66462 ,  H01L29/7787

Abstract: An embodiment of the disclosure includes a semiconductor structure. The semiconductor structure includes a first III-V compound layer. A second III-V compound layer is disposed on the first III-V compound layer and different from the first III-V compound layer in composition. An interface is defined between the first III-V compound layer and the second III-V compound layer. A gate is disposed on the second III-V compound layer. A source feature and a drain feature are disposed on opposite side of the gate. Each of the source feature and the drain feature includes a corresponding metal feature at least partially embedded in the second III-V compound layer. A corresponding intermetallic compound underlies each metal feature. Each intermetallic compound contacts a carrier channel located at the interface.

Abstract translation: 本公开的实施例包括半导体结构。 半导体结构包括第一III-V族化合物层。 第二III-V化合物层设置在第一III-V化合物层上，并且与组合物中的第一III-V化合物层不同。 在第一III-V化合物层和第二III-V化合物层之间界定界面。 栅极设置在第二III-V复合层上。 源极特征和漏极特征设置在栅极的相对侧上。 源特征和漏极特征中的每一个包括至少部分地嵌入第二III-V化合物层中的对应金属特征。 相应的金属间化合物是每个金属特征的基础。 每个金属间化合物接触位于界面处的载体通道。

公开(公告)号：US20130069116A1

公开(公告)日：2013-03-21

申请号：US13233356

申请日：2011-09-15

Applicant: Po-Chih Chen ,  Jiun-Lei Jerry Yu ,  Fu-Wei Yao ,  Chun-Wei Hsu ,  Fu-Chih Yang ,  Chun Lin Tsai

Inventor： Po-Chih Chen ,  Jiun-Lei Jerry Yu ,  Fu-Wei Yao ,  Chun-Wei Hsu ,  Fu-Chih Yang ,  Chun Lin Tsai

IPC: H01L29/778 ,  H01L21/335

CPC classification number: H01L29/7784 ,  H01L29/2003 ,  H01L29/205 ,  H01L29/66462 ,  H01L29/778 ,  H01L29/7787

Abstract: A semiconductor structure is disclosed. The semiconductor structure includes a first layer. A second layer is disposed on the first layer and different from the first layer in composition. An interface is between the first layer and the second layer. A third layer is disposed on the second layer. A gate is disposed on the third layer. A source feature and a drain feature are disposed on opposite sides of the gate. Each of the source feature and the drain feature includes a corresponding metal feature at least partially embedded in the second and the third layer. A corresponding intermetallic compound underlies each metal feature. Each intermetallic compound contacts a carrier channel located at the interface.

Abstract translation: 公开了半导体结构。 半导体结构包括第一层。 第二层设置在第一层上并且与组合物中的第一层不同。 界面在第一层和第二层之间。 第三层设置在第二层上。 门设置在第三层上。 源极特征和漏极特征设置在栅极的相对侧上。 源特征和漏极特征中的每一个包括至少部分地嵌入第二和第三层中的对应金属特征。 相应的金属间化合物是每个金属特征的基础。 每个金属间化合物接触位于界面处的载体通道。

公开(公告)号：US08389348B2

公开(公告)日：2013-03-05

申请号：US12881505

申请日：2010-09-14

Applicant: Kong-Beng Thei ,  Jiun-Lei Jerry Yu ,  Chun Lin Tsai ,  Hsiao-Chin Tuan ,  Alex Kalnitsky

Inventor： Kong-Beng Thei ,  Jiun-Lei Jerry Yu ,  Chun Lin Tsai ,  Hsiao-Chin Tuan ,  Alex Kalnitsky

IPC: H01L21/338

CPC classification number: H01L27/0617 ,  H01L21/26506 ,  H01L21/8258 ,  H01L27/085 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The mechanisms of forming SiC crystalline regions on Si substrate described above enable formation and integration of GaN-based devices and Si-based devices on a same substrate. The SiC crystalline regions are formed by implanting carbon into regions of Si substrate and then annealing the substrate. An implant-stop layer is used to cover the Si device regions during formation of the SiC crystalline regions.

Abstract translation: 在上述Si衬底上形成SiC结晶区的机理能够在同一衬底上形成GaN和GaN基器件的集成。 通过将碳注入到Si衬底的区域中，然后使衬底退火来形成SiC晶体区域。 在形成SiC晶体区域期间，使用注入停止层来覆盖Si器件区域。